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Patrick Girard
9
Documents
Identifiants chercheurs
- patrick-girard-lirmm
- 0000-0003-0722-8772
Présentation
Publications
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All-Spin PUF: An Area Efficient and reliable PUF Design with Signature Improvement for Spin-Transfer Torque Magnetic Cell-Based All-Spin CircuitsACM Journal on Emerging Technologies in Computing Systems, 2022, 18 (4), pp.1-20/71. ⟨10.1145/3517811⟩
Article dans une revue
lirmm-03768916v1
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A Survey of Test and Reliability Solutions for Magnetic Random Access MemoriesProceedings of the IEEE, 2021, 109 (2), pp.149-169. ⟨10.1109/JPROC.2020.3029600⟩
Article dans une revue
lirmm-03031646v1
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DOVA PRO: A Dynamic Overwriting Voltage Adjustment Technique for STT-MRAM L1 Cache Considering Dielectric Breakdown EffectIEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2021, 29 (7), pp.1325-1334. ⟨10.1109/TVLSI.2021.3073415⟩
Article dans une revue
lirmm-03376949v1
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DOVA: A Dynamic Overwriting Voltage Adjustment for STT-RAM L1 CacheISQED 2020 - 21st International Symposium on Quality Electronic Design, Mar 2020, Santa Clara, CA, United States. pp.408-414, ⟨10.1109/ISQED48828.2020.9137020⟩
Communication dans un congrès
lirmm-03035589v1
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Power supply noise-aware workload assignments for homogeneous 3D MPSoCs with thermal considerationASP-DAC: Asia and South Pacific Design Automation Conference, Jan 2014, Singapore, Singapore. pp.544-549, ⟨10.1109/ASPDAC.2014.6742948⟩
Communication dans un congrès
lirmm-01248596v1
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Mitigate TSV Electromigration for 3D ICs - From the Architecture PerspectiveInternational Symposium on VLSI, Natale, Brazil. pp.6
Communication dans un congrès
lirmm-00839052v1
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Performance Characterization of TAS-MRAM Architectures in Presence of Capacitive DefectsVALID: Advances in System Testing and Validation Lifecycle, Oct 2013, Venice, Italy. pp.39-44
Communication dans un congrès
lirmm-01433308v1
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A novel method to mitigate TSV electromigration for 3D ICsISVLSI: IEEE Computer Society Annual Symposium on VLSI, Aug 2013, Natal, Brazil. pp.121-126, ⟨10.1109/ISVLSI.2013.6654633⟩
Communication dans un congrès
lirmm-01248617v1
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Electromigration Alleviation Techniques for 3D Integrated CircuitsChao Wang. High Performance Computing for Big Data: Methodologies and Applications, CRC Press, pp.37-58, 2017, 9781498783996
Chapitre d'ouvrage
lirmm-01800220v1
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