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	Roughness generation during Si etching in Cl 2 pulsed plasma Odile Mourey , Camille Petit-Etienne , Gilles Cunge , Maxime Darnon , Emilie Despiau-Pujo Journal of Vacuum Science & Technology A, 2016, 34 (4), ⟨10.1116/1.4951694⟩ Article dans une revue hal-01881982v1
	Porous SiOCH integration: etch challenges with a trench first metal hard mask approach Nicolas Possémé , Thibaut David , Thierry Chevolleau , Maxime Darnon , Philippe Brun ECS Transactions, 2011, 34, pp.389. ⟨10.1149/1.3567609⟩ Article dans une revue hal-00647490v1

	Etch process cleaning to improve wafer to wafer reproducibility T. Chevolleau , C. Petit-Etienne , Gilles Cunge , Erwine Pargon , L. Vallier ENRIS 2019 (European Nanofabrication Research Infrastructure Symposium), 2019, UNIVERSITY OF TWENTE, Netherlands Communication dans un congrès hal-02624143v1
	Porous SiOCH integration: Etch challenges with a trench first metal hard mask approach Nicolas Possémé , Thibaut David , Thierry Chevolleau , Maxime Darnon , Philippe Brun Chinese Semiconductor Technology International Conference (CSTIC), Mar 2011, Shanghaï, China. pp.389-394, ⟨10.1149/1.3567609⟩ Communication dans un congrès hal-00625347v1
	Profile control and sidewall modifications of narrow porous ULK trenches after plasma etching and pore sealing treatments Maxime Darnon , Thierry Chevolleau , D. Eon , Fanny Bailly , Bernard Pélissier 53rd International AVS Symposium, 2006, San Francisco, United States Communication dans un congrès hal-00400479v1

Maxime Darnon