Remi Dussart
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Mitigation of plasma-induced damage in porous low-k dielectrics by cryogenic precursor condensationJournal of Physics D: Applied Physics, 2016, 49 (17), pp.175203. ⟨10.1088/0022-3727/49/17/175203⟩
Article dans une revue
hal-01324407v1
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Low Damage Cryogenic Etching of Porous Organosilicate Low-k Materials Using SF6/O2/SiF4ECS Journal of Solid State Science and Technology, 2013, 2 (6), pp.N131. ⟨10.1149/2.001306jss⟩
Article dans une revue
hal-00831339v1
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Damage Free Cryogenic Etching of a Porous Organosilica Ultralow-k FilmElectrochemical and Solid-State Letters, 2012, 2 (2), pp.N5. ⟨10.1149/2.007302ssl⟩
Article dans une revue
hal-00831289v1
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A novel low temperature etch approach to reduce ULK plasma damagePlasma Etch and Strip in Microtecnology, Apr 2015, Leuven, Belgium
Communication dans un congrès
hal-01151524v1
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Applications of cryogenic plasma etching for microtechnology and advanced CMOS manufacturingPlasma Etch and Strip in Microtechnology, Mar 2013, Louvain, Belgium
Communication dans un congrès
hal-00831344v1
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Damage free cryogenic etching of porous organosilicate low-k films for advanced interconnect applicationAVS 59th International Symposium and Exhibition, Oct 2012, Tampa, United States
Communication dans un congrès
hal-00747749v1
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