Pascal Nouet
244
Documents
Publications
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On the scaling of EMFI probesFDTC 2021 - Workshop on Fault Detection and Tolerance in Cryptography, Sep 2021, Milan, Italy. pp.67-73, ⟨10.1109/FDTC53659.2021.00019⟩
Communication dans un congrès
lirmm-03476820v1
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Exploring flexible and 3D printing technologies for the design of high spatial resolution EM probesNEWCAS 2021 - 19th IEEE International New Circuits and Systems Conference, Jun 2021, Toulon, France. pp.1-4, ⟨10.1109/NEWCAS50681.2021.9462763⟩
Communication dans un congrès
lirmm-03278789v1
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Optimal Detector Position and Structure for a New 3-axis CMOS Thermal MicroaccelerometerSSD 2020 - 17th International Multi-Conference on Systems, Signals and Devices, Jul 2020, Monastir, Tunisia. pp.1144-1149, ⟨10.1109/SSD49366.2020.9364127⟩
Communication dans un congrès
lirmm-03528836v1
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Low-voltage Low-power current-mode square-root circuit based on Quasi-floating gate techniqueSSD 2020 - 17th International Multi-Conference on Systems, Signals and Devices, Jul 2020, Monastir, Tunisia. pp.761-764, ⟨10.1109/SSD49366.2020.9364230⟩
Communication dans un congrès
lirmm-03528840v1
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New High Efficiency Heater Design for a 3-axis CMOS MEMS Convective AccelerometerDTIP 2020 - 22nd Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS, Jun 2020, Lyon (Virtual), France. pp.1-6, ⟨10.1109/DTIP51112.2020.9139152⟩
Communication dans un congrès
lirmm-02942550v1
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Dynamic weighted average in multisensory systemsDTIP 2019 - 21st Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS, May 2019, Paris, France. pp.1-4, ⟨10.1109/DTIP.2019.8752804⟩
Communication dans un congrès
lirmm-02354061v1
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Mechanical Solution for Out-of-Plane Sensitivity Enhancement of CMOS MEMS Convective AccelerometersICECS 2018 - 25th International Conference on Electronics, Circuits and Systems, Dec 2018, Bordeaux, France. pp.301-304, ⟨10.1109/ICECS.2018.8617928⟩
Communication dans un congrès
lirmm-02354212v1
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A generic model for sensor simulation at system levelDTIP 2018 - 20th Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS, May 2018, Roma, Italy. ⟨10.1109/DTIP.2018.8394198⟩
Communication dans un congrès
lirmm-01827709v1
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From spintronic devices to hybrid CMOS/magnetic system on chipIFIP International Conference on Very Large Scale Integration (VLSI-SoC 2018), Oct 2018, Verona, Italy. pp.188-191, ⟨10.1109/VLSI-SoC.2018.8644875⟩
Communication dans un congrès
hal-01982791v1
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Using multifunctional standardized stack as universal spintronic technology for IoTDATE 2018 - 21st Design, Automation and Test in Europe Conference and Exhibition, Mar 2018, Dresden, Germany. pp.931-936, ⟨10.23919/DATE.2018.8342143⟩
Communication dans un congrès
hal-01864468v1
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Post-fabrication soft trimming of resistive sensorsDTIP 2018 - 20th Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS, May 2018, Roma, Italy. ⟨10.1109/DTIP.2018.8394221⟩
Communication dans un congrès
lirmm-01827725v1
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Synchronised 4-Phase Resonant Power Clock Supply for Energy Efficient Adiabatic LogicICRC: International Conference on Rebooting Computing, Nov 2017, Washington, DC, United States. ⟨10.1109/ICRC.2017.8123661⟩
Communication dans un congrès
lirmm-01768831v1
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GREAT: HeteroGeneous IntegRated Magnetic tEchnology Using Multifunctional Standardized sTackISVLSI 2017 - International Symposium on Very Large Scale Integration, Jul 2017, Bochum, Germany. pp.344-349, ⟨10.1109/ISVLSI.2017.67⟩
Communication dans un congrès
lirmm-01708599v1
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High Temperature, Time Domain Sensor Interface based on Phase ShifterHiTen: High Temperature Electronics Network, Jul 2017, Cambridge, United Kingdom. pp.103-108, ⟨10.4071/2380-4491.2017.HiTEN.103⟩
Communication dans un congrès
lirmm-01684794v1
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New time-domain conditioning circuit for resistive sensor: Behavioral modelling for simulation and optimizationMIXDES: Mixed Design of Integrated Circuits and Systems, Jun 2017, Bydgoszcz, Poland. pp.408-411, ⟨10.23919/MIXDES.2017.8005242⟩
Communication dans un congrès
lirmm-01687778v1
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A high temperature, 12-bit-time-domain sensor interface based on injection locked oscillatorISCAS: International Symposium on Circuits and Systems, May 2017, Baltimore, United States. ⟨10.1109/ISCAS.2017.8050504⟩
Communication dans un congrès
lirmm-01687348v1
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Combo of innovative educational approaches to teach industrial test to undergraduate studentsEDUCON: Global Engineering Education Conference, Apr 2017, Athens, Greece. pp.56-64, ⟨10.1109/EDUCON.2017.7942824⟩
Communication dans un congrès
lirmm-01768840v1
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Highly linear voltage-to-time converter based on injection locked relaxation oscillatorsSSD: Systems, Signals and Devices, Mar 2017, Marrakech, Morocco. ⟨10.1109/SSD.2017.8167011⟩
Communication dans un congrès
lirmm-01712478v1
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Problem-Based Learning Approach to Teach Printed Circuit Boards TestICL: Interactive Collaborative Learning, Sep 2016, Belfast, United Kingdom. pp.45-57, ⟨10.1007/978-3-319-50337-0_4⟩
Communication dans un congrès
lirmm-01385626v1
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Physical description and analysis of doped carbon nanotube interconnectsPATMOS: Power And Timing Modeling, Optimization and Simulation, Sep 2016, Brême, Germany. pp.250-255, ⟨10.1109/PATMOS.2016.7833695⟩
Communication dans un congrès
lirmm-01457338v1
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Investigation of the power-clock network impact on adiabatic logicSPI: Signal and Power Integrity, May 2016, Turin, Italy. ⟨10.1109/SaPIW.2016.7496270⟩
Communication dans un congrès
hal-01348476v1
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Industrial Test Project Oriented EducationEDUCON: Global Engineering Education Conference, Apr 2016, Abu Dhabi, United Arab Emirates. pp.119-124, ⟨10.1109/EDUCON.2016.7474541⟩
Communication dans un congrès
lirmm-01256447v1
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Per Peers Learning Education Approach to Teach Industrial Test to Undergraduate StudentsEWME: European Workshop on Microelectronics Education, May 2016, Southampton, United Kingdom. ⟨10.1109/EWME.2016.7496485⟩
Communication dans un congrès
lirmm-01385619v1
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An ultra-low-power front-end for differential capacitive sensorsDTIP: Design, Test, Integration and Packaging, Apr 2015, Montpellier, France. ⟨10.1109/DTIP.2015.7160964⟩
Communication dans un congrès
lirmm-01235453v1
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On Analysis of On-chip DC-DC Converters for Power Delivery NetworksISVLSI: International Symposium on Very Large Scale Integration, Jul 2015, Montpellier, France. pp.557-560, ⟨10.1109/ISVLSI.2015.96⟩
Communication dans un congrès
lirmm-01446182v1
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Une pedagogie par projet pour des etudiants acteurs et auteurs de leur apprentissageQPES: Questions de Pédagogie dans l’Enseignement Supérieur, Jun 2015, Brest, France
Communication dans un congrès
lirmm-01256445v1
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MEMS based Inertial Measurement UnitsDTIP: Design, Test, Integration and Packaging, Apr 2015, Montpellier, France. ⟨10.1109/DTIP.2015.7160966⟩
Communication dans un congrès
lirmm-01235526v1
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Monitoring of particle deposition in cleanrooms: State-of-the-artDTIP: Design, Test, Integration and Packaging, Apr 2014, Cannes, France. pp.368-371, ⟨10.1109/DTIP.2014.7056699⟩
Communication dans un congrès
lirmm-01166805v1
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Une expérience de pédagogie par projet pour la formation au test industrielCETSIS: Colloque sur l'Enseignement des Technologies et des Sciences de l'Information et des Systèmes, Oct 2014, Besançon, France
Communication dans un congrès
lirmm-01256441v1
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Direct digital synthesiser (DDS) design parameters optimisation for vibrating MEMS sensors: Optimisation of phase accumulator, Look-Up Table (LUT) and Digital to Analog Converter (DAC) sizesDTIP: Design, Test, Integration and Packaging, Apr 2014, Cannes, France. ⟨10.1109/DTIP.2014.7056692⟩
Communication dans un congrès
lirmm-01166917v1
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CMOS implementation of a 3-axis thermal convective accelerometerIEEE SENSORS, Nov 2014, Valencia, Spain. pp.1471-1474, ⟨10.1109/ICSENS.2014.6985292⟩
Communication dans un congrès
lirmm-01166836v1
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Self-test and self-calibration of a MEMS convective accelerometerDTIP: Design, Test, Integration & Packaging of MEMS/MOEMS, Apr 2013, Barcelona, Spain. pp.239-242
Communication dans un congrès
lirmm-00814231v1
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Design of a Monolithic 3-axis Thermal Convective AccelerometerDTIP: Design, Test, Integration and Packaging, Apr 2013, Barcelona, Spain. pp.235-238
Communication dans un congrès
lirmm-00814222v1
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Testabilité d'un circuit intégré mixte dédié à la mesure d'un champ magnétique12èmes Journées Pédagogiques du CNFM (JPCNFM 2012), Nov 2012, Saint Malo, France. pp. 45-50
Communication dans un congrès
hal-00769886v1
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Study of a high-resolution and low-power CMOS temperature sensorNEWCAS: International New Circuits and Systems Conference, Jun 2012, Montreal, Canada. pp.205-208, ⟨10.1109/NEWCAS.2012.6328992⟩
Communication dans un congrès
lirmm-00814184v1
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Efficiency modeling of a CMOS MEMS convective accelerometerDTIS: Design and Technology of Integrated Systems in Nanoscale Era, May 2012, Tunis, Tunisia. ⟨10.1109/DTIS.2012.6232985⟩
Communication dans un congrès
lirmm-00814162v1
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Design-for-manufacturability of MEMS convective accelerometers through adaptive electrical calibration strategyLATW: Latin American Test Workshop, Apr 2012, Quito, Ecuador. ⟨10.1109/LATW.2012.6261237⟩
Communication dans un congrès
lirmm-00803451v1
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De l'étude de la testabilité d'un circuit logique à sa vérification sur testeur industriel : Une expérience pédagogique sur les approches de test structurel et fonctionnel12èmes Journées Pédagogiques du CNFM (JPCNFM 2012), Nov 2012, Saint Malo, France. pp.39-44
Communication dans un congrès
hal-00769876v1
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Modeling and simulation of CMOS integrated MEMS: application to low-cost sensorsSSDM'2012: International Conference on Solid State Devices and Materials, Sep 2012, Kyoto, Japan. pp.1117-1119
Communication dans un congrès
lirmm-00814386v1
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Accurate Frequency Counting Architecture for Vibrating Accelerometers on FPGADCIS 2012 - 27th Conference on Design of Circuits and Integrated Systems, Nov 2012, Avignon, France. pp.218-222
Communication dans un congrès
lirmm-00814198v1
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A MEMS Convective Accelerometer Equipped with On-Chip Facilities for Sensitivity Electrical CalibrationIMS3TW'11: IEEE International Mixed-Signals, Sensors and Systems Test Workshop, United States. pp.82-87, ⟨10.1109/IMS3TW.2011.21⟩
Communication dans un congrès
lirmm-00702759v1
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Investigation on the Effect of Geometrical Dimensions on the Conductive Behaviour of a MEMS Convective AccelerometerDTIP'11: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Aix-en-Provence, France. pp.14-17
Communication dans un congrès
lirmm-00632610v1
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A Tracking Converter for Resistive Sensors Based on a Feedback Active BridgeIEEE International Conference NEWCAS 2011, Jun 2011, France. pp.458-461, ⟨10.1109/NEWCAS.2011.5981269⟩
Communication dans un congrès
lirmm-00743354v1
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Test and Calibration of MEMS Convective Accelerometers with a Fully Electrical SetupLATW: Latin American Test Workshop, Mar 2011, Porto de Galinhas, Brazil. ⟨10.1109/LATW.2011.5985907⟩
Communication dans un congrès
lirmm-00702769v1
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A Novel Integrated Solution for the Control and Diagnosis of Electrostatic MEMS SwitchesDTIP'11: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Aix-en-Provence, France. pp.315-319
Communication dans un congrès
lirmm-00632583v1
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A Micro-Power High-Resolution Sigma-Delta CMOS Temperature SensorIEEE Sensors 2011, Limerik, Ireland. pp.1530-1533
Communication dans un congrès
lirmm-00651052v1
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An Ultra Low Power Temperature Sensor for Smart Packaging MonitoringDTIP'11: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Aix-en-Provence, France. pp.320-323
Communication dans un congrès
lirmm-00632577v1
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An Electrical Test Method for MEMS Convective Accelerometers: Development and EvaluationDATE: Design, Automation and Test in Europe, Mar 2011, Grenoble, France. ⟨10.1109/DATE.2011.5763137⟩
Communication dans un congrès
lirmm-00702754v1
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Smart Drivers for Online Diagnosis of Electrostatic MEMS ActuatorsIMS3TW'10: 16th IEEE International Mixed-Signals, Sensors and Systems Test Workshop, La Grande Motte, Montpellier, France. pp.N/A
Communication dans un congrès
lirmm-00494515v1
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Modeling the Influence of Etching Defects on the Sensitivity of MEMS Convective AccelerometersIMS3TW'10: 16th IEEE International Mixed-Signals, Sensors and Systems Test Workshop, La Grande Motte, Montpellier, France. pp.N/A
Communication dans un congrès
lirmm-00494555v1
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A Study of Package Effects on the Behavior of MEMS Convective AccelerometersDTIP'10: Design, Test, Integration and Packaging of MEMS/MOEMS, Seville, Spain. pp.6-9
Communication dans un congrès
lirmm-00489026v1
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An Optimized Electronic Architecture for Resistive SensorsDTIP'10: Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, Seville, Spain. pp.372-375
Communication dans un congrès
lirmm-00547712v1
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Nonlinear Behaviour of a Micromachined SOI Device for Energy Harvesting ApplicationDTIP'10: Design, Test, Integration and Packaging of MEMS/MOEMS, May 2010, Seville, Spain. pp.263-265
Communication dans un congrès
lirmm-00489036v1
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A CMOS-MEMS Inertial Measurement UnitIEEE SENSORS, Nov 2010, Waikoloa, Hawaii, United States. pp.1033-1036
Communication dans un congrès
lirmm-00547694v1
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Projet pédagogique Master Micro-Nano Électronique de Strasbourg ¬ CRTC: Testabilité numérique-analogique sur circuit intégré mixte dédié11èmes Journées Pédagogiques du CNFM (JPCNFM 2010), Nov 2010, Sainr-Malo, France. Actes pp. 7-12
Communication dans un congrès
hal-00597329v1
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A Low Power Interface Circuit for Resistive Sensors with Digital Offset CompensationISCAS'10: IEEE International Symposium on Circuits and Systems, Paris, France. pp.3092-3095
Communication dans un congrès
lirmm-00498468v1
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Design of a Smart CMOS High-Voltage Driver for Electrostatic MEMS SwitchesDTIP'10: Design, Test, Integration and Packaging of MEMS/MOEMS, Seville, Spain. pp.44-47
Communication dans un congrès
lirmm-00489031v1
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Experiments on the Analysis of Phase/Frequency-Modulated RF Signals Using Digital Tester ChannelsLATW'10: 11th Latin-American Test Workshop, Punta del Este, Uruguay. pp.N/A
Communication dans un congrès
lirmm-00473524v1
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Mécanismes non linéaires dans des dispositifs MEMS pour la récupération d'énergieJournées Nationales 2009 du GDR Micro- et Nano-Systèmes, France
Communication dans un congrès
lirmm-00436714v1
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Interfaces pour microsystèmes magnétiquesJournées Nationales de la Section Electronique du Club EEA "Interfaces Capteurs : Vers les Micro-Nanosystèmes », France
Communication dans un congrès
lirmm-00406816v1
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Challenges in Manufacturing Test of Micro and Nano-SystemsWorkshop on Design for Reliability and Manufacturability in MNT, France
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lirmm-00406837v1
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An Innovative, Offset Imune, Conditionning and Read-out Circuitry for Resistive MEMS SensorsJoint Conference IEEE NEWCAS - TAISA'09, Toulouse, France, pp.4
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lirmm-00406936v1
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Méthodes alternatives pour le test de MEMSJournées Nationales du GDR Micro et Nano Systèmes, France
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lirmm-00406946v1
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Investigations on Electrical-only Test Setup for MEMS Convective AccelerometerICSCS: International Conference on Signals, Circuits and Systems, Nov 2009, Medenine, Tunisia. ⟨10.1109/ICSCS.2009.5412624⟩
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lirmm-00436265v1
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A Wide Bandwidth, Wide Dynamic Range Thermal Architecture for Convective AccelerometersIEEE Sensors 2009 Conference, Oct 2009, Nouvelle Zélande, pp.N/A
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lirmm-00406935v1
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An Efficient Low Power Interface Circuit for Resistive MEMs SensorFTFC'09: 8èmes Journées Faible Tension Faible Consommation, Neufchatel, Suisse, pp.3
Communication dans un congrès
lirmm-00406942v1
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Challenges in Manufacturing Test of Micro and Nano-SystemsThe Innovative Manufacturing Research Conference, Scottish Manufacturing Institute, France
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lirmm-00406781v1
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The Active Bridge: an Alternative to the Wheatstone Bridge for Efficient Conditioning of Resistive MEMS SensorsDTIP 2009 - Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, Apr 2009, Rome, Italy. pp.265-268
Communication dans un congrès
lirmm-00373800v1
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A Novel Low Power Interface for Resistive MEMS SensorsSCS: Signals, Circuits and Systems, Nov 2009, Medenine, Tunisia. ⟨10.1109/ICSCS.2009.5412550⟩
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lirmm-00436253v1
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Exploiting Zero-Crossing for the Analysis of FM Modulated Analog/RF Signals using Digital ATEATS: Asian Test Symposium, 2009, Taichung, Taiwan. pp.261-266, ⟨10.1109/ATS.2009.56⟩
Communication dans un congrès
lirmm-00436384v1
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Read-Out Circuit in RT-FluxgateISCAS'06: IEEE International Symposium on Circuits and Systems, pp.5910-5913
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lirmm-00406820v1
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A MEMS Multi-Sensor System for Attitude DeterminationDTIP'09: Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, Apr 2009, pp.261-264
Communication dans un congrès
lirmm-00373753v1
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A MEMS-Based Multi-Sensor Platform for Consumer ApplicationsPRIME'09: Research in Microelectronics and Electronics, Jul 2009, Cork, Ireland. pp.320-323
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lirmm-00423604v1
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Design for Manufacturing of MNT-based Systems: A Test CaseJournées Nationales du GDR Micro et Nano-Systèmes, France
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lirmm-00406847v1
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Design for Test of MNT-Based Systems: Alternative Test Solutions for Reduced Test CostsMEMUNITY (The MEMS Test Community) Workshop, France
Communication dans un congrès
lirmm-00406907v1
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Linearity optimization using dithering in a 1st order thermal modulatorJoint Conference IEEE NEWCAS - TAISA'09, Toulouse, France, pp.4
Communication dans un congrès
lirmm-00406937v1
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Design for Manufacturing of MNT-based Systems: a test caseJournées nationales du GDR Micro et Nano Systèmes, Lille, France
Communication dans un congrès
lirmm-00406951v1
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A Method for Electrical Calibration of MEMS Accelerometers Through Multivariate RegressionIMS3TW'09: IEEE 15th Mixed-Signals, Sensors and Systems Test Workshop, Jun 2009, pp.N/A
Communication dans un congrès
lirmm-00399110v1
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Silicon on Insulator Temperature and Pressure Sensor for MEMS Smart PackagingProceedings of the Eurosensors XXIII Conference, France. pp.782-785
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lirmm-00436120v1
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Challenges in MEMS Manufacture Testing and Embedded Test SolutionsNTC (Northern Test Center) Remote and Embedded Testing Seminar, Finland
Communication dans un congrès
lirmm-00406914v1
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An Approach to Integrate MEMS into High-Level System design FlowsJoint conference IEEE NEWCAS - TAISA'08, Jun 2008, Montreal, Canada. pp.273-276
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lirmm-00333697v1
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Evaluation of a Fully Electrical Test and Calibration Method for MEMS Capacitive AccelerometersIMS3TW'08: 14th IEEE International Mixed-Signals, Sensor, and Systems Test Workshop, Jun 2008, Vancouver, Canada, pp.6, ⟨10.1109/IMS3TW.2008.4581616⟩
Communication dans un congrès
lirmm-00337875v1
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Transit Time Extraction Method for ESD Protection Diodes ModelIEW'08: International ESD Workshop, Port d'Albret, France
Communication dans un congrès
lirmm-00337884v1
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A Closed-Loop Architecture with Digital Output for Convective AccelerometersISVLSI'08: IEEE Computer Society Annual Symposium on VLSI, Apr 2008, Montpellier, France, pp.51-56
Communication dans un congrès
lirmm-00280803v1
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Use of a Statistical Approach for Efficient Implementation of Oscillation-Based Test StrategyIMSTW'03: 9th IEEE International Mixed-Signal Testing Workshop, Sevilla (Spain), France. pp. 99-103
Communication dans un congrès
lirmm-00269582v1
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Conception de MEMS : de l'idée à l'integration SoC/SiPGDR SoC-SiP: System-On-Chip & Sytem-In-Package, Jun 2008, Paris, France
Communication dans un congrès
lirmm-00361232v1
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Design of an IEEE 1149.4 Test Chip with Extended ABM FunctionalityIMSTW'02: 8th IEEE International Mixed-Signal Testing Workshop, Montreux (Suisse), France. pp. 153-159
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lirmm-00269340v1
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Protection contre les ESD : Caractérisation et Modélisation de Thyristors ParasitesEOS/ESD/EMI Workshop, Toulouse (France), France. pp.P nd
Communication dans un congrès
lirmm-00269343v1
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Micromachined CMOS Magnetic Field Sensors with Low-Noise Signal ConditioningMEMS'02: IEEE International Conference on Micro Electro Mechanical Systems, Las Vegas, Nevada, USA, pp.256-259
Communication dans un congrès
lirmm-00268486v1
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Towards New Low-Cost Multi-Sensor SystemsEUROSENSORS, Sep 2008, Desden, Germany. pp.549-552
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lirmm-00325075v1
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A Novel SCR-Based Protection Structure Against ESD with Efficient Multi-Finger TriggeringESSDERC'03: 3rd European Solid-State Device Research Conference, Estoril (Portugal), pp. 207-210
Communication dans un congrès
lirmm-00269605v1
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Evaluation of the Oscillation-Based Test Methodology for Micro-Electro-Mechanical SystemsVTS'02: 20th IEEE VLSI Test Symposium, Monterey, CA, USA, pp.439-444
Communication dans un congrès
lirmm-00268484v1
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Study of First-Order Thermal SIGMA-DELTA Architecture for Convective AccelerometersDTIP: Design, Test, Integration and Packaging of MEMS/MOEMS, Apr 2008, Nice, France. pp.100-104, ⟨10.1109/DTIP.2008.4752961⟩
Communication dans un congrès
lirmm-00333632v1
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STMSCR: A New Multi-Finger SCR-Based Protection Structure Against ESDEOS/ESD Symposium, Las Vegas (USA), pp. 223-241
Communication dans un congrès
lirmm-00269603v1
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A Novel Method for Test and Calibration of Capacitive Accelerometers with a Fully Electrical SetupDDECS 2008 - 11th IEEE Workshop on Design and Diagnostics of Electronic Circuits and Systems, Apr 2008, Bratislava, Slovakia. ⟨10.1109/DDECS.2008.4538807⟩
Communication dans un congrès
lirmm-00337873v1
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Analytical and Finite-Element Modeling of a Localized-Mass SensorSensors, Oct 2008, Lecce, Italy. pp.367-370, ⟨10.1109/ICSENS.2008.4716457⟩
Communication dans un congrès
lirmm-00363479v1
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A CMOS Multi-Sensor System for 3D Orientation DeterminationISVLSI'08: IEEE Computer Society Annual Symposium on VLSI, Apr 2008, Montpellier, France, pp.57-62
Communication dans un congrès
lirmm-00280806v1
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A Physics-Based Compact Model for ESD Protection Diodes under Very Fast Transients30th Annual EOS/ESD Symposium, Sep 2008, Tuscon, Arizona, USA, pp.9
Communication dans un congrès
lirmm-00337880v1
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Caractérisation et Modélisation de Thyristors Parasites en Technologie CMOS Fortement SubmicroniqueColloque du GDR CAO de Circuits et Systèmes Intégrés, Paris (France), France. pp. 137-140
Communication dans un congrès
lirmm-00269319v1
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Conception et Test d'une Micro-Boussole Electromécanique IntégréeColloque du GDR CAO de Circuits et Systèmes Intégrés, Paris (France), France. pp. 97-100
Communication dans un congrès
lirmm-00269324v1
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STUDY OF FIRST-ORDER THERMAL SIGMA-DELTA ARCHITECTURE FOR CONVECTIVE ACCELEROMETERSDTIP 2008, Apr 2008, Nice, France. pp.100-104
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hal-00277687v1
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Rejection of Power Supply Noise in Wheatstone Bridges: Application to Piezoresistive MEMSDTIP 2008 - 10th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Apr 2008, Nice, France. pp.96-99, ⟨10.1109/DTIP.2008.4752960⟩
Communication dans un congrès
hal-00277686v1
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The Active Bridge: an Alternative to the Wheatstone BridgeJournées Nationales du GDR MNS, Dec 2008, France
Communication dans un congrès
lirmm-00363892v1
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Réjection du bruit d'alimentation du pont de Wheatstone : application aux MEMS piézorésistifsTAISA'07 : 8ème colloque sur le Traitement Analogique de l'Information, du Signal et ses Applications, Oct 2007, Lyon, France. Session 4A : Capteurs
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lirmm-00202769v1
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Conception de Microsystèmes Monolithiques Testables et Robustes aux Variations de ProcessEcole d'hiver Francophone sur les Technologies de Conception des Systèmes Embarqués Hétérogènes (FETCH 2007), 2007, Grenoble, France
Communication dans un congrès
lirmm-00406918v1
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A Fault-Tolerant MEF Peptide Synthesizer using Control and Direct Sensing Electrodes Employing Current and Impedance TestsIMSTW'07: International Mixed-Signals Testing Workshop and 3rd International GHz/Gbps Test Workshop, Jun 2007, pp.176-181
Communication dans un congrès
lirmm-00161699v1
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Design and Characterization of a Bulk-Acoustic-Resonator (FBAR)MEMSWAVE'07: 8th International Symposium on RF MEMS and RF Microsystems, Jun 2007, Barcelone, Spain
Communication dans un congrès
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A Digitally Testable Capacitance-Insensitive Mixed-Signal FilterETS: European Test Symposium, May 2007, Freiburg, Germany. pp.21-26, ⟨10.1109/ETS.2007.6⟩
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lirmm-00158154v1
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Instantaneous de-embedding of the on-wafer Equivalent-Circuit Parameters of Acoustic Resonator (FBAR) for Integrated Circuit ApplicationsSBCCI: Symposium on Integrated Circuits and Systems Design, Sep 2007, Copacabana, Rio de Janeiro, Brazil. pp.212-217, ⟨10.1145/1284480.1284539⟩
Communication dans un congrès
lirmm-00203350v1
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A Comparative Study of Conditioning Architectures for Convective Accelerometers6th IEEE Conference on SENSORS 2007, Oct 2007, pp.107-110
Communication dans un congrès
lirmm-00194571v1
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Characterization of the Transient Behavior of Gated/STI Diodes and their Associated BJT in the CDM Time DomainEOS/ESD'07: 29th Electrical Overstress/Electrostatic Discharge Symposium, Sep 2007, Anaheim, CA, USA, pp.3A.2_1- 3A.2_10, ⟨10.1109/EOSESD.2007.4401748⟩
Communication dans un congrès
lirmm-00199232v1
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Automated On-Wafer Characterization in Micro-Machined Resonators: Towards an Integrated Test Vehicle for Bulk Acoustic Wave Resonators (FBAR)ICMTS'07: IEEE International Conference on Microelectronic Test Structures, Mar 2007, Tokyo, Japan, pp.157-161
Communication dans un congrès
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On the Use of LVTPNP in ESD Protection StructuresIEW'07: International Electrostatic Discharge Workshop, May 2007, Lake Tahoe, CA, United States
Communication dans un congrès
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Accéléromètre convectif CMOS en boucle ferméeTAISA'2007 : 8ème colloque sur le Traitement Analogique de l'Information, du Signal et ses Applications, pp.107-110
Communication dans un congrès
lirmm-00181093v1
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Modeling of a CMOS Convective Accelerometer for HDL IntegrationESSDERC'06: 36th European Solid-State Device Research Conference - ESSCIRC'06: 32nd European Solid-State Circuits Conference, Sep 2006, Montreux (Switzerland), pp.134-137
Communication dans un congrès
lirmm-00102127v1
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InP HBT XOR and Phase-Detector for 40Gbit/s Clock and Data Recovery (CDR)MIKON: Microwaves, Radar & Wireless Communications, May 2006, Paris, France. pp.1115-1118, ⟨10.1109/MIKON.2006.4345382⟩
Communication dans un congrès
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A simulation tool for CDM stress evaluation at circuit levelEOS/ESD/EMI Workshop, May 2006, Toulouse, France. pp.89-92
Communication dans un congrès
lirmm-00112986v1
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Challenges in Manufacturing Test of MNT-based SystemsIMSTW'06: 12th International Mixed Signal Testing Workshop, Jun 2006
Communication dans un congrès
lirmm-00128280v1
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The future of Embedded Test within the Design for Micro & Nano Manufacture NoEWorkshop on Design for Reliability and Manufacturability in MNT, Apr 2006, Stresa, Lago Maggiore, Italy
Communication dans un congrès
lirmm-00406909v1
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HDL Simulation of a Thermal Accelerometer for System DesignXX EUROSENSORS, Sep 2006, Göteborg (Sweden)
Communication dans un congrès
lirmm-00102170v1
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Partially Depleted SOI Body-Contacted MOSFET-Triggered Silicon Controlled Rectifier for ESD ProtectionEOS/ESD Symposium, Sep 2006, Tucson (USA), pp.6
Communication dans un congrès
lirmm-00112952v1
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Electro-thermal short pulsed simulation for SOI technologyESREF: European Symposium on Reliability of Electron devices, Failure physics and analysis, Oct 2006, Wuppertal, Germany
Communication dans un congrès
lirmm-00112981v1
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On the Testing of the Electronic Conditioning Chain of a CMOS MEMS Based Magnetic Field SensorLATW'06: 7th IEEE Latin American Test Workshop, Mar 2006, Buenos Aires, Argentina. pp.29-34
Communication dans un congrès
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Design of a Micromachined CMOS CompassTRANSDUCERS'05, Jun 2005, Séoul (Corée), pp.405-408
Communication dans un congrès
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Electro-Thermal On-Line Testing of a MEMS Magnetometer Through Bias ModulationLATW: Latin American Test Workshop, Mar 2005, Salvador, Bahia, Brazil. pp.213-218
Communication dans un congrès
lirmm-00106517v1
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On-Chip Electro-Thermal Stimulus Generation for a MEMS-Based Magnetic Field SensorVTS'05: 23rd IEEE VLSI Test Symposium, May 2005, Palm Springs, CA (USA), pp.213-218
Communication dans un congrès
lirmm-00105996v1
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XOR en technologie TBH InP pour les futures transmissions optiques à 40 Gb/s14èmes Journées Nationales Microondes, 2005, Paris, France
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Comparison Between 0.13 µm PD-SOI Gated Diode and non Gated Diode through DC TCAD SimulationsEUROSOI'05, Jan 2005, Grenade, Spain
Communication dans un congrès
lirmm-00106519v1
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Superposition vs. Modulation: A Comparative Analysis for Electro-Thermal On-Line MEMS TestingIMSTW'05: 11th IEEE International Mixed-Signal Testing Workshop, Jun 2005, Cannes, pp.212-219
Communication dans un congrès
lirmm-00106522v1
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Experimental and Finite-Element Study of Convective Accelerometer on CMOSEUROSENSORS, Sep 2005, Barcelona, Spain
Communication dans un congrès
lirmm-00106544v1
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Physics and Design Optimization of ESD Diode for 0.13mm PD-SOI TechnologyEOS/ESD: Electrical Overstress/Electrostatic Discharge, Sep 2005, Anaheim, United States
Communication dans un congrès
lirmm-00106041v1
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VHDL-AMS Fault Simulation for Testing DNA Bio-Sensing ArraysIEEE SENSORS, Oct 2005, Irvine, United States. ⟨10.1109/ICSENS.2005.1597878⟩
Communication dans un congrès
lirmm-00106042v1
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BIST Implementation of Electro-Thermal Stimulus Generation for a MEMS-Based Magnetic Field SensorLATW: Latin American Test Workshop, Mar 2005, Salvador, Bahia, Brazil. pp.207-212
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lirmm-00106516v1
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Design&Test of an Oscillation Based System Architecture for DNA Sensor ArraysIMSTW'05: 11th IEEE International Mixed-Signal Testing Workshop, Jun 2005, Cannes, pp.234-239
Communication dans un congrès
lirmm-00106525v1
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Offset and Noise Rejection Analysis in CMOS Piezoresistive SensorsEUROSENSORS, Sep 2005, Barcelona, Spain
Communication dans un congrès
lirmm-00106543v1
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A Monolithic CMOS 3-Axis Accelerometer Combining Piezoresistive and Heat Transfer EffectsPRIME'05: PhD Research in Microelectronics and Electronics, Jul 2005, Lausanne (Switzerland), pp.219-222
Communication dans un congrès
lirmm-00106064v1
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Absolute Pitch, Roll and Yaw Measurement on CMOS4th IEEE Conference on Sensors, Oct 2005, Irvine, CA (USA), pp.133-136
Communication dans un congrès
lirmm-00154128v1
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A Broad-Band Active Frequency Doubler Operating up to 120 GHzEuMC: European Microwave Conference, Oct 2005, Paris, France
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Towards On-Line Testing of MEMS Using Electro-Thermal ExcitationETS: European Test Symposium, May 2005, Tallinn, Estonia. pp.76-81
Communication dans un congrès
lirmm-00106009v1
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Tutorial on Test Engineering and Design for Testability of Micro- and Nano- Systems1st DfMM Summer School, 2004
Communication dans un congrès
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Investigations on the Use of EWS Data for Failure Diagnosis EnhancementLATW'04: 5th IEEE Latin American Test Workshop, Mar 2004, Cartagena (Colombia), pp.6-10
Communication dans un congrès
lirmm-00108652v1
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A DC-100 GHz Frequency Doubler in InP DHBT TechnologyMTT-S: Microwave Theory and Techniques Society, Jun 2004, Texas, United States. pp.167-170, ⟨10.1109/MWSYM.2004.1335834⟩
Communication dans un congrès
lirmm-00108815v1
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Electrically-Induced Thermal Stimuli for MEMS Testing1st DfMM Summer School, 2004
Communication dans un congrès
lirmm-00109142v1
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A CMOS MEMS Accelerometer with Bulk MicromachiningEUROSENSORS, Sep 2004, Rome, Italy
Communication dans un congrès
lirmm-00108794v1
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Optimised Probing Flow for High Speed Fault LocalizationISTFA'04: International Symposium on Testing and Failure Analysis, Nov 2004, Worcester (USA)
Communication dans un congrès
lirmm-00108898v1
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An A/D Interface for Resonant Piezoresistive MEMS SensorISIE 2004 - IEEE International Symposium on Industrial Electronics, May 2004, Ajaccio, France. pp.83-88, ⟨10.1109/ISIE.2004.1571786⟩
Communication dans un congrès
lirmm-00108896v1
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On the Use of Electrical Stimuli for MEMS TestingLATW'04: 5th IEEE Latin American Test Workshop, Mar 2004, Cartagena, Spain. pp.118-122
Communication dans un congrès
lirmm-00108651v1
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Electrically-Induced Thermal Stimuli for MEMS TestingETS: European Test Symposium, May 2004, Ajaccio, Corsica, France. pp.60-65
Communication dans un congrès
lirmm-00108904v1
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Amplificateur CMOS Faible Bruit pour Micro Capteur MEMSTAISA'03: Traitement Analogique de l'Information, du Signal et ses Applications, Oct 2003, Louvain, Belgique. pp.71-74
Communication dans un congrès
lirmm-00269460v1
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Design and Simulation of a CMOS MEMS Using Standard Microelectronic CAD EnvironmentNANOTECH 2003 - Nanotechnology Conference and Trade Show, Feb 2003, San Francisco, CA, United States. pp.472-475
Communication dans un congrès
lirmm-00269546v1
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Piezoresistive CMOS Beams for Inertial SensingIEEE SENSORS, Oct 2003, Toronto, Canada. pp.451-456, ⟨10.1109/ICSENS.2003.1278978⟩
Communication dans un congrès
lirmm-00269470v1
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Low Noise CMOS Amplifier for a Piezoresistive Magnetic Field SensorDCIS: Design of Circuits and Integrated Systems, Nov 2003, Ciudad Real, Spain. pp.639-644
Communication dans un congrès
lirmm-00269472v1
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Improving the Efficiency of the Oscillation-Based Test Methodology for Parametric FaultsLATW: Latin American Test Workshop, Feb 2003, Natal, Brazil. pp.234-237
Communication dans un congrès
lirmm-00269433v1
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Electrical Modeling of LSCRs in Deep Submicron CMOS Technologies for Circuit-Level Simulation of ESDBCTM 2003 - Bipolar/BiCMOS Circuits and Technology Meeting, Sep 2003, Toulouse, France. pp.97-100, ⟨10.1109/BIPOL.2003.1274943⟩
Communication dans un congrès
lirmm-00269608v1
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On the Synthesis of Analog Cascaded Filters with Optimal Test Point InsertionLATW: Latin American Test Workshop, Feb 2003, Natal, Brazil. pp.212-216
Communication dans un congrès
lirmm-00269499v1
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Designing Testable Analog Filters with Optimal DFT InsertionIMSTW: International Mixed-Signal Testing Workshop, Jun 2002, Montreux, Switzerland. pp.201-203
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lirmm-00269341v1
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On the Use of CMOS 0n-Chip Mechanical Devices for Spectral AnalysisEUROSENSORS, Sep 2002, Prague, Czech Republic. pp.191-192
Communication dans un congrès
lirmm-00268509v1
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Experimental test infrastructure supporting IEEE 11494 StandardETW: European Test Workshop, 2002, Corfou, Greece
Communication dans un congrès
lirmm-00268606v1
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Implementation of an Experimental IEEE 1149.4 Mixed-Signal Test ChipBTW 2002 - 1st IEEE International Board Test Workshop, Oct 2002, Baltimore, United States. paper 4.2
Communication dans un congrès
lirmm-00269342v1
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On the Use of an Oscillation-Based Test Methodology for CMOS Micro-Electro-Mechanichal SystemsDATE: Design, Automation and Test in Europe, Mar 2002, Paris, France. pp.1120-1120, ⟨10.1109/DATE.2002.998476⟩
Communication dans un congrès
lirmm-00268488v1
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Impact of Environmental Parameters on CMOS MEMS StructuresCANEUS, Aug 2002, Montreal, Canada
Communication dans un congrès
lirmm-00269356v1
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Testing Reasonant Micro-Electro-Mechanical Sensors Using the Oscillation-Based Test MethodologyLATW 2002 - 3rd IEEE Latin American Test Workshop, Feb 2002, Montevideo, Uruguay. pp.99-104
Communication dans un congrès
lirmm-00269323v1
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Impact of Power-Clock Network on Adiabatic LogicPoster de conférence lirmm-01456996v1 |
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FINMINA: a French national project to promote Innovation in Higher Education in Microelectronics and NanotechnologiesITHET: Information Technology Based Higher Education and Training, Sep 2014, York, United Kingdom. Information Technology Based Higher Education and Training, 2014, ⟨10.1109/ITHET.2014.7155715⟩
Poster de conférence
hal-01122242v1
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FEM study of a 3-axis thermal accelerometer based on free convection in a microcavityMSM'2012: Modeling & Simulation of Microsystems, Microtech Conference & Expo, Santa Clara, United States. pp.4, 2012
Poster de conférence
lirmm-00814247v1
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A Time-Efficient Simulation Flow for DAC Characterization & OptimizationDCIS 2012 - 27th Conference on Design of Circuits and Integrated Systems, Nov 2012, Avignon, France. pp.298-299, 2012
Poster de conférence
lirmm-00814994v1
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Pressure Sensor for Smart Wafer-Level Packaging of MEMSEUROSENSORS, Sep 2008, Dresden, Germany. 22nd European Conference on Solid-State Transducers, pp.408-411, 2008
Poster de conférence
lirmm-00325109v1
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Design of a High Resolution MEMS-Based CMOS MagnetometerEUSPEN: European Society for Precision Engineering and Nanotechnology, May 2005, Montpellier, France. 5th International Conference of the European Society for Precision Engineering and Nanotechnology, pp.287-290, 2005
Poster de conférence
lirmm-00105999v1
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Design of CMOS Cantilevers for Intertial SensingEUSPEN: European Society for Precision Engineering and Nanotechnology, May 2005, Montpellier, France. 5th International Conference of the European Society for Precision Engineering and Nanotechnology, pp.341-344, 2005
Poster de conférence
lirmm-00106001v1
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On the Development of a Low-Cost Diagnostic Flow for Efficient Failure AnalysisETS: European Test Symposium, May 2004, Ajaccio, France. 9th IEEE European Test Symposium, 2004
Poster de conférence
lirmm-00108658v1
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Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP 2015)IEEE, 2015, 978-1-4799-8625-5
Ouvrages
lirmm-01432968v1
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Proceedings of Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP 2014)Vice General Chair: Pascal NOUET. EDA Publishing, 2014
Ouvrages
lirmm-01434883v1
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Ultra-Low-Power SensorsM. Belleville and C. Condemine. Energy Autonomous Micro and Nano Systems, ISTE Ltd and John Wiley & Sons Inc, pp.207-237, 2012, 978-1-84821-359-9
Chapitre d'ouvrage
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Les capteurs à ultra-basse consommationM. Belleville et C. Condemine. Micro et nanosystèmes autonomes en énergie, des applications aux fonctions et technologies, Hermès-Lavoisier, pp.237-269, 2012, 978-2-7462-2517-6
Chapitre d'ouvrage
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Analog and Mixed-Signal Test Bus: IEEE 1149.4 Test StandardHuertas J.L. Test and Design-for-Testability in Mixed-Signal Integrated Circuits, Kluwer Academic Publishers, pp.28, 2004, 1-4020-7724-6
Chapitre d'ouvrage
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Interconnect Capacitance Modelling in a VDSM CMOS TechnologySOC Design Methodologies, 90, Kluwer Academic Publishers, pp.133-144, 2002, IFIP — The International Federation for Information Processing, 978-1-4757-6530-4. ⟨10.1007/978-0-387-35597-9_12⟩
Chapitre d'ouvrage
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Impact of Technology Spreading on MEMS Design RobustnessSOC Design Methodologies, 90, Kluwer Academic Publishers, pp.241-251, 2002, IFIP — The International Federation for Information Processing, 978-1-4757-6530-4. ⟨10.1007/978-0-387-35597-9_21⟩
Chapitre d'ouvrage
lirmm-00268485v1
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Noise Optimisatioin of a Piezoresistive CMOS MEMS for Magnetic Field SensingSOC Design Methodologies, 90, Kluwer Academic Publishers, pp.461-472, 2002, IFIP — The International Federation for Information Processing, 978-1-4757-6530-4. ⟨10.1007/978-0-387-35597-9_40⟩
Chapitre d'ouvrage
lirmm-00268487v1
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Noise optimisation of a piezoresistive CMOS MEMS for magnetic field sensingSOC Design Methodologies, 90, Kluwer Academic Publishers, pp.461-472, 2002, IFIP — The International Federation for Information Processing, 978-1-4757-6530-4. ⟨10.1007/978-0-387-35597-9_39⟩
Chapitre d'ouvrage
hal-01105261v1
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MEMS monolithiques.Hermès science publication, 1 (1), 2000, Nano et Micro Technologies, micro-capteurs et microsystèmes intégrés, 9-782746-202422
Chapitre d'ouvrage
hal-01105274v1
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Gated thyristor and related system and methodUnited States, Patent n° : US7619863 (B2). 2009, pp.N/A
Brevet
lirmm-00406923v1
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Circuit d'amplification d'un signal représentant une variation de résistance d'une résistance variable et capteur correspondantFrance, N° de brevet: FR0854585A; FR2009051324W. 2008
Brevet
lirmm-00363897v1
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Thyristor à GrilleN° de brevet: 06/52837. 2006, pp.15
Brevet
lirmm-00128273v1
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Electrostatic Discharge Protection Device Comprising Several ThyristorsFrance, Patent n° : United States Patent n° 7-113-377. 2006, pp.N/A
Brevet
lirmm-00406883v1
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Smart Triggered Multifinger SCR (STMSCR)France, Patent n° : 0202009. 2002
Brevet
lirmm-00090262v1
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Smart Triggered Multifinger SCR (STMSCR)United States, Patent n° : 0202009. 9568. 2002, pp.P/N
Brevet
lirmm-00268609v1
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3D Orientation Determination DEMO2008
Autre publication scientifique
lirmm-00361236v1
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Remote Access to Manufacturing Test Facilities: a Reality in IC, a dream in MEMS2006, pp.39-41
Autre publication scientifique
lirmm-00128278v1
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Introduction aux Microsystèmes (MEMS)2004
Autre publication scientifique
lirmm-00109128v1
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Caractérisation TLP des Structures STMSCR du Run H8T1062003, pp.P nd
Autre publication scientifique
lirmm-00269719v1
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Modélisation Electrique de LSCR en Technologie H92002
Autre publication scientifique
lirmm-00268608v1
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A Simple Protocol to Compare EMFI platforms2020
Pré-publication, Document de travail
lirmm-03626807v1
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HBM and CDM Stress Evaluation at Circuit Level06023, 2006, 15 p
Rapport
lirmm-00102725v1
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Modelling and Comparison of TQFP48 and GBA64 Packages in CDM Environment06022, 2006, 40 p
Rapport
lirmm-00102724v1
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Study of a Multi-Chip Circuit under CDM Stress06024, 2006, 20 p
Rapport
lirmm-00102726v1
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