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A NEW METHODOLOGY FOR EXTRACTION OF DYNAMIC COMPACT THERMAL MODELS

 Wasim Habra , Patrick Tounsi , F. Madrid , P. Dupuy , Clément Barbot , et al.
THERMINIC 2007, Sep 2007, Budapest, Hungary. pp.141-144
Communication dans un congrès hal-00202550v1
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New testing approach using near electromagnetic field probing intending to upgrade in-circuit testing of high density PCBAs

 Nabil El-Belghiti , Patrick Tounsi , Alexandre Boyer , Arnaud Viard
27th IEEE North Atlantic Test Workshop, May 2018, Essex, United States. ⟨10.1109/NATW.2018.8388867⟩
Communication dans un congrès hal-01997428v1
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Detecting PCB Assembly defects using infrared thermal signatures

 Nabil El Belghiti Alaoui , Patrick Tounsi , Alexandre Boyer , Arnaud Viard
27th International Conference Mixed Design of Integrated Circuits and Systems (MIXDES2019), Jun 2019, Wroclaw, Poland. ⟨10.23919/MIXDES.2019.8787089⟩
Communication dans un congrès hal-02319460v1
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Implementation of Thermoelectric Generators in Airliners for Powering,Battery-free Wireless Sensor Networks

 Jean-Marie Dilhac , Romain Monthéard , Marise Bafleur , Vincent Boitier , Nicolas Nolhier , et al.
Journal of Electronic Materials, 2014, 43 (6), pp.2444-2451
Article dans une revue hal-00998857v1
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Degradation indicators of power-GaN-HEMT under switching power-cycling

 M A González-Sentís , Patrick Tounsi , A. Bensoussan , A. Dufour
ESREF 2019, Sep 2019, Toulouse, France. ⟨10.1016/j.microrel.2019.113412⟩
Communication dans un congrès hal-02613682v1
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Drift effects and trap analysis of power-GaN-HEMT under switching power cycling

 Manuel A González-Sentís , Patrick Tounsi , Alain Bensoussan , Arnaud Dufour
Science of Electronics, Technologies of Information and Telecommunication, SETIT’18, Dec 2018, Hammamet, Tunisia
Communication dans un congrès hal-02131990v1
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Advanced Compact Thermal Modeling by using VHDL-AMS

 Wasim Habra , Patrick Tounsi , Jean-Marie Dorkel
THERMINIC 2006, Sep 2006, Nice, France. pp.225-228
Communication dans un congrès hal-00171380v1
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New defect detection approach using near electromagnetic field probing of high density PCBAs

 Nabil El Belghiti Alaoui , Alexandre Boyer , Patrick Tounsi , A. Viard
Microelectronics Reliability, 2018, 88-90, pp.288-293. ⟨10.1016/j.microrel.2018.07.090⟩
Article dans une revue hal-01885517v1
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Development of SiC MOSFET electrical model and experimental validation: improvement and reduction of parameter number

 Quang Nguyen , Patrick Tounsi , Jean-Pierre Fradin , Jean-Michel Reynes
26th International Conference "Mixed Design of Integrated Circuits and Systems MIXDES 2019, Lodz University of Technology Department of Microelectronics and Computer Science, Jun 2019, Rzeszów, Poland
Communication dans un congrès hal-03655841v1

Study of CVD diamond films for thermal management in power electronics

 Henri Schneider , Marie-Laure Locatelli , J. Achard , Emmanuel Scheid , Patrick Tounsi , et al.
EPE 2007: 12th European Conference on Power Electronics and Applications, Aalborg, Denmark, 2007, Aalborg, Denmark. pp.1-8
Communication dans un congrès hal-03877112v1
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Investigation of SiC MOSFET channel reverse conduction

 Quang Nguyen , Patrick Tounsi , Jean-Pierre Fradin , Jean-Michel Reynes
13th International Conference on Power Electronics and Drive Systems (PEDS 2019), Jul 2019, Toulouse, France. ⟨10.1109/PEDS44367.2019.8998901⟩
Communication dans un congrès hal-02613785v1
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Compact thermal modelling for fast simulating consequences of pump defect: application to power module with double efficient cooling

 Anais Cassou , Patrick Tounsi , Jean-Pierre Fradin
THERMINIC 2018, Sep 2018, Stockholm, Sweden. pp.1-5, ⟨10.1109/THERMINIC.2018.8593317⟩
Communication dans un congrès hal-02613655v1

Electrothermal Characterization of Double-Sided Cooling Si Power Module

 Sébastien Sanchez , Cong Tu Nguyen , Claudia Cadile , Jean-Pierre Fradin , Patrick Tounsi , et al.
ELECTRIMACS 2019, May 2019, Salerno, Italy. ⟨10.1007/978-3-030-37161-6_5⟩
Communication dans un congrès hal-02613793v1
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Using Compact Thermal Modelling for the investigation of a cooling system dysfunction applied to a power module with double sided cooling

 Anais Cassou , Patrick Tounsi , Jean-Pierre Fradin
MIXDES 2019, Jun 2019, Rzeszow, Poland. ⟨10.23919/MIXDES.2019.8787192⟩
Communication dans un congrès hal-02613604v1

Modélisation avancée de module de puissance

 Patrick Austin , Rodolphe de Maglie , Jean-Louis Sanchez , Jean-Luc Schanen , Patrick Tounsi , et al.
Journées GdR, Oct 2005, Lyon, France
Communication dans un congrès hal-00187678v1
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Investigation on the use of the MOSFET SiC body diode for junction temperature measurement

 Quang Chuc Nguyen , Patrick Tounsi , Jean-Pierre Fradin , Jean-Michel Reynes
IEEE THERMINIC 2020, Fraunhofer Berlin, Sep 2020, Berlin, Germany
Communication dans un congrès hal-03655865v1
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New defect detection approach using near electromagnetic field probing for high density PCBAs New defect detection approach using near electromagnetic field probing of high density PCBAs

 Nabil El Belghiti Alaoui , Patrick Tounsi , Alexandre Boyer , Arnaud Viard
29 th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2018), Oct 2018, Aalborg, Denmark. ⟨10.1016/j.microrel.2018.07.090⟩
Communication dans un congrès hal-02319457v1

In situ characterisation of non linear capacitors

 Lionel Laudebat , Vincent Bley , Thierry Lebey , Henri Schneider , Patrick Tounsi
European Physical Journal: Applied Physics, 2001, 14 (2), pp.107-114. ⟨10.1051/epjap:2001142⟩
Article dans une revue istex hal-02536621v1
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Development of SiC MOSFET Electrical Model and Experimental Validation: Improvement and Reduction of Parameter Number

 Nguyen Quang , Patrick Tounsi , Jean-Pierre Fradin , Jean-Michel Reynes
26th International Conference "Mixed Design of Integrated Circuits and Systems" (MIXDES 2019), Jun 2019, Rzeszów, Poland. pp.298 - 301, ⟨10.23919/MIXDES.2019.8787050⟩
Communication dans un congrès hal-02613777v1
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Upgrading In-Circuit Test of high density PCBAs using electromagnetic measurement and Principal Component Analysis

 Nabil El Belghiti Alaoui , Alexandre Boyer , Patrick Tounsi , Arnaud Viard
Journal of Electronic Testing: : Theory and Applications, 2018, 34 (6), pp.749-762. ⟨10.1007/s10836-018-5763-4⟩
Article dans une revue hal-01944924v1
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Using infrared thermal responses for PCBA production tests: Feasibility study

 Nabil El Belghiti Alaoui , Anais Cassou , Patrick Tounsi , Alexandre Boyer , Arnaud Viard
30 th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2019), Sep 2019, Toulouse, France
Communication dans un congrès hal-02319468v1
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Extraction of compact transient thermal models for a global optimization of a power system based on SiC MOSFETs switches

 Anaïs Cassou , Quang Chuc Nguyen , Patrick Tounsi , Jean-Pierre Fradin , Marc Budinger , et al.
26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2020), Sep 2020, Berlin, Germany
Communication dans un congrès hal-03655834v1
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TRANSIENT COMPACT MODELING FOR MULTI CHIPS COMPONENTS

 Wasim Habra , Patrick Tounsi , Jean-Marie Dorkel
THERMINIC 2005, Sep 2005, Belgirate, Lago Maggiore, Italy. pp.129-134
Communication dans un congrès hal-00189464v1
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