Remi Dussart
7
Documents
Présentation
Publications et communications
Publications
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Elucidating the effects of gas flow rate on an SF6 inductively coupled plasma and on the silicon etch rate, by a combined experimental and theoretical investigationJournal of Physics D: Applied Physics, 2016, 49 (38), pp.385201. ⟨10.1088/0022-3727/49/38/385201⟩
Article dans une revue
hal-01374746v1
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Cryogenic etching of silicon with SF6 inductively coupled plasmas: a combined modelling and experimental studyJournal of Physics D: Applied Physics, 2015, 48, pp.155204. ⟨10.1088/0022-3727/48/15/155204⟩
Article dans une revue
hal-01135854v1
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Numerical and experimental investigation of cryogenic etching of silicon and porous low-dielectricInternational Symposium on Dry Process 2016 (DPS2016), Nov 2016, Sapporo, Japan
Communication dans un congrès
hal-01561212v1
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Effects of gas and surface temperatures during cryogenic etching of silicon with SF6/O269th Gaseous Electronic Conference, Oct 2016, Bochum, France
Communication dans un congrès
hal-01379701v1
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Cryogenic Etching of Silicon with SF6/O2/SiF4 plasmas: a modeling and experimental studyPlasma Etch and Strip in Microtechnology, Apr 2015, Leuven, Belgium
Communication dans un congrès
hal-01151530v1
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Cryogenic etching of silicon with SF6/O2/SiF4 plasmas: a modelling and experimental study22nd International Symposium on Plasma Chemistry (ISPC 2015), Jul 2015, Antwerp, Belgium
Communication dans un congrès
hal-01228451v1
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Cryogenic etching of silicon with SF6/O2: a computational and experimental studyPlasma Etch and Strip in Microtechnology, May 2016, Grenoble, France
Poster de conférence
hal-01344725v1
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