Remi Dussart

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	Titanium-based MEMS: Application for a novel implantable feedthrough using TTV (Through Titanium Vias) technologies Bertrand Boutaud , Edouard Laudrel , Marion Woytasik , Elie Lefeuvre , Thomas Tillocher 6th Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum (MiNaPAD 2018), May 2018, Grenoble, France Communication dans un congrès hal-02306370v1