Nombre de documents

3

Shuangfeng ZHANG


Communication dans un congrès2 documents

  • Shuangfeng Zhang, Eric Labouré, Denis Labrousse, Stéphane Lefebvre. Thermoelectric Cooling for Bare Dies Power Devices Embedded in PCB Substrates. PCIM, Jun 2018, Nuremberg, Germany. 〈hal-01834171〉
  • Shuangfeng Zhang, Eric Labouré, Denis Labrousse, Stéphane Lefebvre. Inverse Thermal Model of Temperature-to-Power Mapping for eGaN Systems. PCIM, Jun 2018, Nuremberg, Germany. 2018. 〈hal-01834165〉

Autre publication1 document

  • Shuangfeng Zhang, Eric Labouré, Denis Labrousse, Stéphane Lefebvre. Thermal management for GaN power devices mounted on PCB substrates. This paper investigates different thermal management solutions for GaN HEMT mounted on Printed Ci.. 2017, 〈10.1109/IWIPP.2017.7936752〉. 〈hal-01585213〉