CV Accueil - Archive ouverte HAL

	Optimization of submicron deep trench profiles with the STiGer cryoetching process: reduction of defects Thomas Tillocher , Wassim Kafrouni , Julien Ladroue , Philippe Lefaucheux , Mohamed Boufnichel Journal of Micromechanics and Microengineering, 2011, 21, pp.085005. ⟨10.1088/0960-1317/21/8/085005⟩ Article dans une revue hal-00655002v1

	STiGer process for silicon deep etching: extended scalloping reduction on submicron trenches Wassim Kafrouni , Thomas Tillocher , Julien Ladroue , Philippe Lefaucheux , Mohamed Boufnichel 18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France Communication dans un congrès hal-00696422v1
	Deep etching of bulk titanium by plasma Thomas Tillocher , Julien Ladroue , Wassim Kafrouni , Mukesh Kulsreshath , Philippe Lefaucheux 18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France Communication dans un congrès hal-00696425v1
	Deep silicon etching of 0.8 µm to hundreds of microns wide trenches with the STiGer process Thomas Tillocher , Wassim Kafrouni , Julien Ladroue , Philippe Lefaucheux , Pierre Ranson AVS 58th International Symposium & Exhibition, Oct 2011, Nashville, United States Communication dans un congrès hal-00696428v1
	Optimization of STiGer process for silicon deep etching Thomas Tillocher , Wassim Kafrouni , Vincent Girault , Julien Ladroue , Philippe Lefaucheux 63rd Gaseous Electronics Conference, Oct 2010, Paris, France Communication dans un congrès hal-00696366v1

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