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12 résultats
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Using CAD Tool for Substrate Parasitic Modeling in Smart Power TechnologyIEEE Transactions on Circuits and Systems I: Regular Papers, 2016, pp.2323 - 2333. ⟨10.1109/TCSI.2016.2618622⟩
Article dans une revue
hal-01397654v1
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A CAD integrated solution of substrate modeling for industrial IC design2015 20th International Mixed-Signal Testing Workshop (IMSTW), Jun 2015, Paris, France. ⟨10.1109/IMS3TW.2015.7177885⟩
Communication dans un congrès
hal-01230118v1
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Efficient Substrate Noise Coupling Verification and Failure Analysis Methodology for Smart Power ICs in Automotive ApplicationsIEEE Transactions on Power Electronics, 2016, ⟨10.1109/TPEL.2016.2604818⟩
Article dans une revue
hal-01360881v1
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Design of fully integrated resonance switched capacitor converters in FDSOI technology2017 15th IEEE International New Circuits and Systems Conference (NEWCAS), Jun 2017, Strasbourg, France. ⟨10.1109/NEWCAS.2017.8010127⟩
Communication dans un congrès
hal-01887189v1
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An Adaptive Mesh Refinement Strategy of Substrate Modeling for Smart Power ICsIEEE International Symposium on Circuits and Systems (ISCAS 2016), May 2016, Montreal, Canada. pp.2358-2361, ⟨10.1109/ISCAS.2016.7539058⟩
Communication dans un congrès
hal-01360469v1
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Challenges for fully-integrated resonant switched capacitor converters in CMOS technologies2017 24th IEEE International Conference on Electronics, Circuits and Systems (ICECS), Dec 2017, Batumi, Georgia. ⟨10.1109/ICECS.2017.8292101⟩
Communication dans un congrès
hal-01887175v1
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Mixed-Signal PI Controller in Current-Mode DC-DC Buck Converter for Automotive Applications IEEE International Symposium on Circuits and Systems (ISCAS'16), May 2016, Montréal, Canada. pp.1610-1613, ⟨10.1109/ISCAS.2016.7538873⟩
Communication dans un congrès
hal-01325114v1
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Optimization and Co-Simulation of an Implantable Telemetry System by Linking System Models to Nonlinear CircuitsComputational Intelligence in Analog an Mixed-Signal (AMS) and Radio-Frequency (RF) Circuit Design, Springer, pp.83-113, 2015
Chapitre d'ouvrage
hal-01221769v1
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Substrate modeling to improve reliability of high voltage technologies20th International Mixed-Signal Testing Workshop (IMSTW), 2015, Paris, Jun 2015, Paris, France. ⟨10.1109/IMS3TW.2015.7177884⟩
Communication dans un congrès
hal-01228157v1
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AUTOMICS: A novel approach for substrate modeling for Automotive applications18th IEEE European Test Symposium, May 2013, Avignon, France
Communication dans un congrès
hal-01078755v1
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Substrate noise modeling with dedicated CAD framework for smart power ICs2015 IEEE International Symposium on Circuits and Systems (ISCAS), May 2015, Lisbon, Portugal. pp.4, ⟨10.1109/ISCAS.2015.7168943⟩
Communication dans un congrès
hal-01230110v1
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A novel CAD framework for substrate modeling10th Conference on Ph.D Research in Microelectronics and electronics, Jun 2014, Grenoble, France. pp.1-4, ⟨10.1109/PRIME.2014.6872736⟩
Communication dans un congrès
hal-01078767v1
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