Accéder directement au contenu

Pierre-Olivier Bouchard

2
Documents

Présentation

Publications

881779

Packaging induced stress effects investigations on 40nm CMOS technology node: Measurements and optimization of device shifts

 Komi Atchou Ewuame , Pierre-Olivier Bouchard , Vincent Fiori , Sebastien Gallois-Garreignot , Karim Inal
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), Dec 2015, Singapore, Singapore. pp.346-351, ⟨10.1109/EPTC.2015.7412333⟩
Communication dans un congrès hal-01354249v1

CMOS stress sensor for 3D integrated circuits: Thermo-mechanical effects of Through Silicon Via (TSV) on surrounding silicon

 Komi Atchou Ewuame , Vincent Fiori , Karim Inal , Pierre-Olivier Bouchard , Sébastien Gallois-Garreignot
15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, Apr 2014, Ghent, Belgium. 8 p. - ISBN 978-1-4799-4791-1, ⟨10.1109/EuroSimE.2014.6813808⟩
Communication dans un congrès hal-01024448v1