Pierre MONTMITONNET
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Micro-Indentation of oxidized low carbon steel to evaluate properties of oxidesIOP Conference Series: Materials Science and Engineering, 2022, 1270 (1), pp.012106. ⟨10.1088/1757-899X/1270/1/012106⟩
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Investigation on the effect of external mechanical stress on the DC characteristics of GaAs microwave devicesMicroelectronics Reliability, 2015, Proceedings of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - Proceedings of ESREF 2015, 55 (9-10), pp.1697-1702. ⟨10.1016/j.microrel.2015.06.033⟩
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Robust design of thermo-mechanical MEMS switch embedded in aluminium BEOL interconnectMicroelectronics Reliability, 2015, Proceedings of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - Proceedings of ESREF 2015, 55 (9-10), pp.1896-1900. ⟨10.1016/j.microrel.2015.06.032⟩
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Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influenceMicroelectronics Reliability, 2015, 55 (8), pp.1205-1213. ⟨10.1016/j.microrel.2015.05.019⟩
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Thermo-mechanical analysis of GaAs devices under temperature-humidity-bias testing16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE 2015, Apr 2015, Budapest, Hungary. 8 p. - ISBN 978-1-4799-9949-1 ⟨10.1109/EuroSimE.2015.7103140⟩
Communication dans un congrès
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Improvement of freestanding CMOS-MEMS through detailed stress analysis in metallic layers15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, Apr 2014, Ghent, Belgium. 6 p. - ISBN 978-1-4799-4791-1, ⟨10.1109/EuroSimE.2014.6813834⟩
Communication dans un congrès
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On the material depletion rate due to electromigration in a copper TSV structure 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW) , IEEE, Oct 2014, S. Lake Tahoe, California, United States. pp.111-114 - ISBN 978-1-4799-7308-8 ⟨10.1109/IIRW.2014.7049523⟩
Communication dans un congrès
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Determination of material properties and failure using in-situ thermo-mechanical probe2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2014, Apr 2014, Cannes, France. pp.Article number 7056700 - ISBN 978-2-35500-028-7, ⟨10.1109/DTIP.2014.7056700⟩
Communication dans un congrès
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First in Operando SEM Observation of Electromigration-Induced Voids in TSV Structures39th International Symposium for Testing and Failure Analysis - ISTFA 2013, Nov 2013, San Jose, California, United States. pp.59-68 - ISBN 978-1-62708-022-4
Communication dans un congrès
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