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	Alternating SiCl4/O2 passivation steps with SF6 etch steps for silicon deep etching Corinne Y. Duluard , Pierre Ranson , Laurianne E. Pichon , Jeremy Pereira , El-Houcine Oubensaid Journal of Micromechanics and Microengineering, 2011, 21, pp.065015 Article dans une revue hal-00655003v1
	In situ x-ray photoelectron spectroscopy analysis of SiOxFy passivation layer obtained in a SF6/O2 cryoetching process Jeremy Pereira , Laurianne E. Pichon , Remi Dussart , Christophe Cardinaud , Corinne Y. Duluard Applied Physics Letters, 2009, 94, pp.071501. ⟨10.1063/1.3085957⟩ Article dans une revue hal-00365892v1

	STiGer cryoetching process of silicon: passivation mechanisms, enhanced robustness and performances Jeremy Pereira , Hao Jiang , Laurianne E. Pichon , Remi Dussart , Corinne Y. Duluard Plasma Etch and Strip in Microelectronics 2nd International Workshop, Feb 2009, Louvain, Belgium Communication dans un congrès hal-00444370v1
	STiGer cryoetching process on silicon : results on performances for 0.8 um trenches Vincent L. Girault , Remi Dussart , Laurianne E. Pichon , Jeremy Pereira , Philippe Lefaucheux 17th International Colloquium on Plasma Processes, Jun 2009, Marseille, France Communication dans un congrès hal-00444466v1
	Formation of Columnar MicroStructures of silicon (CMS) in SF6/O2 plasma in cryogenic conditions Jeremy Pereira , Remi Dussart , Laurianne E. Pichon , Vincent L. Girault , Philippe Lefaucheux 17th International Colloquium on Plasma Processes, Jun 2009, Marseille, France Communication dans un congrès hal-00444402v1
	Study of SiOxFy passivation layer deposited in SiF4/O2 ICP discharge Jeremy Pereira , Laurianne E. Pichon , Remi Dussart , Corinne Y. Duluard , El-Houcine Oubensaid AVS 55th International Symposium & Exhibition, Oct 2008, Boston, United States Communication dans un congrès hal-00444361v1

Remi Dussart