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Aida Todri-Sanial

17

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todri
ResearcherId : M-5156-2013
0000-0001-8573-2910
Google Scholar : https://scholar.google.fr/citations?user=-awivq4AAAAJ&hl=en
IdRef : 235598879
ResearcherId : http://www.researcherid.com/rid/M-5156-2013

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184516

	Carbon nanotubes for Interconnects Aida Todri-Sanial , Jean Dijon , Antonio Maffucci Aida Todri-Sanial, Jean Dijon, Antonio Maffuci. Springer International Publishing, 2017, 978-3-319-29744-6 (Print) 978-3-319-29746-0 (Online). ⟨10.1007/978-3-319-29746-0⟩ Ouvrages lirmm-01444977v1

	Investigation of Pt-Salt-Doped-Standalone-Multiwall Carbon Nanotubes for On-Chip Interconnect Applications Jie Liang , Rongmei Chen , Raphaël Ramos , Jaeyoung Lee , Hanako Okuno IEEE Transactions on Electron Devices, 2019, 66 (5), pp.2346-2352. ⟨10.1109/TED.2019.2901658⟩ Article dans une revue lirmm-02082869v1
	Variability Study of MWCNT Local Interconnects Considering Defects and Contact Resistances - Part II: Impact of Charge Transfer Doping Rongmei Chen , Jie Liang , Jaehyun Lee , Vihar P. Georgiev , Raphael Ramos IEEE Transactions on Electron Devices, 2018, 65 (11), pp.4963-4970. ⟨10.1109/TED.2018.2868424⟩ Article dans une revue lirmm-01879940v1
	Atomistic to Circuit-Level Modeling of Doped SWCNT for On-Chip Interconnects Jie Liang , Jaehyun Lee , Salim Berrada , Vihar Georgiev , Reetu Raj Pandey IEEE Transactions on Nanotechnology, 2018, 17 (6), pp.1084-1088. ⟨10.1109/TNANO.2018.2802320⟩ Article dans une revue lirmm-01795792v1
	Variability study of MWCNT local interconnects considering defects and contact resistances - Part I: pristine MWCNT Rongmei Chen , Jie Liang , Jaehyun Lee , Vihar P. Georgiev , Raphael Ramos IEEE Transactions on Electron Devices, 2018, 65 (11), pp.4955-4962. ⟨10.1109/TED.2018.2868421⟩ Article dans une revue lirmm-01879935v1
	Understanding Electromigration in Cu-CNT Composite Interconnects: A Multiscale Electrothermal Simulation Study Jaehyun Lee , Salim Berrada , Fikru Adamu-Lema , Nicole Nagy , Vihar P. Georgiev IEEE Transactions on Electron Devices, 2018, 65 (9), pp.3884-3892. ⟨10.1109/TED.2018.2853550⟩ Article dans une revue lirmm-01867729v1
	A Survey of Carbon Nanotube Interconnects for Energy Efficient Integrated Circuits Aida Todri-Sanial , Raphael Ramos , Hanako Okuno , Jean Dijon , Abitha Dhavamani IEEE Circuits and Systems Magazine -New Series-, 2017, 17 (2), pp.47-62. ⟨10.1109/MCAS.2017.2689538⟩ Article dans une revue lirmm-01795757v1

	Design and Technology-level Optimization Challenges for Carbon Nanotube Circuits Aida Todri-Sanial EDA 2020 - International Workshop on Advanced Electronic Design Automation, Jan 2020, Xidian, China Communication dans un congrès lirmm-02549406v1
	Importance of Interconnects: A Technology-System-Level Design Perspective Jie Liang , Aida Todri-Sanial IEDM 2019 - 65th IEEE International Electron Device Meeting, Dec 2019, San Francisco, United States. pp.23.1.1-23.1.4, ⟨10.1109/IEDM19573.2019.8993558⟩ Communication dans un congrès lirmm-02388007v1
	Challenges and Progress on Carbon Nanotube Integration for BEOL Interconnects Benjamin Uhlig , Abitha Dhavamani , Nicole Nagy , Katharina Lilienthal , R. Liske IITC: International Interconnect Technology Conference, Jun 2018, Santa Clara, United States. pp.16-18, ⟨10.1109/IITC.2018.8430411⟩ Communication dans un congrès lirmm-01880138v1
	Progress on carbon nanotube BEOL interconnects Benjamin Uhlig , Jie Liang , Lee Jaehyun , Raphael Ramos , Abitha Dhavamani DATE 2018 - 21st Design, Automation and Test in Europe Conference and Exhibition, Mar 2018, Dresden, Germany. pp.937-942, ⟨10.23919/DATE.2018.8342144⟩ Communication dans un congrès lirmm-01880198v1
	A physics-based investigation of Pt-salt doped carbon nanotubes for local interconnects Jie Liang , Raphael Ramos , Jean Dijon , H. Okuno , D. Kalita IEDM: International Electron Devices Meeting, Dec 2017, San Francisco, United States. ⟨10.1109/IEDM.2017.8268502⟩ Communication dans un congrès lirmm-01795777v1
	Atomistic to circuit level modeling of defective doped SWCNTs with contacts for on-chip interconnect application Jie Liang , Lee Jaehyun , Salim Berrada , Vihar P. Georgiev , Asenov Asen NMDC: Nanotechnology Materials and Devices Conference, Oct 2017, Singapore, Singapore. pp.66-67, ⟨10.1109/NMDC.2017.8350506⟩ Communication dans un congrès lirmm-01880220v1
	Atoms-to-circuits simulation investigation of CNT interconnects for next generation CMOS technology Jaehyun Lee , Jie Liang , Salvatore Amoroso , Toufik Sadi , Liping Wang SISPAD: Simulation of Semiconductor Processes and Devices, Sep 2017, Kamakura, Japan. pp.153-156, ⟨10.23919/SISPAD.2017.8085287⟩ Communication dans un congrès lirmm-01795803v1
	The impact of vacancy defects on CNT interconnects: From statistical atomistic study to circuit simulations Jaehyun Lee , Salim Berrada , Jie Liang , Toufik Sadi , Vihar Georgiev SISPAD: Simulation of Semiconductor Processes and Devices, Sep 2017, Kamakura, Japan. pp.157-160, ⟨10.23919/SISPAD.2017.8085288⟩ Communication dans un congrès lirmm-01795799v1
	Electrical performance of carbon-based power distribution networks with thermal effects Alessandro Magnani , Massimiliano de Magistris , Salomeh Heidari , Aida Todri-Sanial , Antonio Maffucci SPI: Signal and Power Integrity, May 2017, Baveno, Italy. ⟨10.1109/SaPIW.2017.7944044⟩ Communication dans un congrès lirmm-01795816v1

	Progress on Pt-Salt Doped Carbon Nanotubes for Local Interconnects Jie Liang , Raphael Ramos , Jean Dijon , Hanako Okuno , Dipankar Kalita 12e Colloque National du GDR SoC/SiP, Jun 2018, Paris, France. 2018 Poster de conférence lirmm-02132496v1