Pierre MONTMITONNET
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Thermo-mechanical analysis of GaAs devices under temperature-humidity-bias testing16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE 2015, Apr 2015, Budapest, Hungary. 8 p. - ISBN 978-1-4799-9949-1 ⟨10.1109/EuroSimE.2015.7103140⟩
Communication dans un congrès
hal-01247921v1
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