Documentation
Français (FR)

Anglais (EN)

Remi Dussart

14

Documents

Présentation

Publications

855202

	Alternating SiCl4/O2 passivation steps with SF6 etch steps for silicon deep etching Corinne Y. Duluard , Pierre Ranson , Laurianne E. Pichon , Jeremy Pereira , El-Houcine Oubensaid Journal of Micromechanics and Microengineering, 2011, 21, pp.065015 Article dans une revue hal-00655003v1
	Neutral species in inductively coupled SF6/SiCl4 plasmas Corinne Y. Duluard , Pierre Ranson , Laurianne E. Pichon , El-Houcine Oubensaid , Jeremy Pereira Journal of Physics D: Applied Physics, 2009, 42, pp.115206 Article dans une revue hal-00396438v1
	Cryogenic etching of n-type silicon with p+ doped walls with the TGZM process through the Al/Si eutectic alloy El-Houcine Oubensaid , Corinne Y. Duluard , Laurianne E. Pichon , B. Morillon , Mohamed Boufnichel Microelectronic Engineering, 2009, 86, pp.2262. ⟨10.1016/j.mee.2009.04.002⟩ Article dans une revue hal-00413753v1
	Direct measurements of the energy flux due to chemical reactions at the surface of a silicon sample interacting with a SF6 plasma Remi Dussart , Anne-Lise Thomann , Laurianne E. Pichon , Larbi Bedra , Nadjib Semmar Applied Physics Letters, 2008, 93, pp.131502. ⟨10.1063/1.2995988⟩ Article dans une revue hal-00336392v1

	STiGer cryoetching process of silicon: passivation mechanisms, enhanced robustness and performances Jeremy Pereira , Hao Jiang , Laurianne E. Pichon , Remi Dussart , Corinne Y. Duluard Plasma Etch and Strip in Microelectronics 2nd International Workshop, Feb 2009, Louvain, Belgium Communication dans un congrès hal-00444370v1
	Formation of Columnar MicroStructures of silicon (CMS) in SF6/O2 plasma in cryogenic conditions Jeremy Pereira , Remi Dussart , Laurianne E. Pichon , Vincent L. Girault , Philippe Lefaucheux 17th International Colloquium on Plasma Processes, Jun 2009, Marseille, France Communication dans un congrès hal-00444402v1
	STiGer cryoetching process on silicon : results on performances for 0.8 um trenches Vincent L. Girault , Remi Dussart , Laurianne E. Pichon , Jeremy Pereira , Philippe Lefaucheux 17th International Colloquium on Plasma Processes, Jun 2009, Marseille, France Communication dans un congrès hal-00444466v1
	Study of SiOxFy passivation layer deposited in SiF4/O2 ICP discharge Jeremy Pereira , Laurianne E. Pichon , Remi Dussart , Corinne Y. Duluard , El-Houcine Oubensaid AVS 55th International Symposium & Exhibition, Oct 2008, Boston, United States Communication dans un congrès hal-00444361v1
	SiOxFy film deposited by SiF4/O2 plasma on silicon at low temperature Remi Dussart , Laurianne E. Pichon , Corinne Y. Duluard , Philippe Lefaucheux , Mohamed Boufnichel 16th International Colloquium on Plasma Processes, Jun 2007, Toulouse, France Communication dans un congrès hal-00444198v1
	Neutral production in SF6/SiCl4 inductively coupled plasmas Corinne Y. Duluard , Remi Dussart , Laurianne E. Pichon , El-Houcine Oubensaid , Philippe Lefaucheux 60th Gaseous Electronics Conference, Oct 2007, Arlington, United States Communication dans un congrès hal-00444252v1
	A robust passivation-enhanced cryogenic process used for deep silicon etching Laurianne E. Pichon , El-Houcine Oubensaid , Corinne Y. Duluard , Remi Dussart , Philippe Lefaucheux AVS 54th International Symposium & Exhibition, Oct 2007, Seattle, United States Communication dans un congrès hal-00444264v1
	A study on SF6/SiCl4 inductively coupled plasma by mass spectrometry and optical emission spectroscopy Corinne Y. Duluard , Remi Dussart , Laurianne E. Pichon , Philippe Lefaucheux , Michel Puech 16th International Colloquium on Plasma Processes, Jun 2007, France Communication dans un congrès hal-00444208v1
	SiOxFy film growth in SiF4/O2 plasma at cryogenic temperature Laurianne E. Pichon , Corinne Y. Duluard , Thomas Tillocher , Remi Dussart , Philippe Lefaucheux 18th International Symposium on Plasma Chemistry, Aug 2007, Kyoto, Japan. pp.30P-105 Communication dans un congrès hal-00444241v1
	Enhanced robustness of the cryogenic process for silicon deep etching Remi Dussart , Thomas Tillocher , El-Houcine Oubensaid , Philippe Lefaucheux , Pierre Ranson Micro- and Nano-Engineering, Sep 2007, Copenhague, Denmark Communication dans un congrès hal-00444248v1