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Marie-Lise Flottes
29
Documents
Identifiants chercheurs
marie-lise-flottes- IdRef : 142992321
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0000-0002-7231-3976
Présentation
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Development and Application of Embedded Test Instruments to Digital, Analog/RFs and Secure ICsIOLTS 2020 - 26th IEEE International Symposium on On-Line Testing and Robust System Design, Jul 2020, Napoli, Italy. pp.1-4, ⟨10.1109/IOLTS50870.2020.9159723⟩
Communication dans un congrès
lirmm-02993384v1
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European Network for Test EducationDELTA'02: 1st International Workshop on Electronic DesignTest and Applications, Christchurch, New Zeland, pp.230-239
Communication dans un congrès
lirmm-00268490v1
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Power Supply Investigation for Wireless Wafer TestLATW'08: 9th Latin-American Test Workshop, Mar 2008, Puebla, Mexico. pp.165-170
Communication dans un congrès
lirmm-00260205v1
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Testing System-in-Package WirelesslyLATW'06: 7th Latin American Test Workshop, 2006, Buenos Aires, Argentina. pp.73-78
Communication dans un congrès
lirmm-00102751v1
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Testing System-In-Package WirelesslyDTIS: Design and Technology of Integrated Systems in Nanoscale Era, Sep 2006, Tunis, Tunisia. pp.222-226
Communication dans un congrès
lirmm-00094916v1
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Test Digital, Test de Mémoires, Test Mixte : 5 Centres de Compétence pour la Formation en EuropeCNFM'04 : 8ème Journées Pédagogiques du Comité National de Formation en Microélectronique, 2004, Saint Malo, France. p. 242
Communication dans un congrès
lirmm-00108671v1
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A Remote Access to Engineering Test Facilities for the Distant Education of European Microelectronics Students32nd Annual Frontiers in Education (FIE), Nov 2002, Boston, MA, United States. pp.T2E-24, ⟨10.1109/FIE.2002.1157943⟩
Communication dans un congrès
lirmm-00269423v1
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EuNICE-Test Project: A remote Access to Engineering Test for European UniversitiesEWME: European Workshop on Microelectronics Education, 2002, Vigo, Spain. pp.133-136
Communication dans un congrès
lirmm-00268489v1
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TOETS: Work Package 1Poster de conférence lirmm-00653039v1 |
Wireless Wafer Test for Iterative Testing During System Assembly3D-Test: Testing Three-Dimensional Stacked Integrated Circuits, Nov 2010, Austin, Texas, United States. , 1st IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits, 2010
Poster de conférence
lirmm-00537849v1
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Wireless Test Structure for Integrated SystemsITC'2008: International Test Conference, Oct 2008, Santa Clara, CA, United States. pp.N/A, 2008, ⟨10.1109/TEST.2008.4700704⟩
Poster de conférence
lirmm-00375077v1
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Test de Circuits et de Systèmes IntégrésCollection EGEM, Ed.Hermès, 2004, 2-7462-0864-4
Ouvrages
lirmm-00109158v1
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System and Method for Wirelessly Testing Integrated CircuitsSpain, Patent n° : EP 08290891 WO 2010031879 (A1). 2008, pp.N/A
Brevet
lirmm-00767777v1
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