Co-auteurs

Réseaux sociaux

  • ResearchGate: karim_inal
Nombre de documents

54

Karim Inal, Mes publications


Thèse Orsay-ENSAM, ATER ENSAM Paris, MCF ENSAM Metz puis Aix en Provence, Pr ENSMSE Gardanne, Pr MinesParisTech Sophia


Article dans une revue18 documents

  • Simon Gousseau, Stéphane Moreau, David Bouchu, Alexis Farcy, Pierre Montmitonnet, et al.. Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence. Microelectronics Reliability, Elsevier, 2015, 55 (8), pp.1205-1213. <10.1016/j.microrel.2015.05.019>. <hal-01166314>
  • Kokou Adokanou, Karim Inal, Pierre Montmitonnet, Francis Pressecq, Barbara Bonnet, et al.. Investigation on the effect of external mechanical stress on the DC characteristics of GaAs microwave devices. Microelectronics Reliability, Elsevier, 2015, Proceedings of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - Proceedings of ESREF 2015, 55 (9-10), pp.1697-1702. <10.1016/j.microrel.2015.06.033>. <hal-01180774>
  • Sebastian Orellana, Brice Arrazat, Pascal Fornara, Christian Rivero, Sylvain Blayac, et al.. Robust design of thermo-mechanical MEMS switch embedded in aluminium BEOL interconnect. Microelectronics Reliability, Elsevier, 2015, Proceedings of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - Proceedings of ESREF 2015, 55 (9-10), pp.1896-1900. <10.1016/j.microrel.2015.06.032>. <hal-01180626>
  • Komi Atchou Ewuame, Vincent Fiori, Karim Inal, Pierre-Olivier Bouchard, Sebastien Gallois-Garreignot, et al.. Investigations of Thermomechanical Stress Induced by TSV-Middle (Through-Silicon via) in 3-D ICs by Means of CMOS Sensors and Finite-Element Method. IEEE Transactions on Components, Packaging and Manufacturing Technology. Part A, Manufacturing Technology, Institute of Electrical and Electronics Engineers (IEEE), 2015, 5 (8), pp.1085-1092 - Article number 7164297. <10.1109/TCPMT.2015.2445099>. <hal-01221158>
  • Brice Arrazat, Sebastian Orellana, Christian Rivero, P. Fornara, Antonio Di Giacomo, et al.. From stress sensor towards back end of line embedded thermo-mechanical sensor. Microelectronic Engineering, Elsevier, 2014, 120, pp.41-46. <10.1016/j.mee.2013.12.013>. <hal-00932762>
  • Romain Cauchois, Mohamed Saadaoui, Abdelwahhab Yakoub, Karim Inal, Béatrice Dubois-Bonvalot, et al.. Impact of variable frequency microwave and rapid thermal sintering on microstructure of inkjet-printed silver nanoparticles. Journal of Materials Science, Springer Verlag, 2012, 47 (20), pp.7110-7116. <10.1007/s10853-012-6366-6>. <emse-00673215>
  • Jean-Philippe Mathieu, Karim Inal, Sophie Berveiller, Olivier Diard. A micromechanical interpretation of the temperature dependence of Beremin model parameters for french RPV steel. Journal of Nuclear Materials, Elsevier, 2010, 406 (1), pp.97-112. <10.1016/j.jnucmat.2010.02.025>. <hal-00833671>
  • Pierre-Yves Duvivier, Vincent Mandrillon, Karim Inal. Selective image analysis for roughness characterisation. Tribology - Materials, Surfaces & Interfaces, 2010, 4 (3), pp.136-143. <emse-00533815>
  • Raphaël Pesci, Karim Inal, Renaud Masson. Three scale modeling of the behavior of a 16MND5-A508 bainitic steel: Stress distribution at low temperatures. Materials Science and Engineering: A, Elsevier, 2009, 527 (1-2), pp.376-386. <10.1016/j.msea.2009.08.020>. <emse-00466384>
  • Raphaël Pesci, Karim Inal, Renaud Masson. Three scale modeling of the behavior of a 16MND5-A508 bainitic steel: Stress distribution at low temperatures. Materials Science and Engineering: A, Elsevier, 2009, 527 (1-2), pp.376-386. <10.1016/j.msea.2009.08.020>. <hal-01166251>
  • Mamadou Diobet Diop, Vincent Mandrillon, Hervé Boutry, Karim Inal, Roland Fortunier. Analysis of nickel cylindrical bump insertion into aluminium thin film for flip chip applications. Microelectronic Engineering, Elsevier, 2009, 87 (3), pp.522-526. <10.1016/j.mee.2009.07.020>. <emse-00450478>
  • Renaud Vayrette, C. Rivero, B. Gros, Sylvain Blayac, Karim Inal. Residual stress estimation in damascene copper interconnects using embedded sensors. Microelectronic Engineering, Elsevier, 2009, 87 (3), pp.412-415. <10.1016/j.mee.2009.05.017>. <emse-00450882>
  • N. Shiekhelsouk, V. Favier, Karim Inal, M. Cherkaoui. Modelling the behaviour of polycrystalline austenitic steel with twinning-induced plasticity effect. International Journal of Plasticity, Elsevier, 2009, 25 (1), pp.105-133. <10.1016/j.ijplas.2007.11.004>. <emse-00429576>
  • Man Su, Xavier Boddaert, Karim Inal. Numerical investigations of smart card module: parametric analysis and design optimization. IEEE Transaction on Device and Material reliability, 2008, 8 (3), pp.464-470. <10.1109/TDMR.2008.2002347>. <emse-00476018>
  • Karim Inal, Raphaël Pesci, Jean-Lou Lebrun, Olivier Diard, Renaud Masson. Grain and phase stress criteria for behaviour and cleavage in duplex and bainitic steels. Fatigue and Fracture of Engineering Materials and Structures, Wiley-Blackwell, 2006, 29 (9-10), pp.685-696. <10.1111/j.1460-2695.2006.01056.x>. <hal-01203493>
  • Raphaël Pesci, Karim Inal, Sophie Berveiller, Etienne Patoor, Jean-Sébastien Lecomte, et al.. Inter- and Intragranular Stress Determination with Kossel Microdiffraction in a Scanning Electron Microscope. Materials Science Forum, 2006, 524-525, pp.109-114. <10.4028/www.scientific.net/MSF.524-525.109 >. <hal-01213863>
  • Raphaël Pesci, Karim Inal, Marcel Berveiller, Renaud Masson. Distribution des contraintes dans l’acier bainitique 16MND5. Analyse expérimentale et modélisation polycristalline. Mécanique and Industries / Mécanique et Industries, EDP Sciences, 2003, 4 (4), pp.457-465. <10.1016/S1296-2139(03)00075-7>. <hal-01203593>
  • Raphaël Pesci, Karim Inal, Marcel Berveiller, Jean-Lu Lebrun. Internal Stress Analysis for the Damage Study of a 16MND5 Bainitic Steel. Materials Science Forum, 2002, 404-407, pp.641-646. <10.4028/www.scientific.net/MSF.404-407.641>. <hal-01245099>

Communication dans un congrès35 documents

  • Frédéric Georgi, Romain Macabies, Muriel Bouttemy, Damien Aureau, Karim Inal. Etude XPS de la ré-oxydation de films de Nichrome dans la chambre d'analyse lors du profilage séquentiel par érosion. ELSPEC'16, 7eme conférence francophone sur les spectroscopies d’électrons, May 2016, Versailles_Meudon, France. <hal-01444740>
  • Kokou Adokanou, Karim Inal, Pierre Montmitonnet, Frédéric Courtade, Barbara Bonnet. Thermo-mechanical analysis of GaAs devices under temperature-humidity-bias testing. 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE 2015, Apr 2015, Budapest, Hungary. IEEE, Proceedings EuroSimE 2015, 8 p. - ISBN 978-1-4799-9949-1 2015, <10.1109/EuroSimE.2015.7103140>. <hal-01247921>
  • Komi Atchou Ewuame, Pierre-Olivier Bouchard, Vincent Fiori, Sebastien Gallois-Garreignot, Karim Inal, et al.. Packaging induced stress effects investigations on 40nm CMOS technology node: Measurements and optimization of device shifts. 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), Dec 2015, Singapore, Singapore. Institute of Electrical and Electronics Engineers - IEEE, Proceedings of the Electronic Packaging Technology Conference, EPTC, pp.346-351, 2016, <10.1109/EPTC.2015.7412333>. <hal-01354249>
  • Roberto Lacerda De Orio, Simon Gousseau, Stéphane Moreau, Hajdin Ceric, Siegfried Selberherr, et al.. On the material depletion rate due to electromigration in a copper TSV structure. 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW) , Oct 2014, S. Lake Tahoe, California, United States. IEEE International Integrated Reliability Workshop Final Report, pp.111-114 - ISBN 978-1-4799-7308-8 2015, <10.1109/IIRW.2014.7049523>. <hal-01298215>
  • Brice Arrazat, Sebastian Orellana, C. Rivero, P. Fornara, Antonio Di Giacomo, et al.. Determination of material properties and failure using in-situ thermo-mechanical probe. 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2014, Apr 2014, Cannes, France. IEEE, DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, pp.Article number 7056700 - ISBN 978-2-35500-028-7, <10.1109/DTIP.2014.7056700>. <hal-01143767>
  • Romain Cauchois, András Borbély, Patrice Gergaud, Mohamed Saadaoui, Karim Inal. Microstrain and residual stress in thin-films made from silver nanoparticles deposited by inkjet-printing technology. M. François, G. Montay, B. Panicaud, D. Retraint and E. Rouhaud. 9th European Conference on Residual Stresses, ECRS 2014, Jul 2014, Troyes, France. Advanced Materials Research, 996, pp.930-935, 2014, Residual Stresses IX. <10.4028/www.scientific.net/AMR.996.930>. <hal-01063661>
  • Kévin Tekaya, Manuel Fendler, Delphine Dumas, Yann Gaeremynck, David Henry, et al.. Hemispherical curved monolithic cooled and uncooled infrared focal plane arrays for compact cameras. Bjørn F. Andresen; Gabor F. Fulop; Charles M. Hanson; Paul R. Norton. Infrared Technology and Applications XL, May 2014, Baltimore, Maryland, United States. The International Society for Optical Engineering, 9070, art. no. 90702T - 8 p., 2014, <10.1117/12.2049967>. <hal-01060488>
  • Komi Atchou Ewuame, Vincent Fiori, Karim Inal, Pierre-Olivier Bouchard, Sébastien Gallois-Garreignot, et al.. CMOS stress sensor for 3D integrated circuits: Thermo-mechanical effects of Through Silicon Via (TSV) on surrounding silicon. 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, Apr 2014, Ghent, Belgium. IEEE, 8 p. - ISBN 978-1-4799-4791-1, 2014, <10.1109/EuroSimE.2014.6813808>. <hal-01024448>
  • Sebastian Orellana, Brice Arrazat, P. Fornara, Christian Rivero, Antonio Di Giacomo, et al.. Improvement of freestanding CMOS-MEMS through detailed stress analysis in metallic layers. 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, Apr 2014, Ghent, Belgium. IEEE, 6 p. - ISBN 978-1-4799-4791-1, 2014, <10.1109/EuroSimE.2014.6813834>. <hal-01024062>
  • Komi Atchou Ewuame, Vincent Fiori, Karim Inal, Pierre-Olivier Bouchard, Sébastien Gallois-Garreignot, et al.. Investigation of TSV induced thermo-mechanical stress: Implementation of piezoresistive sensors and correlation with simulation. M. François, G. Montay, B. Panicaud, D. Retraint and E. Rouhaud. 9th European Conference on Residual Stresses, ECRS 2014, Jul 2014, Troyes, France. Advanced Materials Research, 996, pp.975-981, 2014, Residual Stresses IX. <10.4028/www.scientific.net/AMR.996.975>. <hal-01063670>
  • Simon Gousseau, Stéphane Moreau, David Bouchu, Alexis Farcy, Pierre Montmitonnet, et al.. First in Operando SEM Observation of Electromigration-Induced Voids in TSV Structures. 39th International Symposium for Testing and Failure Analysis - ISTFA 2013, Nov 2013, San Jose, California, United States. ASM International, pp.59-68 - ISBN 978-1-62708-022-4, 2013. <hal-01052908>
  • Kévin Tekaya, Manuel Fendler, Karim Inal, Elisabeth Massoni, Herve Ribot. Mechanical behavior of flexible silicon devices curved in spherical configurations. 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Apr 2013, Wroclaw, Poland. IEEE - Institute of Electrical and Electronics Engineers, 7 p. - Article number 6529978, 2013, <10.1109/EuroSimE.2013.6529978>. <hal-00857209>
  • Brice Arrazat, Karim Inal, Patrice Gergaud. INVESTIGATION OF BORON AND NITROGEN ION BEAM IMPLANTATION IN GOLD THIN FILMS FOR OHMIC MEMS SWITCH CONTACT IMPROVEMENT. Tansducers and Eurosensors XXVII, Jun 2013, Barcelona, Spain. 2013. <emse-00840099>
  • Romain Cauchois, Mohamed Saadaoui, Jacques Legeleux, Thierry Malia, Béatrice Dubois-Bonvalot, et al.. Chip integration using inkjet-printed silver conductive tracks reinforced by electroless plating for flexible board packages. MiNaPAD 2012. Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum, Apr 2012, Grenoble, France. pp.F01, 2012. <emse-00691806>
  • Romain Cauchois, Daniel Żymełka, Karim Inal, Mohamed Saadaoui. Selective Sintering of Inkjet-Printed Silver Inks Using Variable Frequency Microwave. Global Congress on Microwave Energy Applications, Jul 2012, Long Beach, California, United States. <emse-00714123>
  • Romain Cauchois, Mohamed Saadaoui, Karim Inal, Béatrice Dubois-Bonvalot, Jean-Christophe Fidalgo. Printed Ag nanoparticles on Evaporated Au System: Impact of Microstructure on Mechanical and Electrical Properties. European Materials Research Society Spring Meeting, May 2011, Nice, France. <emse-00594778>
  • Romain Cauchois, Mohamed Saadaoui, Karim Inal, Béatrice Dubois-Bonvalot, Jean-Christophe Fidalgo. Tailoring the Crystallographic Texture and Electrical Properties of Inkjet-printed Interconnects for Use in Microelectronics. Materials Research Society Spring Meeting, 2011, San Francisco, United States. 1323, pp.O8.10, 2011, <10.1557/opl.2011.1264>. <emse-00576968>
  • Romain Cauchois, Mohamed Saadaoui, Abdelwahhab Yakoub, Karim Inal, Béatrice Dubois-Bonvalot, et al.. Optimal sintering technologies applied to inkjet-printed silver nanoparticles for microelectronics applications. International Conference on Sintering 2011, Aug 2011, Jeju, South Korea. <emse-00638031>
  • François Le Texier, Jessica Mazuir, Man Su, Mohamed Saadaoui, Jean-Luc Liotard, et al.. Investigation of local stress around TSVs by micro-Raman spectroscopy and finite element simulation. International Interconnect Technology Conference and Materials for Advanced Metallization 2011, May 2011, Dresde, Germany. pp.1-3, 2011, <10.1109/IITC.2011.5940351>. <emse-00638030>
  • Brice Arrazat, Vincent Mandrillon, Karim Inal, Maxime Vincent, Christophe Poulain. Microstructure evolution of gold thin films under spherical indentation for micro switches contact applications. European Materials Research Society 2010, Jun 2010, Strasbourg, France. <emse-00554023>
  • Pierre-Yves Duvivier, Vincent Mandrillon, Karim Inal. Time dependence investigation of the electrical resistance of Au / Au thin film micro contacts. 25th International Conference on Electrical Contacts & 56th IEEE Holm Conference on Electrical Contacts, Oct 2010, Charleston, United States. pp.58-64, 2010, <10.1109/HOLM.2010.5619563>. <emse-00533805>
  • Denis Bouscaud, Sophie Berveiller, Raphael Pesci, Claire Maurice, Roland Fortunier, et al.. Analyse de déformations et contraintes locales par couplage EBSD et microdiffraction Kossel. Matériaux 2010, Oct 2010, Nantes, France. pp.0461, 2010. <emse-00533744>
  • Brice Arrazat, Vincent Mandrillon, Karim Inal. Nanoindentation de couches dures ultramines de ruthénium sur or. Materiaux 2010, Oct 2010, Nantes, France. pp.0641, 2010. <emse-00533722>
  • Romain Cauchois, Mohamed Saadaoui, Jacques Legeleux, Thierry Malia, Béatrice Dubois-Bonvalot, et al.. Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages. ESTC 2010. Electronics System Integration Technology Conference, Sep 2010, Berlin, Germany. pp.AP-4, 2010, <10.1109/ESTC.2010.5642997>. <emse-00530148>
  • Romuald Roucou, Vincent Fiori, Karim Inal, Hervé Jaouen. Mechanical Issues Induced by Electrical Wafer Sort: Correlations from actual tests, Nanoindentation and 3D Dynamic Modeling. Electronics System Integration Technology Conference ESTC 2010, Sep 2010, Berlin, Germany. pp.P0027, 2010, <10.1109/ESTC.2010.5642863>. <emse-00533813>
  • Man Su, Karim Inal, Xavier Boddaert. Effect of Packaging Design on Wire Bond Interconnection Reliability. ARCSIS Micropackaging Days Thin and Flexible Packaging 2009, Oct 2009, Gardanne, France. <emse-00470634>
  • Romuald Roucou, Florian Cacho, Vincent Fiori, Karim Inal, Xavier Boddaert. Mechanical study of the probing effect on PAD structures. ARCSIS Micropackaging Days Thin and Flexible Packaging 2009, Oct 2009, Gardanne, France. <emse-00470630>
  • Romain Cauchois, Mohamed Saadaoui, Karim Inal, Béatrice Dubois-Bonvalot, Jean-Cristophe Fidalgo. Direct-writing of conductive patterns based on printed and sintered silver nanoparticles. ARCSIS Micropackaging Days Thin and Flexible Packaging 2009, Oct 2009, Gardanne, France. <emse-00470613>
  • Pierre-Yves Duvivier, Vincent Mandrillon, Jean-Philippe Polizzi, Karim Inal. Hierarchical image analysis for roughness characterization. 5th International Colloquium Micro-Tribology '09, Sep 2009, Milowka, Poland. <emse-00470605>
  • Pierre-Yves Duvivier, Vincent Mandrillon, Jean-Philippe Polizzi, Karim Inal. Étude de la résistance électrique d'un contact Au /Au en fonction de la force appliquée. Congrès Français de Mécanique CFM'2009, Aug 2009, Marseille, France. pp.858, 2009. <emse-00466713>
  • Renaud Vayrette, Sylvain Blayac, Christian Rivero, Karim Inal. Contraintes résiduelles dans les interconnexions submicroniques. Prise en compte des dimensions des lignes de cuivre par microcapteurs embarqués. Congrès Français de Mécanique CFM'2009, Aug 2009, Marseille, France. pp.1326, 2009. <emse-00466583>
  • Romain Cauchois, Mohamed Saadaoui, Karim Inal, Béatrice Dubois-Bonvalot, J.-C. Fidalgo. Thermal optimization of silver nanoparticles sintering for low resistive printed applications. LAAS-CNRS. MME 09. 20th MicroMechanics Europe Workshop, Sep 2009, Toulouse, France. LAAS-CNRS, pp.D07/ 1-4, 2009. <emse-00466405>
  • Jean-Philippe Mathieu, Karim Inal, Sophie Berveiller, Olivier Diard. Micro-mechanical modeling of brittle fracture of French RPV steel - A comprehensive study of stress triaxiality effect. ASME 2008 Pressure Vessels and Piping Conference, Jul 2008, Chicago, United States. ASME, pp.Volume 6: Materials and Fabrication, Parts A and B, 2012, <10.1115/PVP2008-61334>. <hal-00671909>
  • Sophie Berveiller, Etienne Patoor, Jean-Sébastien Lecomte, Karim Inal, A. Eberhardt. stress determination with Kossel microdiffraction in a scanning electron microscope. 7th European Conference on Residual Stresses (ECRS7, Berlin, Jan 2006, Germany. 2006. <hal-00111936>
  • Raphaël Pesci, Karim Inal, R. Masson. A crystallographic approach of brittle fracture in the 16MND5 bainitic steel. In-situ X-ray diffraction and scanning electron microscope measurements at low temperatures. 9th European Mechanics of Materials Conference/ Euromech Mecamat 2006/ Local approach to fracture, May 2006, Moret-sur-Loing, France. Jacques Besson, Dominique Moinereau, Dirk Steglich, 2006, Euromech Mecamat 2006. <hal-01342979>

Chapitre d'ouvrage1 document

  • Romain Cauchois, Mohamed Saadaoui, Karim Inal. Impression et recuit de nanoparticules métalliques pour l’électronique imprimée. Techniques de l'Ingénieur, Référence RE 222lab et Doc. RE 222, Editions T.I., 27 + 5 p., 2014. <hal-01107859>