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Philippe Descamps
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Documents
Identifiants chercheurs
philippe-descamps-
0000-0002-9788-8581
Présentation
**Philippe Descamps** received the Ph. D. degree from the University of Lille, France, in 1992. From 1989 to 1999, He joined the research group Integrated Systems at the Institut d’Electronique, de Microélectronique et de Nanotechnologies (IEMN), Villeneuve d’Ascq, France, where he was involved in microwave research activities mainly guided by the Characterization, Simulation and Design, and by the realization of field-effect devices in centimetres and millimetres waves ranges for automotive applications and telecommunication systems. From 1999 to 2018, he has been a full Professor at the Ecole Nationale Supérieure d’Ingénieurs of Caen (ENSICAEN), France where he currently heads the mixed research Laboratory of Microelectronics and Physics of Semiconductors (LaMIPS). He is mainly involved of high frequencies Characterization, Modelization of Microwave Components and of the design of Integrated Circuits for telecommunication applications. Since 2018, he became Director of Research and Development and Director of IRSEEM Laboratory of the school of Engineering ESIGELEC in Rouen, France.
Publications
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Bonding-Wire-Geometric-Profile-Dependent Model for Mutual Coupling Between Two Bonding Wires on a Glass SubstrateIEEE Transactions on Components Packaging and Manufacturing Technology Part B, 2015, 5 (1), pp.119-127. ⟨10.1109/TCPMT.2014.2366730⟩
Article dans une revue
hal-02190867v1
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Analytical crossing lines modeling2014 20th International Conference on Microwaves, Radar, and Wireless Communications (MIKON), Jun 2014, Gdansk, Poland. pp.1-4, ⟨10.1109/MIKON.2014.6899910⟩
Communication dans un congrès
hal-02439829v1
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Model of mutual coupling between two bonding wires on glass substrate2013 International Semiconductor Conference Dresden - Grenoble (ISCDG), Sep 2013, Dresden, Germany. pp.1-4, ⟨10.1109/ISCDG.2013.6656302⟩
Communication dans un congrès
hal-02437447v1
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