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Karim Inal

3
Documents

Présentation

Thèse Orsay-ENSAM, ATER ENSAM Paris, MCF ENSAM Metz puis Aix en Provence, Pr ENSMSE Gardanne, Pr MinesParisTech Sophia

Publications

881779

Packaging induced stress effects investigations on 40nm CMOS technology node: Measurements and optimization of device shifts

 Komi Atchou Ewuame , Pierre-Olivier Bouchard , Vincent Fiori , Sebastien Gallois-Garreignot , Karim Inal
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), Dec 2015, Singapore, Singapore. pp.346-351, ⟨10.1109/EPTC.2015.7412333⟩
Communication dans un congrès hal-01354249v1

CMOS stress sensor for 3D integrated circuits: Thermo-mechanical effects of Through Silicon Via (TSV) on surrounding silicon

 Komi Atchou Ewuame , Vincent Fiori , Karim Inal , Pierre-Olivier Bouchard , Sébastien Gallois-Garreignot
15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, Apr 2014, Ghent, Belgium. 8 p. - ISBN 978-1-4799-4791-1, ⟨10.1109/EuroSimE.2014.6813808⟩
Communication dans un congrès hal-01024448v1

Mechanical Issues Induced by Electrical Wafer Sort: Correlations from actual tests, Nanoindentation and 3D Dynamic Modeling

 Romuald Roucou , Vincent Fiori , Karim Inal , Hervé Jaouen
Electronics System Integration Technology Conference ESTC 2010, Sep 2010, Berlin, Germany. pp.P0027, ⟨10.1109/ESTC.2010.5642863⟩
Communication dans un congrès emse-00533813v1