Co-auteurs

Nombre de documents

212

Remi DUSSART


Publications et communications


Article dans une revue64 documents

  • Alexane Vital, Marylène Vayer, Thomas Tillocher, Remi Dussart, Mohamed Boufnichel, et al.. Morphology control in thin films of PS: PLA homopolymer blends by dip-coating deposition. Applied Surface Science, Elsevier, 2017, 〈10.1016/j.apsusc.2016.09.151〉. 〈hal-01561189〉
  • Stefan Tinck, Thomas Tillocher, Violeta Georgieva, Remi Dussart, Erik Neyts, et al.. Concurrent effects of wafer temperature and oxygen fraction on cryogenic silicon etching with SF6/O2 plasmas. Plasma Processes and Polymers, Wiley-VCH Verlag, 2017, 〈10.1002/ppap.201700018〉. 〈hal-01561200〉
  • Stefan Tinck, Thomas Tillocher, Remi Dussart, Erik Neyts, Annemie Bogaerts. Elucidating the effects of gas flow rate on an SF6 inductively coupled plasma and on the silicon etch rate, by a combined experimental and theoretical investigation. Journal of Physics D: Applied Physics, IOP Publishing, 2016, 〈10.1088/0022-3727/49/38/385201〉. 〈hal-01374746〉
  • Zhang Liping, Jean-Francois De Marneffe, Floriane Leroy, Philippe Lefaucheux, Thomas Tillocher, et al.. Mitigation of plasma-induced damage in porous low-k dielectrics by cryogenic precursor condensation. Journal of Physics D: Applied Physics, IOP Publishing, 2016, 49 (17), pp.175203. 〈10.1088/0022-3727/49/17/175203〉. 〈hal-01324407〉
  • Valentin Felix, Philippe Lefaucheux, Olivier Aubry, Judith Golda, V Schulz-Von Der Gathen, et al.. Origin of microplasma instabilities during DC operation of silicon based microhollow cathode devices. Plasma Sources Science and Technology, IOP Publishing, 2016, 25, pp.025021. 〈10.1088/0963-0252/25/2/025021〉. 〈hal-01287230〉
  • Alexane Vital, Marylène Vayer, Christophe Sinturel, Thomas Tillocher, Philippe Lefaucheux, et al.. Polymer masks for structured surface and plasma etching. Applied Surface Science, Elsevier, 2015, 332, pp.237. 〈10.1016/j.apsusc.2015.01.040〉. 〈hal-01219273〉
  • Alexane Vital, M Vayer, Christophe Sinturel, Thomas Tillocher, Philippe Lefaucheux, et al.. Modification of poly(styrene) thin films and enhancement of cryogenic plasma etching resistance by ruthenium tetroxide vapor staining. Polymer, Elsevier, 2015, 〈10.1016/j.polymer.2015.08.062〉. 〈hal-01228427〉
  • Nicolas Gosset, Mohamed Boufnichel, Emilie Bahette, Walid Khalfaoui, Rami Ljazouli, et al.. Single and multilayered materials processing by argon ion beam etching: study of ion angle incidence and defect formation. Journal of Micromechanics and Microengineering, IOP Publishing, 2015, 25, pp.095011. 〈10.1088/0960-1317/25/9/095011〉. 〈hal-01217644〉
  • Floriane Leroy, Liping Zhang, Thomas Tillocher, Koichi Yatsuda, Kaoru Maekawa, et al.. Cryogenic etching processes applied to porous low-k materials using SF6/C4F8 plasmas. Journal of Physics D: Applied Physics, IOP Publishing, 2015, 48, pp.435202. 〈10.1088/0022-3727/48/43/435202〉. 〈hal-01217648〉
  • Stefan Tinck, Thomas Tillocher, Rémi Dussart, Annemie Bogaerts. Cryogenic etching of silicon with SF6 inductively coupled plasmas: a combined modelling and experimental study. Journal of Physics D: Applied Physics, IOP Publishing, 2015, 48, pp.155204. 〈10.1088/0022-3727/48/15/155204〉. 〈hal-01135854〉
  • Pierre-Antoine Cormier, A. Balhamri, Anne-Lise Thomann, Remi Dussart, Nadjib Semmar, et al.. Titanium oxide thin film growth by magnetron sputtering: Total energy flux and its relationship with the phase constitution. Surface and Coatings Technology, Elsevier, 2014, Vol 254 (2014), Volume 254, 15 September 2014, Pages 291-297. 〈10.1016/j.surfcoat.2014.06.037〉. 〈hal-01057278〉
  • Judith Golda, Mukesh Kulsreshath, H Boettner, Valentin Felix, Remi Dussart, et al.. Circular Emission and Destruction Patterns on a Silicon-Based Microdischarge Array. IEEE Transactions on Plasma Science, Institute of Electrical and Electronics Engineers, 2014, 42 (10), pp.2646. 〈10.1109/TPS.2014.2337657〉. 〈hal-01082634〉
  • Mariem El Mokh, Amaël Caillard, Nadjib Semmar, Rémi Dussart, Thomas Lecas, et al.. Energy Transferred From a Hot Nickel Target During Magnetron Sputtering. IEEE Transactions on Plasma Science, Institute of Electrical and Electronics Engineers, 2014, pp.Plasma Science, IEEE Transactions on (Volume:PP Issue: 99 ). 〈10.1109/TPS.2014.2338742〉. 〈hal-01057286〉
  • Thomas Tillocher, Philippe Lefaucheux, Bertrand Boutaud, Remi Dussart. Alternated process for the deep etching of titanium. Journal of Micromechanics and Microengineering, IOP Publishing, 2014, 24, pp.075021. 〈10.1088/0960-1317/24/7/075021〉. 〈hal-01015146〉
  • Remi Dussart, Thomas Tillocher, Philippe Lefaucheux, Mohamed Boufnichel. Plasma cryogenic etching of silicon: from the early days to today's advanced technologies. Journal of Physics D: Applied Physics, IOP Publishing, 2014, pp.123001. 〈10.1088/0022-3727/47/12/123001〉. 〈hal-00959819〉
  • Mukesh Kulsreshath, Judith Golda, V. Schulz-Von Der Gathen, Remi Dussart. Width dependent interaction of trench-like microdischarges arranged in sub-arrays on a single silicon based chip. Plasma Sources Science and Technology, IOP Publishing, 2014, 23, pp.045012. 〈10.1088/0963-0252/23/4/045012〉. 〈hal-01021943〉
  • Liping Zhang, Rami Ljazouli, Philippe Lefaucheux, Thomas Tillocher, Remi Dussart, et al.. Low Damage Cryogenic Etching of Porous Organosilicate Low-k Materials Using SF6/O2/SiF4. ECS Journal of Solid State Science and Technology, 2013, 2 (6), pp.N131. 〈10.1149/2.001306jss〉. 〈hal-00831339〉
  • P.-A. Cormier, A.-L. Thomann, Vincent Dolique, A. Balhamri, R. Dussart, et al.. IR emission from the target during plasma magnetron sputter deposition. Thin Solid Films, Elsevier, 2013, 545, pp.44-49. 〈10.1016/j.tsf.2013.07.025〉. 〈in2p3-00874718〉
  • Pierre-Antoine Cormier, Anne Lise Thomann, Vincent Dolique, A. Balhamri, Remi Dussart, et al.. IR emission from the target during plasma magnetron sputter deposition. Thin Solid Films, Elsevier, 2013, pp.547(2013) 44-49. 〈hal-00943789〉
  • Anne-Lise Thomann, Pierre-Antoine Cormier, Vincent Dolique, Nadjib Semmar, Remi Dussart, et al.. Energy transferred to the substrate surface during reactive magnetron sputtering of aluminum in Ar/O2 atmosphere. Thin Solid Films, Elsevier, 2013, 539, pp.88. 〈10.1016/j.tsf.2013.05.075〉. 〈hal-00839010〉
  • Nasreddine Mekkakia Maaza, Remi Dussart, Thomas Tillocher, Philippe Lefaucheux, Pierre Ranson. A novel amorphization-etch alternating process for Si(100). Journal of Micromechanics and Microengineering, IOP Publishing, 2013, 23, pp.045023. 〈10.1088/0960-1317/23/4/045023〉. 〈hal-00831302〉
  • M. K. Kulsreshath, N. Sadeghi, L. Schwaederle, T. Dufour, L. J. Overzet, et al.. Ignition and extinction phenomena in helium micro hollow cathode discharges. Journal of Applied Physics, American Institute of Physics, 2013, 114, pp.3303. 〈10.1063/1.4858418〉. 〈hal-01006012〉
  • M. K. Kulsreshath, N. Sadeghi, L. Schwaederle, T. Dufour, L. J. Overzet, et al.. Ignition and extinction phenomena in helium micro hollow cathode discharges. Journal of Applied Physics, American Institute of Physics, 2013, 114 (24), pp.243303. 〈10.1063/1.4858418〉. 〈hal-01303176v2〉
  • Mukesh Kulsreshath, N. Sadeghi, Laurent Schwaederlé, Thierry Dufour, Lawrence Overzet, et al.. Ignition and extinction phenomena in helium micro hollow cathode discharges. Journal of Applied Physics, American Institute of Physics, 2013, 114, pp.243303. 〈10.1063/1.4858418〉. 〈hal-00924433〉
  • Pierre-Antoine Cormier, A. Balhamri, Anne-Lise Thomann, Remi Dussart, Nadjib Semmar, et al.. Measuring the energy flux at the substrate position during magnetron sputter deposition processes. Journal of Applied Physics, American Institute of Physics, 2013, 113, pp.013305. 〈10.1063/1.4773103〉. 〈hal-00831364〉
  • Sergey Abolmasov, Pierre-Antoine Cormier, A. Torres Rios, Remi Dussart, Nadjib Semmar, et al.. Probing dusty-plasma/surface interactions with a heat flux microsensor. Applied Physics Letters, American Institute of Physics, 2012, pp.100, 1, 011601. 〈10.1063/1.3674290〉. 〈hal-00943785〉
  • Liping Zhang, Rami Ljazouli, Philippe Lefaucheux, Thomas Tillocher, Remi Dussart, et al.. Damage Free Cryogenic Etching of a Porous Organosilica Ultralow-k Film. Electrochemical and Solid-State Letters, Electrochemical Society, 2012, 2 (2), pp.N5. 〈10.1149/2.007302ssl〉. 〈hal-00831289〉
  • Mukesh Kulsreshath, Laurent Schwaederlé, Lawrence Overzet, Philippe Lefaucheux, Julien Ladroue, et al.. Study of dc micro-discharge arrays made in silicon using CMOS compatible technology. Journal of Physics D: Applied Physics, IOP Publishing, 2012, 45, pp.285202. 〈10.1088/0022-3727/45/28/285202〉. 〈hal-00713105〉
  • Laurent Schwaederlé, Mukesh Kulsreshath, Lawrence Overzet, Philippe Lefaucheux, Thomas Tillocher, et al.. Breakdown study of dc silicon micro-discharge devices. Journal of Physics D: Applied Physics, IOP Publishing, 2012, 45, pp.065201. 〈10.1088/0022-3727/45/6/065201〉. 〈hal-00667649〉
  • Thomas Defforge, Gaël Gautier, Thomas Tillocher, Remi Dussart, François Tran-Van. Elaboration of high aspect ratio monocrystalline silicon suspended nanobridges by low temperature alkaline treatment of dry etched trenches. Journal of Vacuum Science and Technology A, American Vacuum Society, 2011, 30 (1), pp.010601. 〈10.1116/1.3665217〉. 〈hal-00655000〉
  • Thomas Defforge, Xi Song, Gaël Gautier, Thomas Tillocher, Remi Dussart, et al.. Scalloping removal on DRIE via using low concentrated alkaline solutions at low temperature. Sensors and Actuators A: Physical , Elsevier, 2011, 170 (1-2), pp.114. 〈10.1016/j.sna.2011.05.028〉. 〈hal-00655001〉
  • Thomas Tillocher, Wassim Kafrouni, Julien Ladroue, Philippe Lefaucheux, Mohamed Boufnichel, et al.. Optimization of submicron deep trench profiles with the STiGer cryoetching process: reduction of defects. Journal of Micromechanics and Microengineering, IOP Publishing, 2011, 21, pp.085005. 〈10.1088/0960-1317/21/8/085005〉. 〈hal-00655002〉
  • Corinne Duluard, Pierre Ranson, Laurianne Pichon, Jeremy Pereira, El-Houcine Oubensaid, et al.. Alternating SiCl4/O2 passivation steps with SF6 etch steps for silicon deep etching. Journal of Micromechanics and Microengineering, IOP Publishing, 2011, 21, pp.065015. 〈hal-00655003〉
  • Lawrence J. Overzet, D. Jung, Monali Mandra, Matthew Goeckner, Thierry Dufour, et al.. RF impedance measurements of DC atmospheric micro-discharges. The European Physical Journal D, EDP Sciences, 2010, 60, pp.449-454. 〈10.1140/epjd/e2010-00274-5〉. 〈hal-01303158〉
  • Remi Dussart, Lawrence J. Overzet, P Lefaucheux, Thierry Dufour, M Kulsreshath, et al.. Integrated micro-plasmas in silicon operating in helium. The European Physical Journal D, EDP Sciences, 2010, 60, pp.601-608. 〈10.1140/epjd/e2010-00272-7〉. 〈hal-01303160〉
  • Thierry Dufour, Lawrence Overzet, Remi Dussart, L.C. Pitchford, N. Sadeghi, et al.. Experimental study and simulation of a micro-discharge with limited cathode area. The European Physical Journal D, EDP Sciences, 2010, 60, pp.565. 〈10.1140/epjd/e2010-00273-6〉. 〈hal-00655008〉
  • Thierry Dufour, Lawrence J. Overzet, Remi Dussart, L. C. Pitchford, N Sadeghi, et al.. Experimental study and simulation of a micro-discharge with limited cathode area. The European Physical Journal D, EDP Sciences, 2010, 60, pp.565-574. 〈10.1140/epjd/e2010-00273-6〉. 〈hal-01303159〉
  • T. Dufour, L. J. Overzet, R. Dussart, L. C. Pitchford, N. Sadeghi, et al.. Experimental study and simulation of a micro-discharge with limited cathode area. The European Physical Journal D, EDP Sciences, 2010, 60, pp.565-574. 〈10.1140/EPJD/E2010-00273-6〉. 〈hal-01005937〉
  • Remi Dussart, Lawrence Overzet, Philippe Lefaucheux, Thierry Dufour, Mukesh Kulsreshath, et al.. Integrated micro-plasmas in silicon operating in helium. The European Physical Journal D, EDP Sciences, 2010, 60, pp.601. 〈10.1140/epjd/e2010-00272-7〉. 〈hal-00655009〉
  • Lawrence Overzet, D. Jung, Monali Mandra, Matthew Goeckner, Thierry Dufour, et al.. RF impedance measurements of DC atmospheric micro-discharges. The European Physical Journal D, EDP Sciences, 2010, 60, pp.449. 〈10.1140/epjd/e2010-00274-5〉. 〈hal-00655011〉
  • Pierre-Antoine Cormier, Marc Stahl, Anne-Lise Thomann, Rémi Dussart, Matthias Wolter, et al.. On the measurement of energy fluxes in plasmas using a calorimetric probe and a thermopile sensor. Journal of Physics D: Applied Physics, IOP Publishing, 2010, 43 (46), pp.465201. 〈10.1088/0022-3727/43/46/465201〉. 〈hal-00569747〉
  • L Bedra, A L Thomann, N Semmar, R Dussart, J Mathias. Highly sensitive measurements of the energy transferred during plasma sputter deposition of metals. Journal of Physics D: Applied Physics, IOP Publishing, 2010, 43 (6), pp.65202. 〈10.1088/0022-3727/43/6/065202〉. 〈hal-00569757〉
  • Julien Ladroue, Aline Meritan, Mohamed Boufnichel, Philippe Lefaucheux, Pierre Ranson, et al.. Deep GaN etching by inductively coupled plasma and induced surface defects. Journal of Vacuum Science and Technology A, American Vacuum Society, 2010, 28 (5), pp.1226. 〈10.1116/1.3478674〉. 〈hal-00519022〉
  • Pierre-Antoine Cormier, Marc Stahl, Anne-Lise Thomann, Remi Dussart, Matthias Wolter, et al.. On the measurement of energy fluxes in plasmas using a calorimetric probe and a thermopile sensor. Journal of Physics D: Applied Physics, IOP Publishing, 2010, 43, pp.465201. 〈10.1088/0022-3727/43/46/465201〉. 〈hal-00655004〉
  • Larbi Bedra, Anne-Lise Thomann, Nadjib Semmar, Rémi Dussart, Jacky Mathias. Highly sensitive measurements of the energy transferred during plasma sputter deposition of metals. Journal of Physics D: Applied Physics, IOP Publishing, 2010, pp.065202. 〈hal-00487356〉
  • Jeremy Pereira, Laurianne Pichon, Remi Dussart, Christophe Cardinaud, Corinne Duluard, et al.. In situ x-ray photoelectron spectroscopy analysis of SiOxFy passivation layer obtained in a SF6/O2 cryoetching process. Applied Physics Letters, American Institute of Physics, 2009, 94, pp.071501. 〈10.1063/1.3085957〉. 〈hal-00365892〉
  • J. Pereira, L.E. Pichon, R. Dussart, Christophe Cardinaud, C.Y. Duluard, et al.. In situ x-ray photoelectron spectroscopy analysis of SiOxFy passivation layer obtained in a SF6/O-2 cryoetching process. Applied Physics Letters, American Institute of Physics, 2009, 94 (7), pp.071501. 〈10.1063/1.3085957〉. 〈hal-00432322〉
  • Corinne Duluard, Pierre Ranson, Laurianne Pichon, El-Houcine Oubensaid, Jeremy Pereira, et al.. Neutral species in inductively coupled SF6/SiCl4 plasmas. Journal of Physics D: Applied Physics, IOP Publishing, 2009, 42, pp.115206. 〈hal-00396438〉
  • El-Houcine Oubensaid, Corinne Duluard, Laurianne Pichon, Jeremy Pereira, Mohamed Boufnichel, et al.. Effect of the addition of SF6 and N2 in inductively coupled SiCl4 plasma for GaN etching. Semiconductor Science & Technology, 2009, 24, pp.075022. 〈10.1088/0268-1242/24/7/075022〉. 〈hal-00400936〉
  • El-Houcine Oubensaid, Corinne Duluard, Laurianne Pichon, B. Morillon, Mohamed Boufnichel, et al.. Cryogenic etching of n-type silicon with p+ doped walls with the TGZM process through the Al/Si eutectic alloy. Microelectronic Engineering, Elsevier, 2009, pp.2262. 〈10.1016/j.mee.2009.04.002〉. 〈hal-00413753〉
  • Thomas Tillocher, Remi Dussart, Lawrence Overzet, Xavier Mellhaoui, Philippe Lefaucheux, et al.. Two Cryogenic Processes Involving SF6, O2, and SiF4 for Silicon Deep Etching. Journal of The Electrochemical Society, Electrochemical Society, 2008, 155 (3), pp.D187. 〈10.1149/1.2826280〉. 〈hal-00349343〉
  • Thierry Dufour, Remi Dussart, Philippe Lefaucheux, Pierre Ranson, Lawrence Overzet, et al.. Effect of limiting the cathode surface on direct current microhollow cathode discharge in helium. Applied Physics Letters, American Institute of Physics, 2008, 93, pp.071508. 〈10.1063/1.2966144〉. 〈hal-00349341〉
  • Remi Dussart, Anne-Lise Thomann, Laurianne Pichon, Larbi Bedra, Nadjib Semmar, et al.. Direct measurements of the energy flux due to chemical reactions at the surface of a silicon sample interacting with a SF6 plasma. Applied Physics Letters, American Institute of Physics, 2008, 93, pp.131502. 〈10.1063/1.2995988〉. 〈hal-00336392〉
  • Thierry Dufour, Remi Dussart, P Lefaucheux, P Ranson, Lawrence J. Overzet, et al.. Effect of limiting the cathode surface on direct current microhollow cathode discharge in helium. Applied Physics Letters, American Institute of Physics, 2008, 93 (071508), 〈10.1063/1.2966144͔〉. 〈hal-01303157v2〉
  • Corinne Duluard, Remi Dussart, Thomas Tillocher, Laurianne Pichon, Philippe Lefaucheux, et al.. SO2 passivating chemistry for silicon cryogenic deep etching. Plasma Sources Science and Technology, IOP Publishing, 2008, 17, pp.045008. 〈10.1088/0963-0252/17/4/045008〉. 〈hal-00349344〉
  • Remi Dussart, Xavier Mellhaoui, Thomas Tillocher, Philippe Lefaucheux, Mohamed Boufnichel, et al.. The passivation layer formation in the cryo-etching plasma process. Microelectronic Engineering, Elsevier, 2007, 84, pp.1128. 〈10.1016/j.mee.2007.01.048〉. 〈hal-00365894〉
  • Thomas Tillocher, Remi Dussart, Xavier Mellhaoui, Philippe Lefaucheux, Mohamed Boufnichel, et al.. Silicon cryo-etching of deep holes. Microelectronic Engineering, Elsevier, 2007, 84, pp.1120. 〈10.1016/j.mee.2007.01.148〉. 〈hal-00365907〉
  • Thomas Tillocher, Rémi Dussart, Xavier Mellhaoui, Philippe Lefaucheux, Nasreddine Mekkakia Maaza, et al.. Oxidation threshold in silicon etching at cryogenic temperatures. Journal of Vacuum Science and Technology A, American Vacuum Society, 2006, 24 (4), pp.1073-1082. 〈hal-00097766〉
  • Thomas Tillocher, Philippe Lefaucheux, Xavier Mellhaoui, Remi Dussart, Pierre Ranson, et al.. Oxidation threshold in silicon etching at cryogenic temperatures. Journal of Vacuum Science and Technology A, American Vacuum Society, 2006, 24 (4), pp.1073. 〈10.1116/1.2210946〉. 〈hal-00365909〉
  • E. Odic, A. Goldman, M. Goldman, M. Dhainaut, Rémi Dussart. Current distribution of AC surface discharges and associated chemistry. Journal of Electrostatics, Elsevier, 2006, 64, pp.477-484. 〈hal-00097452〉
  • Emmanuel Odic, Alice Goldman, Max Goldman, Marielle Dhainaut, Rémi Dussart. CURRENT DISTRIBUTION OF AC SURFACE DISCHARGES AND ASSOCIATED CHEMISTRY. Journal of Electrostatics, Elsevier, 2006, 64 (7-9), pp.477-484. 〈hal-00221383〉
  • Anne Lise Thomann, Nadjib Semmar, Rémi Dussart, Jacky Mathias, Vladislav Lang. Diagnostic system for plasma/surface energy transfer characterization. Review of Scientific Instruments, American Institute of Physics, 2006, 77 (2), pp.033501-6. 〈hal-00097829〉
  • Xavier Mellhaoui, Rémi Dussart, Thomas Tillocher, Philippe Lefaucheux, Pierre Ranson, et al.. SiOxFy passivation layer in silicon cryoetching. Journal of Applied Physics, American Institute of Physics, 2005, 98, pp.104901-10. 〈hal-00098638〉
  • Mohamed Boufnichel, Philippe Lefaucheux, Said Aachboun, Rémi Dussart, Pierre Ranson. Origin, control and elimination of undercut in silicon deep plasma etching in the cryogenic process. Microelectronic Engineering, Elsevier, 2005, 77, pp.327-336. 〈hal-00098398〉

Communication dans un congrès133 documents

  • Mukesh Kulsreshath, Christophe Sinturel, Philippe Lefaucheux, Marylène Vayer, Thomas Tillocher, et al.. CRYOGENIC ETCHING APPLIED TO THE REALIZATION OF HIGH DENSITY CAPACITOR WITH A HOMOPOLYMER MASK. International Conference on Plasma Processes 2017 (CIP2017), Jun 2017, Nice, France. 〈hal-01561252〉
  • Remi Dussart, Philippe Lefaucheux, Thomas Tillocher. Cryoetching mechanisms and STiGer process evaluation. International Symposium on Dry Process 2016 (DPS 2016), Nov 2016, Sapporo, Japan. 〈hal-01561210〉
  • Stefan Tinck, Thomas Tillocher, Remi Dussart, Erik Neyts, Annemie Bogaerts. Numerical and experimental investigation of cryogenic etching of silicon and porous low-dielectric. International Symposium on Dry Process 2016 (DPS2016), Nov 2016, Sapporo, Japan. 〈hal-01561212〉
  • Remi Dussart, Thomas Tillocher, Philippe Lefaucheux. Cryogenic processes for advanced material plasma etching. Quo vadis : Complex plasmas - TR 24, Aug 2016, Hambourg, Germany. 〈hal-01374747〉
  • Jean-Francois De Marneffe, Zhang Liping, Mikhail Baklanov, Koichi Yatsuda, Kaoru Maekawa, et al.. Low-Damage etching of highly porous OSG low-k dielectrics. SPIE Advanced Lithography 2016, Feb 2016, San José, United States. 〈hal-01280267〉
  • Stefan Tinck, Erik Neyts, Thomas Tillocher, Remi Dussart, Annemie Bogaerts. Effects of gas and surface temperatures during cryogenic etching of silicon with SF6/O2. 69th Gaseous Electronic Conference, Oct 2016, Bochum, France. 〈hal-01379701〉
  • Remi Dussart, Valentin Félix, Lawrence Overzet, Olivier Aubry, Arnaud Stolz, et al.. Enhanced lifetime for thin-dielectric microdischarge-arrays operating in DC . 69th Gaseous Electronic Conference, Oct 2016, Bochum, Germany. 〈hal-01379698〉
  • Floriane Leroy, Thomas Tillocher, Philippe Lefaucheux, Remi Dussart, Christian Dussarat, et al.. Cryoetching processes applied to ULK material. 37th International Symposium on Dry process , Nov 2015, Awaji, Japan. 〈hal-01287233〉
  • Remi Dussart, Valentin Felix, Lawrence J. Overzet, Olivier Aubry, Philippe Lefaucheux, et al.. DC and AC microplasmas on silicon : performances and limitations. Asian-European Plasma Surface Engineering, Sep 2015, Jeju, South Korea. 〈hal-01217651〉
  • Remi Dussart, Valentin Felix, Lawrence Overzet, Olivier Aubry, Philippe Lefaucheux, et al.. Performances and instabilities of silicon based microdischarges. International workshop on microplasmas, May 2015, Newark, United States. 〈hal-01166019〉
  • Remi Dussart, Valentin Felix, Olivier Aubry, Philippe Lefaucheux. Performances and limitations of DC microdischarges on silicon platforms. 20th International Colloquium on Plasma Processes (CIP), Jun 2015, Saint-Etienne, France. 〈hal-01166022〉
  • Judith Golda, Valentin Felix, Remi Dussart, Lawrence Overzet, V. Schulz-Von Der Gathen. Ignition phase of a silicon-based microdischarge array with excitation by burst waveforms. International workshop on microplasmas, May 2015, Newark, United States. 〈hal-01166021〉
  • Edouard Laudrel, Thomas Tillocher, Philippe Lefaucheux, Bertrand Boutaud, Remi Dussart. Bulk titanium deep etching by plasma processes. , 20th International Colloquium on Plasma Processes (CIP), Jun 2015, Saint-Etienne, France. 〈hal-01166023〉
  • Liping Zhang, Jean-Francois De Marneffe, Floriane Leroy, Rami Ljazouli, Philippe Lefaucheux, et al.. A novel low temperature etch approach to reduce ULK plasma damage. Plasma Etch and Strip in Microtecnology, Apr 2015, Leuven, Belgium. 2015. 〈hal-01151524〉
  • Floriane Leroy, Thomas Tillocher, Liping Zhang, A. Girard, Christophe Cardinaud, et al.. Cryogenic Etching of Porous Organosilicate Low-k Materials: Fluorine based plasma analysis. Plasma Etch and Strip in Microtechnology, Apr 2015, Leuven, Belgium. 2015. 〈hal-01151528〉
  • Alexane Vital, Mohamed Boufnichel, Remi Dussart, Nicolas Gosset, Philippe Lefaucheux, et al.. Submicronic etched features of silicon with high aspect ratio obtained by cryogenic plasma deep-etchingthrough perforated polymer thin films. 2015 MRS Spring Meeting & Exhibit, Apr 2015, San francisco, United States. 2015. 〈hal-01151542〉
  • Remi Dussart, Thomas Tillocher, Floriane Leroy, Philippe Lefaucheux, Koichi Yatsuda, et al.. Low damage cryoetching of low-K materials. SPIE Advanced Lithography 2015, Feb 2015, San José, United States. 2015. 〈hal-01151543〉
  • Thomas Tillocher, Remi Dussart, Floriane Leroy, Philippe Lefaucheux, Mohamed Boufnichel, et al.. Plasma Cryogenic Etching: from 3D Integration to Low-k Materials. China Semiconductor Technology International Conference, Mar 2015, Shanghai, China. 2015. 〈hal-01151533〉
  • Stefan Tinck, Erik Neyts, Thomas Tillocher, Remi Dussart, Annemie Bogaerts. Cryogenic Etching of Silicon with SF6/O2/SiF4 plasmas: a modeling and experimental study. Plasma Etch and Strip in Microtechnology, Apr 2015, Leuven, Belgium. 2015. 〈hal-01151530〉
  • Thomas Tillocher, Floriane Leroy, Liping Zhang, Philippe Lefaucheux, Koichi Yatsuda, et al.. Reduction of plasma induced damage of porous low-k materials using a cryogenic etching process. 22nd International Symposium on Plasma Chemistry (ISPC 2015), Jul 2015, Antwerp, Belgium. 2015. 〈hal-01228448〉
  • Stefan Tinck, E.C. Neyts, Thomas Tillocher, Remi Dussart, Annemie Bogaerts. Cryogenic etching of silicon with SF6/O2/SiF4 plasmas: a modelling and experimental study. 22nd International Symposium on Plasma Chemistry (ISPC 2015), Jul 2015, Antwerp, Belgium. 〈hal-01228451〉
  • Floriane Leroy, Thomas Tillocher, Liping Zhang, Philippe Lefaucheux, Koichi Yatsuda, et al.. Cryogenic etching of porous organosilicate low-k materials: Reduction of plasma induced damage. AVS 62nd International Symposium & Exhibition, Oct 2015, San Jose, United States. 〈hal-01228458〉
  • Nicolas Gosset, Thomas Tillocher, Floriane Leroy, Julien Ladroue, Philippe Lefaucheux, et al.. Limitation of surface defects in deep GaN etching. AVS 62nd International Symposium & Exhibition, Oct 2015, San Jose, United States. 〈hal-01228462〉
  • Floriane Leroy, Thomas Tillocher, Philippe Lefaucheux, Remi Dussart, Koichi Yatsuda, et al.. Cryoetching processes applied to ULK material. 37th International Symposium on Dry Process (DPS 2015), Nov 2015, Awaji Island, Japan. 〈hal-01228477〉
  • Edouard Laudrel, Thomas Tillocher, Philippe Lefaucheux, Bertrand Boutaud, Remi Dussart. DRY DEEP ETCHING OF BULK TITANIUM BY PLASMA PROCESSES. AVS 62nd International Symposium & Exhibition, Oct 2015, San Jose, United States. 〈hal-01228465〉
  • Thomas Tillocher, Floriane Leroy, Zhang Liping, Philippe Lefaucheux, Christian Dussarat, et al.. Reduction of plasma induced damage in cryogenic etching of low-k materials. 4th French Symposium on Emerging Technologies for micro-nanofabrication, Nov 2015, Ecully, France. 2015. 〈hal-01277115〉
  • Nicolas Gosset, Floriane Leroy, Thomas Tillocher, Julien Ladroue, Philippe Lefaucheux, et al.. Surface state improvement in GaN deep etching for power electronics applications. 37th International Symposium on Dry Process (DPS 2015), Nov 2015, Awaji Island, Japan. 〈hal-01228470〉
  • Anne-Lise Thomann, Amaël Caillard, El Mokh Mariem, Nadjib Semmar, Remi Dussart, et al.. Energy flux diagnostics in thin film deposition by magnetron sputtering. XXXII International Conference on Phenomena in Ionized Gases (ICPIG), Jul 2015, Iasi, Romania. 〈hal-01290726〉
  • Anne-Lise Thomann, El Mariem, Amaël Caillard, Nadjib Semmar, Thomas Lecas, et al.. Study of energy transfers at the substrate during “transition steps” in magnetron sputter deposition . 14th International Conference on Plasma Surface Engineering PSE 2014 , Sep 2014, Garmisch-Partenkirchen, Germany. 〈hal-01289446〉
  • Nicolas Gosset, Julien Ladroue, Thomas Tillocher, Philippe Lefaucheux, Mohamed Boufnichel, et al.. Effect of surface fluorination on GaN deep dry etching defects. Plasma Etch and Strip in Microtechnology, May 2014, Grenoble, France. 〈hal-01057239〉
  • Remi Dussart, Thomas Tillocher, Nicolas Gosset, Alexane Vital, Philippe Lefaucheux, et al.. Plasma cryoetching processes for silicon and advanced materials. International Conference on Microelectronics and Plasma Technology, Jul 2014, Gunsan, South Korea. 〈hal-01057585〉
  • Alexane Vital, Thomas Tillocher, Remi Dussart, Marylène Vayer, Christophe Sinturel. Submicrometric structured silicon surfaces obtained from polymer blend film by silica replication and cryogenic plasma etching. Plasma Etch and Strip in Microtechnology, May 2014, Grenoble, France. 〈hal-01057586〉
  • Thomas Tillocher, Xiao Liu, Alexane Vital, Nicolas Gosset, Philippe Lefaucheux, et al.. Multiscale etching of holes by cryogenic silicon etching. Plasma Etch and Strip in Microtechnology, May 2014, Gernoble, France. 〈hal-01057242〉
  • V. Schulz-Von Der Gathen, Judith Golda, Daniel Schröder, H. Boettner, Arthur Greb, et al.. Spectroscopic investigations of transient processes in micro-cavity discharge reactors. International Symposium on Non-equilibrium Plasmas and Complex Systems, Feb 2014, Osaka, Japan. 〈hal-01006368〉
  • Mikhail Baklanov, Liping Zhang, Jean-Francois De Marneffe, Remi Dussart, Andy Goodyear. Low damage cryogenic etching of low-K materials for advanced interconnects. Materials for Advanced Metallization, Mar 2014, Dresden, Germany. 〈hal-01006369〉
  • Nicolas Gosset, Julien Ladroue, Thomas Tillocher, Philippe Lefaucheux, Mohamed Boufnichel, et al.. Improvement of GaN Deep Etched Surface State by Fluorination Dedicated to Power Devices. 226th meeting of the Electrochemical Society, Oct 2014, Cancun, Mexico. 〈hal-01151851〉
  • Remi Dussart, Thomas Tillocher, Nicolas Gosset, Philippe Lefaucheux, Mohamed Boufnichel, et al.. Cryoetching of Silicon and Advanced Materials for 3D Interconnects. 226th meeting of the Electroschemical Society, Oct 2014, Cancun, Mexico. 〈hal-01151844〉
  • Thomas Tillocher, Alexane Vital, Marylène Vayer, Nicolas Gosset, Philippe Lefaucheux, et al.. Cryogenic etching of submicronic features in silicon using masks based on porous polymer films. 226th meeting of the Electrochemical Society, Oct 2014, Cancun, Mexico. 〈hal-01151839〉
  • Judith Golda, V Schulz-Von Der Gathen, Valentin Félix, Remi Dussart, Philippe Lefaucheux, et al.. Spectroscopic Diagnostics of Ceramic MHCDs. International Workshop on Microplasmas, May 2013, Pékin, China. 〈hal-00831354〉
  • Remi Dussart, Philippe Lefaucheux, Thomas Tillocher, Pierre Ranson, Mohamed Boufnichel, et al.. Applications of cryogenic plasma etching for microtechnology and advanced CMOS manufacturing. Plasma Etch and Strip in Microtechnology, Mar 2013, Louvain, Belgium. 〈hal-00831344〉
  • Valentin Félix, Remi Dussart, Mukesh Kulsreshath, Philippe Lefaucheux, V. Schulz-Von Der Gathen, et al.. RF Diagnostics of Microplasmas. International Workshop on Microplasmas, May 2013, Pékin, China. 〈hal-00831362〉
  • Lawrence Overzet, Matthew Goeckner, Remi Dussart, Philippe Lefaucheux, Valentin Félix, et al.. Radio Frequency Diagnostics of Microplasmas. Frontiers in Low Temperature Plasma Diagnostics, Apr 2013, Kerkrade, Netherlands. 〈hal-00831368〉
  • Thomas Tillocher, Julien Ladroue, Philippe Lefaucheux, Mohamed Boufnichel, Remi Dussart. Plasma surface interactions in deep dry etching. Workshop on particle - surface interactions : from surface analysis to materials processing, Jun 2013, Luxembourg, Luxembourg. 2013. 〈hal-00831337〉
  • Thomas Tillocher, Philippe Lefaucheux, Bertrand Boutaud, Remi Dussart. Reproducible process for Titanium deep etching. Plasma Etch and Strip in Microtechnology, Mar 2013, Louvain, Belgium. 〈hal-00831358〉
  • Thomas Tillocher, Philippe Lefaucheux, Remi Dussart. Deep etching processes for silicon micro- and nano-machining. Le Studium workshop : Bottom-up approaches to nanotechnology, May 2013, Orléans, France. 〈hal-00831360〉
  • Remi Dussart, Julien Ladroue, Thomas Tillocher, Mohamed Boufnichel, Nicolas Gosset, et al.. Deep etching of gallium nitride by chlorine based plasma. Journées Nationales des Technologies Emergentes, May 2013, Evian, France. 〈hal-00831346〉
  • Lawrence Overzet, Valentin Felix, Remi Dussart, Philippe Lefaucheux, Mukesh Kulsreshath, et al.. On Causes of the Destruction of MHCD Sources During Operation. International Workshop on Microplasmas, May 2013, Pékin, China. 〈hal-00831363〉
  • Nicolas Gosset, Julien Ladroue, Thomas Tillocher, Philippe Lefaucheux, Mohamed Boufnichel, et al.. Dry deep etching of GaN wide-bandgap semiconductor. 19th International Vacuum Conference, Sep 2013, Paris, France. 〈hal-01056606〉
  • Nicolas Gosset, Julien Ladroue, Thomas Tillocher, Philippe Lefaucheux, Mohamed Boufnichel, et al.. Dry deep etching of GaN wide band-gap Semiconductor. AVS 60th International Symposium & Exhibition, Oct 2013, Long Beach, United States. 〈hal-01057235〉
  • Thomas Tillocher, Philippe Lefaucheux, Bertrand Boutaud, Remi Dussart. Reproducible process for titanium deep etching. 19th International Vacuum Conference, Sep 2013, Paris, France. 〈hal-01057233〉
  • Thomas Tillocher, Philippe Lefaucheux, Bertrand Boutaud, Remi Dussart. Titanium deep etching for medical applications. AVS 60th International Symposium & Exhibition, Oct 2013, Long Beach, United States. 〈hal-01057236〉
  • Remi Dussart, Philippe Lefaucheux, Thomas Tillocher, Nicolas Gosset, Julien Ladroue, et al.. Plasma deep etching of silicon, titanium and gallium nitride for microtechnology. AVS 60th International Symposium & Exhibition, Oct 2013, United States. 〈hal-01006364〉
  • Pierre-Antoine Cormier, A. Balhamri, Anne Lise Thomann, Remi Dussart, Nadjib Semmar, et al.. Energy flux measurements at the substrate deposition during reactive and non-reactive magnetron sputter deposition processes. 19th International Vacuum Conference, Sep 2013, Paris, France. 〈hal-01166024〉
  • Mikhail Baklanov, Liping Zhang, Jean-Francois De Marneffe, Remi Dussart. Damage Free Cryogenic Etching of Ultra Low-k Materials. International Interconnect Technology Conference, Jun 2013, Kyoto, Japan. 〈hal-01056603〉
  • Remi Dussart, Mukesh Kulsreshath, Valentin Félix, Lawrence Overzet, Judith Golda, et al.. Integrated microplasmas on silicon: performances and limitations. 19th International Vacuum Conference, Sep 2013, Paris, France. 〈hal-01056618〉
  • Valentin Félix, Remi Dussart, Mukesh Kulsreshath, Philippe Lefaucheux, V. Schulz-Von Der Gathen, et al.. RF diagnostics performed on DC Microplasmas. 19th International Vacuum Conference, Sep 2013, Paris, France. 〈hal-01056614〉
  • Tiberiu Minea, Lise Caillault, Pierre-Antoine Cormier, Remi Dussart, Nadjib Semmar, et al.. Balanced/unbalanced planar magnetron plasma behaviour. Microscopic analysis by PIC-MCC modelling of the ion flux on thermal probes . 13th International Conference on Plasma Surface Engineering PSE 2012, Sep 2012, Garmisch-Partenkirchen, Germany. 〈hal-01288936〉
  • Pierre-Antoine Cormier, Anne-Lise Thomann, Nadjib Semmar, Remi Dussart, Vincent Dolique, et al.. Advantages of energy influx measurements in low pressure plasma processes. International Conference on Plasma Surface Engineering, Sep 2012, Garmisch-Partenkirchen, Germany. 〈hal-00831371〉
  • Thomas Tillocher, Jérémy Pereira, Nasreddine Mekkakia Maaza, Philippe Lefaucheux, Pierre Ranson, et al.. Formation of black silicon by cryogenic plasma etching processes. Micro- and Nano-Engineering (MNE), Sep 2012, Toulouse, France. 〈hal-00831357〉
  • Mukesh Kulsreshath, Laurent Schwaederlé, Lawrence Overzet, Thomas Tillocher, Sébastien Dozias, et al.. Development of microdicharge arrays in silicon operating in DC and AC. European Physical Society/International Conference on Plasma Physics, Jul 2012, Stockholm, Sweden. 〈hal-00831351〉
  • Thomas Tillocher, Judith Golda, Philippe Lefaucheux, Bertrand Boutaud, Pierre Ranson, et al.. Investigations in SF6 and Cl2/Ar plasmas used for titanium deep etching by means of mass spectrometry. ESCAMPIG 2012, Jul 2012, Viana do Castelo, Portugal. 〈hal-00831352〉
  • Mukesh Kulsreshath, Laurent Schwaederlé, Lawrence Overzet, Thomas Tillocher, Sébastien Dozias, et al.. Development of microdicharges in silicon operating in DC for medical applications. 4th International Conference on Plasma Medecine, Jun 2012, Orléans, France. 〈hal-00831349〉
  • Remi Dussart, Thierry Dufour, Mukesh Kulsreshath, Valentin Felix, Laurent Schwaederlé, et al.. Development and characterization of microplasma arrays on Silicon. International Workshop on Physics of Microplasmas, May 2012, Bochum, Germany. 〈hal-00707932〉
  • Mukesh Kulsreshath, Laurent Schwaederlé, Valentin Felix, Philippe Lefaucheux, Thomas Tillocher, et al.. Caractérisation de matrices de micro plasmas sur silicium. XIIeme congrès de la division Plasmas de la Société Française de Physique, May 2012, Orléans, France. 〈hal-00707935〉
  • Remi Dussart, Mukesh Kulsreshath, Valentin Felix, Lawrence Overzet, Thomas Tillocher, et al.. Integrated microplasmas on silicon: a new tool for lab-on-a-chip applications. Cancer Cells On Chip, Jun 2012, Lyon, France. 〈hal-00707933〉
  • Thomas Tillocher, Philippe Lefaucheux, Julien Ladroue, Mohamed Boufnichel, Pierre Ranson, et al.. Optimization of STiGer process used to etch high aspect ratio silicon microstructures. AVS 59th International Symposium and Exhibition, Oct 2012, Tampa, United States. 〈hal-00747743〉
  • Julien Ladroue, Mohamed Boufnichel, Thomas Tillocher, Philippe Lefaucheux, Pierre Ranson, et al.. Deep GaN Etching : Role of SiCl4 in Plasma Chemistry. AVS 59th International Symposium and Exhibition, Oct 2012, Tampa, United States. 〈hal-00747746〉
  • Liping Zhang, Rami Ljazouli, Philippe Lefaucheux, Thomas Tillocher, Remi Dussart, et al.. Damage free cryogenic etching of porous organosilicate low-k films for advanced interconnect application. AVS 59th International Symposium and Exhibition, Oct 2012, Tampa, United States. 〈hal-00747749〉
  • Remi Dussart, Mukesh Kulsreshath, Laurent Schwaederlé, Valentin Felix, Philippe Lefaucheux, et al.. Development and limitations of microplasma arrays on silicon operating in DC. AVS 59th International Symposium and Exhibition, Oct 2012, United States. 〈hal-00747741〉
  • Pierre-Antoine Cormier, Balharmi A., Anne-Lise Thomann, Stephanos Konstantinidis, Remi Dussart, et al.. Direct energy influx measurements in high power impulse sputtering . 2nd International Conference on HiPIMS, HiPIMS2011 , Jun 2011, Braunschweig, Germany. 〈hal-01288780〉
  • Anne-Lise Thomann, Pierre-Antoine Cormier, Remi Dussart, Nadjib Semmar, Jacky Mathias, et al.. Energy influx measurements in low pressure plasmas for material processing. Innovations in Thin Film Processing and Characterisation, and Magnetron, Ion Processing and Arc Technologies European Conference, ITFPC-MIATEC 2011 , Nov 2011, Nancy, France. 〈hal-01289043〉
  • Mukesh Kulsreshath, Laurent Schwaederlé, Philippe Lefaucheux, Thomas Tillocher, Julien Ladroue, et al.. Characterisation of Silicon based micro discharge plasma arrays in Direct Current (DC) at atmospheric pressure. 6th International Workshop on Microplasmas, Apr 2011, Paris, France. 〈hal-00707925〉
  • Remi Dussart, N. Sadeghi, Lawrence Overzet, Mukesh Kulsreshath, Laurent Schwaederlé, et al.. Characterization of the ignition and the extinction of a Micro Hollow Cathode Discharge. 6th International Workshop on Microplasmas, Apr 2011, Paris, France. 〈hal-00707924〉
  • Laurent Schwaederlé, Mukesh Kulsreshath, Lawrence Overzet, Philippe Lefaucheux, Remi Dussart. Microcathode sustained discharges using Si integrated micro-discharges arrays. 6th International Workshop on Microplasmas, Apr 2011, France, France. 〈hal-00707926〉
  • Mukesh Kulsreshath, Laurent Schwaederlé, Philippe Lefaucheux, H. Boettner, V. Schulz-Von Der Gathen, et al.. Micro plasma reactor arrays made in silicon. 18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France. 〈hal-00707927〉
  • Laurent Schwaederlé, Mukesh Kulsreshath, Lawrence Overzet, Remi Dussart, Philippe Lefaucheux, et al.. Microcathode sustained discharges using Si integrated micro-reactors. 18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France. 〈hal-00707929〉
  • Pierre-Antoine Cormier, Anne-Lise Thomann, Remi Dussart, Nadjib Semmar, Jacky Mathias. Direct energy influx measurements between a biased substrate and a low pressure plasma. 18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France. 〈hal-00707930〉
  • Wassim Kafrouni, Thomas Tillocher, Julien Ladroue, Philippe Lefaucheux, Mohamed Boufnichel, et al.. STiGer process for silicon deep etching: extended scalloping reduction on submicron trenches. 18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France. 〈hal-00696422〉
  • Thomas Tillocher, Julien Ladroue, Wassim Kafrouni, Mukesh Kulsreshath, Philippe Lefaucheux, et al.. Deep etching of bulk titanium by plasma. 18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France. 〈hal-00696425〉
  • Julien Ladroue, Mohamed Boufnichel, Thomas Tillocher, Philippe Lefaucheux, Pierre Ranson, et al.. Deep GaN Etching by Inductively Coupled Plasma. HeteroSiC-WASMPE 2011, Jun 2011, Tours, France. 〈hal-00696418〉
  • Julien Ladroue, Mohamed Boufnichel, Thomas Tillocher, Philippe Lefaucheux, Pierre Ranson, et al.. Obtaining a smooth surface after deep GaN etching. 18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France. 〈hal-00696419〉
  • Julien Ladroue, Mohamed Boufnichel, Thomas Tillocher, Philippe Lefaucheux, Pierre Ranson, et al.. Deep Gallium Nitride Etching: ways to avoid etching defects. 3rd International Symposium on Advanced Plasma Science and its Applications for Nitrides and Nanomaterials, Mar 2011, Nagoya, Japan. 〈hal-00696396〉
  • Thomas Tillocher, Wassim Kafrouni, Julien Ladroue, Philippe Lefaucheux, Pierre Ranson, et al.. Deep silicon etching of 0.8 µm to hundreds of microns wide trenches with the STiGer process. AVS 58th International Symposium & Exhibition, Oct 2011, Nashville, United States. 〈hal-00696428〉
  • Thomas Tillocher, Vincent Girault, Guillaume Gomme, Franck Moro, Laurianne Pichon, et al.. Silicon deep cryoetching with the STiGer process. 3RD WORKSHOP ON PLASMA ETCH AND STRIP IN MICROELECTRONICS, Mar 2010, France. 〈hal-00487360〉
  • Nadjib Semmar, Pierre-Antoine Cormier, Anne Lise Thomann, Rémi Dussart, Jacky Mathias, et al.. Comparaison d'une sonde calorimétrique et d'un capteur à thermopile pour la mesure des transferts d'énergie plasma basse pression/surface'. Congrès Français de Thermique, May 2010, Le Touquet, France. pp.755-760, 2010. 〈hal-00504417〉
  • Lawrence Overzet, Monali Mandra, D. Jung, Thierry Dufour, Remi Dussart, et al.. RF Diagnostics of Atmospheric Pressure Micro-Plasmas. Diagnostics Microplasmas, Mar 2010, Germany. 〈hal-00487366〉
  • Remi Dussart, Thierry Dufour, Thomas Tillocher, Mukesh Kulsreshath, Olivier Aubry, et al.. Study of an MHCD operating in He using optical and electrical diagnostics. Diagnostics Microplasmas, Mar 2010, Germany. 〈hal-00487365〉
  • Remi Dussart, Mukesh Kulsreshath, Lawrence Overzet, Laurent Schwaederlé, Thomas Tillocher, et al.. Micro Hollow Cathode Discharge Arrays in silicon devices. 63rd Gaseous Electronics Conference, Oct 2010, Paris, France. 〈hal-00681902〉
  • Julien Ladroue, Remi Dussart, Thomas Tillocher, Philippe Lefaucheux, Pierre Ranson. Gravure du GaN pour la prochaine génération de diodes Schottky. Workshop MNTS 12-20, Minatec, Mar 2010, Grenoble, France. 〈hal-00487358〉
  • Julien Ladroue, Mohamed Boufnichel, Thomas Tillocher, Philippe Lefaucheux, Pierre Ranson, et al.. Deep GaN Etching by Inductively Coupled Plasma. 3RD WORKSHOP ON PLASMA ETCH AND STRIP IN MICROELECTRONICS, Mar 2010, France. 〈hal-00487363〉
  • Remi Dussart. Les Microdécharges en France. Journées Plasma Québec du Réseau Plasma Froid, Jun 2010, France. 〈hal-00503123〉
  • Mukesh Kulsreshath, Thierry Dufour, Philippe Lefaucheux, Olivier Aubry, Sébastien Dozias, et al.. Micro-discharge plasma using silicon platform. AVS 57th International Symposium & Exhibition, Oct 2010, Albuquerque, United States. 〈hal-00707922〉
  • Thomas Tillocher, Wassim Kafrouni, Vincent Girault, Julien Ladroue, Philippe Lefaucheux, et al.. Optimization of STiGer process for silicon deep etching. 63rd Gaseous Electronics Conference, Oct 2010, Paris, France. 〈hal-00696366〉
  • Julien Ladroue, Mohamed Boufnichel, Thomas Tillocher, Philippe Lefaucheux, Pierre Ranson, et al.. Deep Gallium Nitride Etching. 63rd Gaseous Electronics Conference, Oct 2010, Paris, France. 〈hal-00696376〉
  • Julien Ladroue, Mohamed Boufnichel, Thomas Tillocher, Philippe Lefaucheux, Pierre Ranson, et al.. Deep Inductively Coupled Plasma Etching of GaN. AVS 57th International Symposium & Exhibition, Nov 2010, Albuquerque, United States. 〈hal-00696393〉
  • Remi Dussart, Mukesh Kulsreshath, Thierry Dufour, Lawrence Overzet, Philippe Lefaucheux, et al.. Ignition and extinction of a Micro Hollow Cathode Discharge operating in DC regime. AVS 57th International Symposium & Exhibition, Nov 2010, Albuquerque, United States. 〈hal-00696390〉
  • Corinne Duluard, Thomas Tillocher, Laurianne Pichon, Remi Dussart, Philippe Lefaucheux, et al.. A comparative study on O2 and SO2 passivating chemistry for silicon deep cryogenic etching. AVS 53rd International Symposium & Exhibition, Nov 2009, San Francisco, United States. 〈hal-00442683〉
  • Julien Ladroue, Aline Meritan, Mohamed Boufnichel, Philippe Lefaucheux, Pierre Ranson, et al.. Inductively Coupled Plasma Etching of GaN and Induced Defects. AVS 56th International Symposium & Exhibition, Nov 2009, San Jose, United States. 〈hal-00444488〉
  • Monali Mandra, Lawrence Overzet, Matthew Goeckner, Thierry Dufour, Remi Dussart, et al.. Electrical Characterization of Direct Current Atmospheric Pressure Micro-Discharges Using Radio Frequency Signals in Argon. 62nd Gaseous Electronics Conference, Oct 2009, Saratoga Springs, United States. 〈hal-00444482〉
  • Julien Ladroue, Aline Meritan, Mohamed Boufnichel, Philippe Lefaucheux, Pierre Ranson, et al.. GaN Etching by Inductively Coupled Plasma. 17th International Colloquium on Plasma Processes, Jun 2009, Marseille, France. 〈hal-00444471〉
  • Remi Dussart, Thierry Dufour, Lawrence Overzet, Monali Mandra, Jeong Lee, et al.. Experiment and simulation results of limited cathode area MHCDs operating in He. AVS 56th International Symposium & Exhibition, Nov 2009, San Jose, United States. 〈hal-00444491〉
  • Vincent Girault, Remi Dussart, Laurianne Pichon, Jeremy Pereira, Philippe Lefaucheux, et al.. STiGer cryoetching process on silicon : results on performances for 0.8 um trenches. 17th International Colloquium on Plasma Processes, Jun 2009, Marseille, France. 〈hal-00444466〉
  • Jeremy Pereira, Hao Jiang, Laurianne Pichon, Remi Dussart, Corinne Duluard, et al.. STiGer cryoetching process of silicon: passivation mechanisms, enhanced robustness and performances. Plasma Etch and Strip in Microelectronics 2nd International Workshop, Feb 2009, Louvain, Belgium. 〈hal-00444370〉
  • Jeremy Pereira, Remi Dussart, Laurianne Pichon, Vincent Girault, Philippe Lefaucheux, et al.. Formation of Columnar MicroStructures of silicon (CMS) in SF6/O2 plasma in cryogenic conditions. 17th International Colloquium on Plasma Processes, Jun 2009, Marseille, France. 〈hal-00444402〉
  • Thierry Dufour, Remi Dussart, Lawrence Overzet, Monali Mandra, Jeong Lee, et al.. Ignition and characterization of Micro Hollow Cathode Discharges in Helium. 17th International Colloquium on Plasma Processes, Jun 2009, Marseille, France. 〈hal-00444380〉
  • Larbi Bedra, Anne-Lise Thomann, Nadjib Semmar, Rémi Dussart, Jacky Mathias. Direct measurement of energy transfers during deposition of sputtered metal atoms. 17th International Colloquium on Plasma Processes, CIP 09, Jun 2009, Marseille, France. 〈hal-00445581〉
  • Larbi Bedra, Nadjib Semmar, Anne-Lise Thomann, Rémi Dussart, Jacky Mathias. New Approach of Heat Transfer Characterization on Thin Si and Cu Solids.-Effects of Thermal Contact Resistance. 5th European Thermal-Sciences Conference, Eutrotherm 2008, May 2008, Netherlands. pp.101-106, 2008. 〈hal-00443101〉
  • Thierry Dufour, Monali Mandra, Matthew Goeckner, Philippe Lefaucheux, Pierre Ranson, et al.. Ignition of parallel Micro Hollow Cathode Discharges in He without ballasts. 61st Gaseous Electronics Conference, Oct 2008, Dallas, United States. 〈hal-00444346〉
  • Larbi Bedra, Nadjib Semmar, Anne-Lise Thomann, Rémi Dussart, Jacky Mathias, et al.. Micro transfert d'énergie dans un solide mince : effet de la résistance thermique de contact. Congrès Français de Thermique, SFT 2008, Jun 2008, Toulouse, France. Vol.16, pp.385-390, 2008. 〈hal-00443715〉
  • Jeremy Pereira, Laurianne Pichon, Remi Dussart, Corinne Duluard, El-Houcine Oubensaid, et al.. Study of SiOxFy passivation layer deposited in SiF4/O2 ICP discharge. AVS 55th International Symposium & Exhibition, Oct 2008, Boston, United States. 〈hal-00444361〉
  • Anne-Lise Thomann, Rémi Dussart, Nadjib Semmar, Larbi Bedra, Jacky Mathias, et al.. Direct measurements of the energy transfers in deposition or etching low pressure plasma processes. 11th International Conference on Plasma Surface Engineering, PSE2008, Sep 2008, Garmisch-Partenkirchen, Germany. 〈hal-00445589〉
  • Rémi Dussart, Anne-Lise Thomann, Nadjib Semmar, Laurianne Pichon, Larbi Bedra, et al.. A direct measurement of the energy flux density in plasma surface interaction. 61st Gaseous Electronics Conference, 2008, United States. 〈hal-00448760〉
  • Remi Dussart, Philippe Lefaucheux, Pierre Ranson, Laurianne Pichon, Corinne Duluard, et al.. Cryoetching of silicon for MEMS and microelectronic components. 16th International Colloquium on Plasma Processes, Jun 2007, France. 〈hal-00442662〉
  • Nasreddine Mekkakia Maaza, Remi Dussart, Philippe Lefaucheux, Pierre Ranson. Submicronic Etching in the Cryogenic Process. 16th International Colloquium on Plasma Processes, Jun 2007, Toulouse, France. 〈hal-00442684〉
  • Remi Dussart, Philippe Lefaucheux, Pierre Ranson, Laurianne Pichon, Corinne Duluard, et al.. A new generation of cryogenic processes for silicon deep etching. 60th Gaseous Electronics Conference, Oct 2007, Arlington, United States. 〈hal-00442668〉
  • Thierry Dufour, Remi Dussart, Philippe Lefaucheux, Pierre Ranson, Jeong Lee, et al.. Control of the ignition of direct current parallel microdischarges in helium. 16th International Colloquium on Plasma Processes, Jun 2007, France. 〈hal-00442687〉
  • Thierry Dufour, Remi Dussart, Lawrence J. Overzet, Philippe Lefaucheux, Pierre Ranson, et al.. Direct current parallel microdischarges in helium. ISPC-18, Aug 2007, Kyoto, Japan. 2007. 〈hal-01303260〉
  • Remi Dussart. A new generation of cryogenic processes for silicon deep etching. 60th Gaseous Electronics Conference, Oct 2007, Arlington, United States. 〈hal-00365911〉
  • Remi Dussart, Thierry Dufour, Lawrence Overzet, Philippe Lefaucheux, Pierre Ranson, et al.. Direct current parallel microdischarges in helium. International Symposium on Plasma Chemistry, Aug 2007, Kyoto, Japan. pp.27A-a3, 2007. 〈hal-00444228〉
  • Corinne Duluard, Remi Dussart, Laurianne Pichon, El-Houcine Oubensaid, Philippe Lefaucheux, et al.. Neutral production in SF6/SiCl4 inductively coupled plasmas. 60th Gaseous Electronics Conference, Oct 2007, Arlington, United States. 〈hal-00444252〉
  • Corinne Duluard, Remi Dussart, Laurianne Pichon, Philippe Lefaucheux, Michel Puech, et al.. A study on SF6/SiCl4 inductively coupled plasma by mass spectrometry and optical emission spectroscopy. 16th International Colloquium on Plasma Processes, Jun 2007, France. 〈hal-00444208〉
  • Rémi Dussart, Anne-Lise Thomann, Nadjib Semmar, Laurianne Pichon, Jacky Mathias, et al.. Global evaluation of the energy transfer between an ICP argon plasma and a surface. Internatinal Symposium on Plasma Chemistry, ISPC-18, Aug 2007, Kyoto, Japan. 28p-5, 2007. 〈hal-00443518〉
  • Remi Dussart, Laurianne Pichon, Corinne Duluard, Philippe Lefaucheux, Mohamed Boufnichel, et al.. SiOxFy film deposited by SiF4/O2 plasma on silicon at low temperature. 16th International Colloquium on Plasma Processes, Jun 2007, Toulouse, France. 〈hal-00444198〉
  • Laurianne Pichon, El-Houcine Oubensaid, Corinne Duluard, Remi Dussart, Philippe Lefaucheux, et al.. A robust passivation-enhanced cryogenic process used for deep silicon etching. AVS 54th International Symposium & Exhibition, Oct 2007, Seattle, United States. 〈hal-00444264〉
  • Thierry Dufour, Remi Dussart, Philippe Lefaucheux, Pierre Ranson, Monali Mandra, et al.. Limitation of the cathode area for direct current MHCD in Helium. 4th International Workshop on Microplasmas, Oct 2007, Tainan, Taiwan. 〈hal-00444267〉
  • Remi Dussart, Thomas Tillocher, El-Houcine Oubensaid, Philippe Lefaucheux, Pierre Ranson, et al.. Enhanced robustness of the cryogenic process for silicon deep etching. Micro- and Nano-Engineering, Sep 2007, Copenhague, Denmark. 〈hal-00444248〉
  • Laurianne Pichon, Corinne Duluard, Thomas Tillocher, Remi Dussart, Philippe Lefaucheux, et al.. SiOxFy film growth in SiF4/O2 plasma at cryogenic temperature. 18th International Symposium on Plasma Chemistry, Aug 2007, Kyoto, Japan. pp.30P-105, 2007. 〈hal-00444241〉
  • Monali Mandra, Remi Dussart, Jeong Lee, Matthew Goeckner, Thierry Dufour, et al.. Fabrication process and electrical characterization of direct current parallel microdischarges in helium. 60th Gaseous Electronics Conference, Oct 2007, Arlington, United States. 〈hal-00444259〉
  • Nadjib Semmar, Anne-Lise Thomann, Rémi Dussart, Jacky Mathias. Mise au point d'un micro-fluxmètre pour la caractérisation des transferts d'énergie dans un plasma d'argon. Congrès Français de Thermique, SFT 2006, May 2006, Île de Ré, France. pp.727-732, 2006. 〈hal-00443914〉
  • Remi Dussart, Lawrence Overzet, Thierry Dufour, Philippe Lefaucheux. Electrical and spectroscopic study of DC microdischarges made in alumina. 3rd International Workshop on Microplasmas, May 2006, Greifswald, Germany. 〈hal-00442675〉
  • Xavier Mellhaoui, Remi Dussart, Thomas Tillocher, Philippe Lefaucheux, Lawrence Overzet, et al.. SiOxFy passivation layer characterization in the silicon cryoetching. Eighth International Conference on Advanced Surface Engineering (8th ICASE), Apr 2006, Japan. 〈hal-00442663〉
  • Thomas Tillocher, Remi Dussart. Mechanisms and optimization in the cryogenic etching plasma process. Workshop on Silicon dry processing, Sep 2006, Aix-La-Chapelle, Germany. 〈hal-00442676〉
  • Anne-Lise Thomann, Nadjib Semmar, Rémi Dussart, Jacky Mathias. Diagnostic des plasma par micro-fluxmètre. Congrès de la division plasma de la SFP, 2006, May 2006, Pont-à-Mousson, France. 〈hal-00448844〉

Poster12 documents

  • Thomas Tillocher, Philippe Lefaucheux, Mohamed Boufnichel, Remi Dussart. Silicon micromachining at cryogenic temperature. Design, Test, Integration and Packaging of MEMS/MOEMS 2017 (DTIP17), May 2017, Bordeaux, France. 〈hal-01561233〉
  • Edouard Laudrel, Thomas Tillocher, Yannick Méric, Philippe Lefaucheux, Marion Woytasik, et al.. Titanium microstructuring for implantable components. Design, Test, Integration and Packaging of MEMS/MOEMS, May 2017, Bordeaux, France. 〈hal-01561245〉
  • Sebastian Dzikowski, M Sifft, Ronan Michaud, Remi Dussart, V Schulz-Von Der Gathen. Time resolved investigation of rotational temperature of molecular nitrogen in micro-plasma arrays . 9th International Worksop on Microplasmas, Jun 2017, Garmisch Partenkirchen, Germany. 〈hal-01577608〉
  • Edouard Laudrel, Thomas Tillocher, Yannick Méric, Philippe Lefaucheux, Bertrand Boutaud, et al.. Chlorine-based plasma deep etching of bulk titanium. International Symposium on Dry Process 2016 (DPS2016), Nov 2016, Sapporo, Japan. 〈hal-01561222〉
  • Thomas Tillocher, Remi Dussart, Nicolas Holtzer, Philippe Lefaucheux. Enhanced reproducibility of SiO2 atomic layer etching by addition of O2 steps. International Symposium of Dry Process 2016 (DPS2016), Nov 2016, Sapporo, Japan. 〈hal-01561230〉
  • Chengkun Tu, Ying Cui, Remi Dussart, Thomas Tillocher, Philippe Lefaucheux. Deep silicon etching: STiGer vs. BOSCH. Plasma Etch and Strip in Microtechnology, May 2016, Grenoble, France. 〈hal-01344704〉
  • Floriane Leroy, Nataniel Brochu, Romain Chanson, Remi Dussart, Thomas Tillocher, et al.. Advance in low-k cryogenic etching of porous organoscilicate : Investigation of a new gas with higher boiling point Organic (HBPO) and comparison with C4F8. Plasma Etch and Strip in Microtechnology, May 2016, Grenoble, France. 〈hal-01344722〉
  • Stefan Tinck, Erik Neyts, Thomas Tillocher, Remi Dussart, Annemie Bogaerts. Cryogenic etching of silicon with SF6/O2: a computational and experimental study. Plasma Etch and Strip in Microtechnology, May 2016, Grenoble, France. 〈hal-01344725〉
  • Valentin Felix, Vincent Ah-Leung, Judith Golda, Philippe Lefaucheux, Olivier Aubry, et al.. Near Atmospheric Pressure Etching of Silicon by Microplasma. International workshop on microplasmas, May 2015, Newark, France. 〈hal-01166020〉
  • Stephanos Konstantinidis, Pierre-Antoine Cormier, Anne-Lise Thomann, Remi Dussart, Nadjib Semmar, et al.. On the relationship between the energy flux at the substrate surface and the phase constitution of reactively magnetron sputtered titanium dioxide thin films. 14th International Conference on Plasma Surface Engineering PSE 2014 , Sep 2014, Garmisch-Partenkirchen, Germany. 〈hal-01289438〉
  • Pierre-Antoine Cormier, Anne-Lise Thomann, Nadjib Semmar, Remi Dussart, Dolique Vincent, et al.. Détermination de l'énergie transférée aux surfaces lors de la modification de matériaux par procédés plasmas basse pression. 12ème congrès de la division plasma de la SFP , May 2012, Orléans, France. 〈hal-01288927〉
  • Pierre-Antoine Cormier, Dolique Vincent, Anne-Lise Thomann, Jacky Mathias, Balharmi A., et al.. Direct energy influx measurement in reactive magnetron sputtering. Reactive sputter deposition RSD 2011, Dec 2011, Linköping, Sweden. 〈hal-01288906〉

Chapitre d'ouvrage2 documents

  • Remi Dussart, Anne-Lise Thomann, Nadjib Semmar. A Heat Flux Microsensor for Direct Measurements in Plasma Surface Interactions. Igor Minin. Microsensors, Intech, pp.87, 2011, 978-953-307-170-1. 〈hal-00707968〉
  • Anne Lise Thomann, Nadjib Semmar, Rémi Dussart, Larbi Bedra, Jacky Mathias, et al.. Un capteur de flux d'énergie dans les plasmas. MRCT CNRS. Plasmas Froids : Systèmes d'analyse, Modélisation et Rayonnement, Presses imprimerie Saint-Etienne, pp.97-120, 2009. 〈hal-00443857〉

Direction d'ouvrage, Proceedings, Dossier1 document

  • Stéphane Mottin, Thierry Belmonte, Jérôme Kasparian, Jean-Pierre Wolf, Patrick Mauchien, et al.. Plasmas Froids : Systèmes d'analyse, Modélisation et Rayonnement. Publications MRCT, pp.400, 2009. 〈hal-00420645〉