MD
Maxime Darnon
288
Documents
Identifiants chercheurs
- maxime-darnon
- 0000-0002-6188-7157
- Google Scholar : https://scholar.google.fr/citations?user=ZRXEV4AAAAAJ&hl=fr
- IdRef : 124051758
Présentation
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Optimization of Diesel Generator Usage for Multi-Source Nano-Grid2023 IEEE 14th International Conference on Power Electronics and Drive Systems (PEDS), Aug 2023, Montreal, Canada. pp.1-5, ⟨10.1109/PEDS57185.2023.10246652⟩
Communication dans un congrès
hal-04236828v1
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New Triple-Junction Solar Cell Assembly Process for Concentrator Photovoltaic Applications2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), May 2023, Orlando, United States. pp.2223-2229, ⟨10.1109/ECTC51909.2023.00385⟩
Communication dans un congrès
hal-04236794v1
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A Novel Partial Power Cascaded DC/DC Topology for CPV Application: A Theoretical Study2023 IEEE 14th International Conference on Power Electronics and Drive Systems (PEDS), IEEE, Aug 2023, Montreal, Canada. pp.1-6, ⟨10.1109/PEDS57185.2023.10246548⟩
Communication dans un congrès
hal-04236853v1
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Sub-millimeter-scale multijunction solar cells for concentrator photovoltaics (CPV)SPIE OPTO 2022 - Physics, Simulation, and Photonic Engineering of Photovoltaic, SPIE, Feb 2022, San Francisco, United States. ⟨10.1117/12.2613441⟩
Communication dans un congrès
hal-03781347v1
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Micro-Scale III-V/Ge Multijunction Solar Cell with Through Cell Via Contacts49th IEEE Photovoltaic Specialists Conference, Jun 2022, Philadelphia, United States
Communication dans un congrès
hal-03686951v1
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Development of low-damage plasma process using remote plasma source for the gate opening step in the AlGaN/GaN MOS HEMT integrationPlasma Etch and Strip in Microtechnologies, Sep 2022, Leuven, Belgium
Communication dans un congrès
hal-03831336v1
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Plasma etching of III-V materials for photo transducers fabricationPlasma Etch and Strip in Microelectronics, Sep 2022, Leuven, Belgium
Communication dans un congrès
hal-03831333v1
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Plasma Etching of Copper for the Microfabrication of High-Density Interconnects in Advanced PackagingAVS 68th International Symposium & Exhibition, Nov 2022, Pittsburgh, United States
Communication dans un congrès
hal-03910308v1
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First Feedback from a CPV Plant in a Nordic Location, Québec, Canada18th Conference on Concentrated PhotoVoltaïcs System, Apr 2022, online, Japan
Communication dans un congrès
hal-03831362v1
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Miniaturization of High Efficiency InGaP/InGaAs/Ge Solar Cells and Pathways for Further ImprovementsWorld Conference on Photovoltaics and Energy Conversion, Sep 2022, Milan, Italy
Communication dans un congrès
hal-03831341v1
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Application of DC/DC Partial Power Conversion to Concentrating Photovoltaics48th Annual Conference of the Industrial Electronics Society (IECON), IEEE, Oct 2022, Bruxelles, Belgium
Communication dans un congrès
hal-03831326v1
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A Comparative Study of Existing Approaches for Modeling the Incident Irradiance on Bifacial PanelsElectrimacs, May 2022, Nancy, France
Communication dans un congrès
hal-03831357v1
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Multi-Terminal Three-Junction Solar Cells for Sub-Cells Characterization18th Conference on Concentrated PhotoVoltaïcs System, Apr 2022, on line, Japan
Communication dans un congrès
hal-03831364v1
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Micro-Scale III-V/GeMultijunction Solar Cell with Through Cell Via Contacts49th IEEE Photovoltaic Specialists Conference, Jun 2022, Philadelphia, United States
Communication dans un congrès
hal-03821787v1
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IIIV/Ge Multijunction Solar Cell with Through Cell Via Contact Fabrication and CharacterizationIEEE 48th Photovoltaic Specialists Conference (PVSC), Jun 2021, ON LINE, United States
Communication dans un congrès
hal-04303304v1
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Cu-based Metallization for Silicon Heterojunction Solar Cells4th International Workshop for Silicon Heterojunction Solar Cells, Nov 2021, Neuchatel, Switzerland
Communication dans un congrès
hal-03831367v1
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Multijunction Solar Cell Mesa Isolation: A Comparative Study17th Conference on Concentrated PhotoVoltaïcs System, 2021, Denver (On line), United States
Communication dans un congrès
hal-03407487v1
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Multijunction Solar Cell Electrical Isolation and Passivation with a Single Plasma Process.17th Conference on Concentrated PhotoVoltaïcs Systems (CPV17), Apr 2021, Freiburg (on line), Germany
Communication dans un congrès
hal-03349744v1
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Comparison of Various InGaAs-based Solar Cells for Concentrated Photovoltaics Applications17th Conference on Concentrated PhotoVoltaïcs System, 2021, Denver (On line), United States. ⟨10.1063/5.0103648⟩
Communication dans un congrès
hal-03407479v1
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Demonstration of Back Contacted III/Ge Triple Junction Solar Cells,16th Conference on Concentrated PhotoVoltaïcs Systems (CPV16), May 2020, Denver, United States. pp.020005-1 -- 020005-5, ⟨10.1063/5.0033094⟩
Communication dans un congrès
hal-02991189v1
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Improving Short-Circuit Current of Concentrator Solar Cells Using a Deposited Microbead Layer16th Conference on Concentrated PhotoVoltaïcs Systems, May 2020, Denver, United States
Communication dans un congrès
hal-02991197v1
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Plasma Treatment For Fluxless Flip-chip Chip-Joining Process3S&Systems Summit, SEMI, Jan 2020, Dresden, Germany
Communication dans un congrès
hal-02463072v1
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Towards miniaturization of concentrated photovoltaics (CPV): impact on fabrication, performance and robustness of solar cells2020 IEEE 47th Photovoltaic Specialists Conference (PVSC), IEEE, Jun 2020, Calgary (virtual), Canada. pp.1268-1273, ⟨10.1109/PVSC45281.2020.9300898⟩
Communication dans un congrès
hal-03109711v1
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PROJECT AMELIZ: PATTERNING TECHNIQUES FOR COPPER ELECTROPLATED METALLIZATION ON HETEROJUNCTION CELLSEuropean PV Solar Energy Conference & Exhibition, Sep 2020, Paris, France
Communication dans un congrès
hal-02991212v1
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Nanostructured surface for extended temperature operating range in concentrator photovoltaic modules16TH INTERNATIONAL CONFERENCE ON CONCENTRATOR PHOTOVOLTAIC SYSTEMS (CPV-16), May 2020, Denver, United States. pp.050002-1 -- 050002-6, ⟨10.1063/5.0032134⟩
Communication dans un congrès
hal-03029181v1
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New architectures of Concentrated Photovoltacs (CPV) solar cellsPhotonics North, May 2020, Niagara Falls, Canada
Communication dans un congrès
hal-02991177v1
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High Aspect Ratio and Low Damage III-V/Ge Heterostructure Via EtchingPlasma Etch and Strip in Microelectronics (PESM), 11th International Workshop, May 2019, Grenoble, France
Communication dans un congrès
hal-02324782v1
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Solar Cell with Light-Induced Plated Front Emitter Contact15th Conference on Concentrated PhotoVoltaics Systems, Mar 2019, Fes, Morocco
Communication dans un congrès
hal-02339964v1
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Micro/nanotechnologies to improve concentrated photovoltaics systemsJournées nationales sur les technologies émergentes en micro-nano fabrication, (JNTE2019), Nov 2019, Grenoble, France
Communication dans un congrès
hal-02916153v1
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High-Voltage Low-Current Multijunction Monolithic Interconnected Microcells15th Conference on Concentrated PhotoVoltaics Systems, Mar 2019, Fes, Morocco
Communication dans un congrès
hal-02339963v1
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Improving Temperature-Dependent Energy Output of Concentrator Photovoltaic Systems using Nanotextured SurfacesNumerical Simulation of Optoelectronic Devices, Jul 2019, Ottawa, Canada
Communication dans un congrès
hal-02339961v1
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Synchronous Plasma Pulsing for Etch Applications3rd Plasma Etch and Strip in Microelectronics Workshop, Mar 2019, Grenoble, France
Communication dans un congrès
hal-02339989v1
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Passivating Antireflection Coating for Improving Optical Properties of Concentrated Photovoltaics Using PECVDNumerical Simulation of Optoelectronic Devices, Jul 2019, Ottawa, Canada
Communication dans un congrès
hal-02339960v1
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Nanostructured Surfaces in Concentrator Photovoltaic Systems To Improve Temperature-Dependent Energy OutputCanadian Semiconductor Science and Technology Conference, Jul 2019, Saskatoon, Canada
Communication dans un congrès
hal-02339959v1
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Area downsizing effects on electrical performance and robustness of triple junction solar cells for CPV applicationsInternational Symposium on Reliability of Optoelectronics System, Nov 2019, Toulouse, France
Communication dans un congrès
hal-02443117v1
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Patterning Platinum using CMP and plasma etching industrially compatible processes45th International Conference on Micro and Nano Engineering MNE, Aug 2019, Rhodes, Greece
Communication dans un congrès
hal-02320605v1
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Modeling the Incorporation of Microbeads into Concentrator Photovoltaic SystemsIEEE Photonics North, May 2019, Quebec, Canada. ⟨10.1109/PN.2019.8819537⟩
Communication dans un congrès
hal-02339962v1
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Plasma-induced damage during III-V semiconductor patterning for photonic and photovoltaic applications: from characterization to minimization18th conference on defects recognition, imaging and physics in semiconductors (DRIP XVIII), Sep 2019, Berlin, Germany
Communication dans un congrès
hal-02324729v1
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Etch process cleaning to improve wafer to wafer reproducibilityENRIS 2019 (European Nanofabrication Research Infrastructure Symposium), 2019, UNIVERSITY OF TWENTE, Netherlands
Communication dans un congrès
hal-02624143v1
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Impact of plasma etching process exposure on the integrity of AlN and AlGaN layers integrated in GaN heterojunction transistors (HEMTs)Journées nationales sur les technologies émergentes en micro-nano fabrication, (JNTE2019), Nov 2019, Grenoble, France
Communication dans un congrès
hal-02916150v1
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Patterning Platinum using BEOL industrially compatible processes; Chemical Mechanical Polishing vs. ICP Plasma etching44th International Conference on Micro and Nanoengineering, Sep 2019, Copenhage, Denmark
Communication dans un congrès
hal-03178730v1
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Plasma processes for High Efficiency Multi-Junction Solar Cells Fabrication66th International AVS Symposium & Topical Conferences, Oct 2019, Columbus, Ohio, United States
Communication dans un congrès
hal-02336676v1
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III-V/Ge multijunction solar cell with Through Cell Vias Contacts fabrication14th International Conference on Concentrated PhotoVoltaics Systems, Apr 2018, Puertollano, Spain
Communication dans un congrès
hal-02339966v1
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Plasma Treatment for Fluxless Flip-Chip Chip-Joining Process2018 IEEE 68th Electronic Components and Technology Conference (ECTC), May 2018, San Diego, United States. ⟨10.1109/ECTC.2018.00069⟩
Communication dans un congrès
hal-01870584v1
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Interaction of humidity with plasma-damaged porous low-k28th Advanced Metallization Conference (ADMETA), Oct 2018, Beijing, China
Communication dans un congrès
hal-02338098v1
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Dense array CPV receivers: Impact of the cooling device on the net PV output for different illumination profiles14TH INTERNATIONAL CONFERENCE ON CONCENTRATOR PHOTOVOLTAIC SYSTEMS (CPV-14), Apr 2018, Puertollano, Spain. pp.080008, ⟨10.1063/1.5053536⟩
Communication dans un congrès
hal-01877143v1
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Front-Contacted Multijunction Micro Solar Cells: Fabrication & Characterization14th International Conference on Concentrated PhotoVoltaics Systems, Apr 2018, 2018-04-01, Spain
Communication dans un congrès
hal-02339965v1
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Microfabrication of multi junction solar cells for concentrated photovoltaics applicationEuropean Advanced Energy Materials Congress, Mar 2018, Stockholm, Sweden
Communication dans un congrès
hal-02338105v1
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Permanent bonding process for III-V/Ge multijunction solar cell integration14TH INTERNATIONAL CONFERENCE ON CONCENTRATOR PHOTOVOLTAIC SYSTEMS (CPV-14), Apr 2018, Puertollano, Spain. pp.090004, ⟨10.1063/1.5053542⟩
Communication dans un congrès
hal-01877145v1
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III-V/Ge Heterostructure Etching for Through Cell Via Contact Multijunction Solar Cellc65th International AVS Symposium & Topical Conferences, Oct 2018, Long Beach, California, USA, United States
Communication dans un congrès
hal-01959003v1
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Dual technological procedure for multijunction solar cell : InGaAs subcell Epitaxial Lift-Off combined with InP wafer recycling14th International Conference on Concentrator Photovoltaic Systems CPV'14, Apr 2018, Puertollano, Spain
Communication dans un congrès
hal-01963993v1
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III-V/Ge Heterostructure Etching for Through Cell Via Contact Multijunction Solar Cell65th International AVS Symposium & Topical Conferences, Oct 2018, Long Beach, United States
Communication dans un congrès
hal-02324762v1
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Development and Validation of Key Microfabrication Processes for Through Cell Via Contacts Multi-Junction Solar Cell13th International Conference on Concentrator Photovoltaic Systems (CPV-13), May 2017, Ottawa, Canada
Communication dans un congrès
hal-02453664v1
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The handling of thin substrates and its potential for new architectures in multi-junction solar cells technology13TH INTERNATIONAL CONFERENCE ON CONCENTRATOR PHOTOVOLTAIC SYSTEMS (CPV-13), May 2017, Ottawa, Canada. pp.040001, ⟨10.1063/1.5001423⟩
Communication dans un congrès
hal-02074425v1
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Technological developments of epitaxial lift-off process over InP substratesJournées nationales sur les technologies émergentes en micro nanofabrication (JNTE 2017), Nov 2017, Orléans, France
Communication dans un congrès
hal-02073141v1
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CPV Research at Universite de Sherbrooke: from materials to systems13th International Conference on Concentrated PhotoVoltaics Systems, May 2017, Ottawa, Canada
Communication dans un congrès
hal-02339968v1
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Epitaxial lift-off of low band gap subcells for multijunction solar cell devicesC’Nano meetings, Dec 2017, Lyon, France
Communication dans un congrès
hal-02097245v1
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Via sidewall insulation for through cell via contacts13TH INTERNATIONAL CONFERENCE ON CONCENTRATOR PHOTOVOLTAIC SYSTEMS (CPV-13), May 2017, Ottawa, Canada. pp.040002, ⟨10.1063/1.5001424⟩
Communication dans un congrès
hal-02074429v1
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Micro/Nanotechnologies for high efficiency solar cells fabricationEMN Meeting on Optoelectronics, Apr 2017, Victoria, Canada
Communication dans un congrès
hal-02097240v1
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Submillimeter Multijunction Solar Cells: Impact of Dimension, Design and Architecture on Electrical Performances13th International conference on Concentrator Photovoltaic Systems (CPV 13), May 2017, Otawa, Canada
Communication dans un congrès
hal-01716137v1
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Anisotropic and Low Damage III-V/Ge Heterostructures via Etching for Multijunction Photovoltaic Cell FabricationPlasma Etch and Strip in Microelectronics (PESM), 10th International Workshop, Oct 2017, leuven, Belgium
Communication dans un congrès
hal-01929191v1
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Plasma etching for high efficiency solar cells fabricationCMOS Emerging Technologies Research, May 2016, Montreal, Canada
Communication dans un congrès
hal-02339969v1
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GaP/c-Si heterojunction solar cell processing: understanding and recovery of bulk degradation6th international conference on crystalline silicon PV, Mar 2016, Chambery, France
Communication dans un congrès
hal-02339973v1
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Through Cell Via Contacts: Impact of Hole Integration on Multi-Junction Solar Cell and Associated Surface Treatments12th International Conference on Concentrator Photovoltaic Systems (CPV-12), Apr 2016, Freiburg, Germany
Communication dans un congrès
hal-02097309v1
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Substrate Handling Strategies Thinned Multi-junction Solar-cell Wafers.12th International Conference on Concentrator Photovoltaic Systems (CPV-12), Apr 2016, Freiburg, Germany
Communication dans un congrès
hal-02097312v1
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Plasma Etching for High Efficiency Solar Cells FabricationChina Semiconductor Technology International Conference (CSTIC) 2016, Mar 2016, Shanghai, China
Communication dans un congrès
hal-02338109v1
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Plasma etching applications in concentrated photovoltaic cell fabrication12th International Conference on Concentrator Photovoltaic Systems (CPV-12), May 2016, Freibourg, Germany. pp.060001, ⟨10.1063/1.4962091⟩
Communication dans un congrès
hal-02074637v1
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Plasma etching for III-V/Ge multijunction solar cells singulation12th International Conference on Concentrator Photovoltaic Systems (CPV-12) (25–27 April 2016,, Apr 2016, Freiburg, Germany
Communication dans un congrès
hal-02097315v1
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Roughness generation during Si etching in Cl2 pulsed plasmasPlasma Etch and Strip in Microtechnologies conference, May 2016, Grenoble, France
Communication dans un congrès
hal-02339971v1
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Velocity distribution function of ions through high-aspect ratio holes in Inductively-Coupled Plasma reactorPlasma Etch and Strip in Microtechnologies conference, May 2016, Grenoble, France
Communication dans un congrès
hal-02339972v1
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Microtechnologies for high efficiency solar cells2016 Photonics North (PN), May 2016, Quebec City, Canada. pp.1-2, ⟨10.1109/PN.2016.7537907⟩
Communication dans un congrès
hal-02074627v1
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Can plasma etching be used in photovoltaics?Plasma Etch and Strip in Microtechnologies conference, May 2016, Grenoble, France
Communication dans un congrès
hal-02339970v1
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Measuring IVDF through high-aspect holes in pulsed ICP plasma68th Gaseous Electronics Conference (GEC), Oct 2015, Honolulu, United States
Communication dans un congrès
hal-01878046v1
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Post-porosity Plasma protection (P4): a promising strategy against v-UV damage in porous, low-k materialsPlasma Etch and Strip in Microtechnologies conference, May 2015, Leuven, Belgium
Communication dans un congrès
hal-02339977v1
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Measuring IVDF through high−aspect holes in pulsed ICP plasmas68th GEC / ICRP−9, Oct 2015, Honolulu, United States
Communication dans un congrès
hal-01878113v1
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RFEA analyzers to measure IVDF through high−aspect holes in pulsed ICP plasmasFrontiers in Low Temperature Plasma Diagnostics XI, 2015, Porquerolles, France
Communication dans un congrès
hal-01878109v1
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Challenges of contact etching for 14FDSOI technologySPIE-AL, Feb 2015, San Jose, United States
Communication dans un congrès
hal-02339980v1
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Solar Cell with Gallium Phosphide / Silicon HeterojunctionCMOS Emerging Technologies Research, May 2015, Vancouver, Canada
Communication dans un congrès
hal-02338111v1
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GaP/Si heterojunction solar cells: an alternative to amorphous silicon?6th Photovoltaic Technical Conference (PVTC 2015), May 2015, Aix en Provence, France
Communication dans un congrès
hal-02339974v1
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Spectral analysis of the line-width and line-edge roughness transfer during self-aligned double patterning approachSPIE Advanced Lithography, SPIE, 2015, San Jose, CA, United States. pp.94280B, ⟨10.1117/12.2085812⟩
Communication dans un congrès
hal-01869175v1
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Producing ion waves from acoustic pressure waves in pulsed ICP: Modelling vs. Experiments68th Gaseous Electronics Conference (GEC), Oct 2015, Honolulu, United States
Communication dans un congrès
hal-01878115v1
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Multi-junction Solar Cells with Through Substrate Vias ContactsNext Generation PhotoVoltaics Canada, May 2015, Toronto, Canada
Communication dans un congrès
hal-02339975v1
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Measuring IVDF through high−aspect holes in ICP plasmasPESM 2015 (Plasma Etch and Strip in Microtechnology), 2015, Louvain, Belgium
Communication dans un congrès
hal-01878112v1
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Solar cells with gallium phosphide/silicon heterojunction11th International Conference on Concentrator Photovoltaic Systems (CPV-11), May 2015, Aix-les-Bains, France. pp.040003, ⟨10.1063/1.4931514⟩
Communication dans un congrès
hal-02338417v1
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Evolution of Bulk c-Si Properties during the Processing of GaP/c-Si Heterojunction Cell5th International Conference on Silicon Photovoltaics (Silicon PV 2015), Mar 2015, Konstanz, Germany. pp.493-499, ⟨10.1016/j.egypro.2015.07.070⟩
Communication dans un congrès
hal-02339979v1
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Diagnostics in pulsed hydrogen plasmas11th Frontiers in low temperature plasma diagnostics, May 2015, Hyeres, France
Communication dans un congrès
hal-02339976v1
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Porous Materials Characterization by Infrared SpectroscopyCMOS Emerging Technologies Research, May 2015, Vancouver, Canada
Communication dans un congrès
hal-02338119v1
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MD simulations of Cl2 plasmas interaction with ultrathin Si films for advanced etch processes”Plasma Etch and Strip in Microelectronics (PESM), May 2014, Grenoble (France), France
Communication dans un congrès
hal-01798396v1
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Plasma Damage of Porous Low-k MaterialsMaterial Research Society Spring Meeting, Apr 2014, San Francisco, United States
Communication dans un congrès
hal-02338124v1
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Prospects for dielectric constant reduction in integrated circuits interconnectsMaterials Research Society Spring Meeting, Jun 2014, San Francisco, United States. pp.Mrss14-1692-cc01-01, ⟨10.1557/opl.2014.609⟩
Communication dans un congrès
hal-02338418v1
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Reactor wall plasma cleaning processes after InP etching in Cl2/CH4/Ar ICP dischargePlasma Etch and Strip in Microelectronics (PESM), 7th International Workshop, May 2014, grenoble, France
Communication dans un congrès
hal-01798099v1
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MD simulations of chlorine plasmas interaction with ultrathin silicon films for advanced etch processes.Plasma Etch and Strip in Microelectronics (PESM), 6th International Workshop, May 2014, grenoble, France
Communication dans un congrès
hal-01798524v1
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Selective dry etching of titanium nitride nanostructures with chlorine-based inductively coupled plasma40th Micro and Nano Engineering Conference, Sep 2014, Lausanne, Switzerland
Communication dans un congrès
hal-02339986v1
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Pulsed ICP plasmas processing: 0D Model vs. ExperimentsPlasma Etch and Strip in Microelectronics (PESM), 6th International Workshop, May 2014, grenoble, France
Communication dans un congrès
hal-01798532v1
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Silicon etching using CW, synchronized pulsed and bias pulsed Cl2 plasmaAVS 2014, , 2014, Baltimore, United States
Communication dans un congrès
hal-01798348v1
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Diagnostics in Pulsed Hydrogen PlasmasAVS 61st international symposium, Oct 2014, Baltimore, United States
Communication dans un congrès
hal-02339983v1
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Inductively coupled plasma etching of ultra-shallow Si3N4 and SiO2 nanostructures40th Micro and Nano Engineering Conference, Sep 2014, Lausanne, Switzerland
Communication dans un congrès
hal-02339985v1
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Optical and electrical diagnostics in chlorine based pulsed plasmas of an industrial silicon etching reactor1st International Middle-East Plasma Science, Turkey, Apr 2014, Istambul, Turkey
Communication dans un congrès
hal-02338122v1
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Producing ion waves from acoustic pressure waves in pulsed inductive plasmasPlasma Etch and Strip in Microelectronics (PESM), May 2014, Grenoble, France
Communication dans un congrès
hal-01798411v1
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Role of the mask on contact etching at the 20 nm nodePlasma Etch and Strip in Microtechnologies conference, May 2014, Grenoble, France
Communication dans un congrès
hal-02339987v1
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Diagnostics of Pulsed Hydrogen Plasmas67th Gaseous Electronic Conference, Oct 2014, Raleigh, United States
Communication dans un congrès
hal-02339984v1
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Pulsed Plasmas for etching in micro and nanoelectronicsPlasma Nanoscience Conference, Mar 2014, Dublin, Ireland
Communication dans un congrès
hal-02338129v1
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Interaction between the plasma & mask materials during the contact etching for 14FDSOIAVS 61st international symposium, Oct 2014, Baltimore, United States
Communication dans un congrès
hal-02339981v1
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MD simulations of chlorine plasmas interaction with ultrathin Si films for advanced etch processes2014 Silicon Nanoelectronics Workshop (SNW), Jun 2014, Honolulu (USA), United States
Communication dans un congrès
hal-01798393v1
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Pulsed Cl2/Ar ICP plasmas processing : 0D Model vs. ExperimentsPlasma Etch and Strip in Microelectronics (PESM), May 2014, grenoble, France
Communication dans un congrès
hal-01798407v1
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Si3N4 spacers etching in synchronized pulsed CH3F/O2/He/SiF4 plasmasAVS 60h international symposium, Oct 2013, Long Beach, United States
Communication dans un congrès
hal-00925775v1
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Characterization of silicon etching in synchronized pulsed plasmaSPIE Advanced Lithography, 2013, San Jose, United States. ⟨10.1117/12.2011462⟩
Communication dans un congrès
hal-00860917v1
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Pulsed plasma processing: A combined modelling and experimental study31st International Conference on Phenomena in Ionized Gases (ICPIG), Jul 2013, Granada, Spain
Communication dans un congrès
hal-00904428v1
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Pulsed ICP chlorine plasmas : Numerical simulations versus Experiments4th Workshop on Radio Frequency Discharges, May 2013, giens, France
Communication dans un congrès
hal-00860934v1
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Pulsed plasmas for etching at the nanoscaleJournées Nationales des Technologies Émergentes, May 2013, Evian les bains, France
Communication dans un congrès
hal-00860922v1
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MD simulations of chlorine plasmas interaction with ultrathin silicon films for advanced etch processesAVS 2013, Oct 2013, Long beach, United States
Communication dans un congrès
hal-00919179v1
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Optical and Electrical Diagnostics of Pulsed Plasmas Etching ProcessesAVS 60h international symposium, Oct 2013, Long Beach, United States
Communication dans un congrès
hal-00925763v1
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Pulsed plasmas for etching in microelectronicsJournées du réseau plasma froids, 2013, La Rochelle, France
Communication dans un congrès
hal-00925769v1
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Pulsed ICP plasmas processing : A combined modelling and experimental study31st International Conference on Phenomena in Ionized Gases (ICPIG), Jul 2013, Granada, Spain
Communication dans un congrès
hal-00925794v1
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MD Simulations of Pulsed Chlorine Plasmas Interaction with Ultrathin Silicon Films for Advanced Etch ProcessesAmerican Vacuum Society 60th International Symposium, Oct 2013, Long beach, United States
Communication dans un congrès
hal-00904431v1
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Pulsed plasmas: from plasma parameters to pattern transferPlasma Etch and Strip in Microtechnologies conference, 2013, leuven, Belgium
Communication dans un congrès
hal-00860925v1
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Optical and Electrical Diagnostics of Pulsed Plasmas Etching Processes11th Technological Plasma Workshop, Dec 2013, York, United Kingdom
Communication dans un congrès
hal-02338133v1
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Time-resolved Optical and Electrical Diagnostics of Pulsed Plasmas EtchingAmerican Vacuum Society 60th International Symposium, Oct 2013, Long beach, United States
Communication dans un congrès
hal-00904432v1
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Self-assembly patterning using block copolymer for advanced CMOS technology: optimisation of plasma etching processSPIE-AL, 2012, San Jose, CA, United States
Communication dans un congrès
hal-00808863v1
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Plasma Etching for Back End Of Line ApplicationsChina Semiconductor Technology International Conference (CSTIC), Mar 2012, Shanghaï, China
Communication dans un congrès
hal-00808862v1
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SiCl4/Cl2 plasmas: a new chemistry to etch high-k material selectively to Si-based AlloysPlasma Etch and Strip in Microelectronics conference, 2012, Grenoble, France
Communication dans un congrès
hal-00808860v1
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Investigation of synchronized pulsed plasmas for highly selective etching of Si3N4 spacersPacific Rim Meeting of the Electrochemical and Solid State Society (PRiME), 2012, Hawai, United States
Communication dans un congrès
hal-00808854v1
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Self assembly patterning using block copolymer for advanced CMOS technologyPlasma Etch and Strip in Microelectronics conference, 2012, Grenoble, France
Communication dans un congrès
hal-00808857v1
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Challenges related to linewidth roughnessChina Semiconductor Technology International Conference (CSTIC), Mar 2012, Shanghai, China
Communication dans un congrès
hal-02338405v1
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Towards new plasma technologies for 22 nm gate etch processes and beyondSPIE Advanced Lithography, 2012, San Jose, United States. pp.83280D, ⟨10.1117/12.920312⟩
Communication dans un congrès
hal-00808682v1
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Time resolved ion flux measurement in pulsed ICP plasmasTampa, Oct 2012, Tampa, United States
Communication dans un congrès
hal-00762123v1
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Plasmas Processes Challenges for Porous SiCOH Integration in Advanced InterconnectsMaterials Research Society spring meeting, Apr 2012, San francisco, United States
Communication dans un congrès
hal-00808861v1
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Analysis of Passivation Layer Composition and Thickness on Silicon Patterns Etched by Synchronously Pulsed Plasmas5th Plasma Etch and Strip in Microelectronics Workshop (PESM), Mar 2012, Grenoble, France
Communication dans un congrès
hal-00755594v1
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Time-resolved diagnostics of reactive pulsed plasmas by absorption spectroscopy, modulated beam Mass spectrometry, ion flux probes and RFEA analyzersFirst Pulsed Plasma Diagnostics Workshop (PPDW), 2012, dublin, Ireland
Communication dans un congrès
hal-00808856v1
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Time-resolved diagnostics of pulsed plasma etching processes1st pulsed plasma diagnostic workshop, Sep 2012, Dublin, Ireland
Communication dans un congrès
hal-00808669v1
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Towards new plasma technologies for 22nm gate etch processes and beyondSPIE-AL, 2012, San Jose, CA, United States
Communication dans un congrès
hal-00808670v1
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Low-k integration using metallic hard masksUCPSS, 2012, Ghent, Belgium. pp.195, 193-195, ⟨10.4028/www.scientific.net/SSP.187.193⟩
Communication dans un congrès
hal-00925747v1
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Self assembly patterning using block copolymer for advanced CMOS Technology : optimisation of plasma etching processesSPIE, 2012, United States. pp.83280M, ⟨10.1117/12.916399⟩
Communication dans un congrès
hal-00944979v1
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Self-assembly patterning using block copolymer for advanced CMOS technology: optimisation of plasma etching processSPIE, 2012, United States. Volume: 8328 Pages: 83280M (6 pp.), ⟨10.1117/12.91639⟩
Communication dans un congrès
hal-00808850v1
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HfO2 etching by pulsed BCl3/Ar plasma4th PESM workshop, May 2011, Belgium
Communication dans un congrès
hal-00641438v1
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Interest of synchronized pulsed plasmas for next CMOS technologiesChina Semiconductor Technology International Conference (CSTIC) 2011, Mar 2011, Shanghaï, China
Communication dans un congrès
hal-00625345v1
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Porous SiCOH Patterning for Advanced Interconnects: Challenges and SolutionsElectrochem. 219th Soc. Meeting, 2011, Montreal, Canada
Communication dans un congrès
hal-00625357v1
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Porous SiOCH integration: Etch challenges with a trench first metal hard mask approachChinese Semiconductor Technology International Conference (CSTIC), Mar 2011, Shanghaï, China. pp.389-394, ⟨10.1149/1.3567609⟩
Communication dans un congrès
hal-00625347v1
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Angstrom Level Resolution EtchChina Semiconductor Technology International Conference (CSTIC), Mar 2011, Shanghaï, China
Communication dans un congrès
hal-00625350v1
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HfO2 Etching by Pulsed BCl3/Ar PlasmaAVS 58h international symposium, Oct 2011, Nashville, United States
Communication dans un congrès
hal-02339988v1
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Challenges of porous SiCOH dielectric material integration for advanced interconnect technology nodesCMOS Emerging Technologies, Jun 2011, Whistler, Canada
Communication dans un congrès
hal-00647646v1
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Characterizing Plasma Induced Damage to Ultra Low-kChina Semiconductor Technology International Conference (CSTIC), Mar 2011, Shanghaï, China
Communication dans un congrès
hal-00625356v1
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Diagnostics of reactive pulsed plasmas by UV and VUV absorption spectroscopy and by modulated beam Mass spectrometryIX workshop on frontiers in low temperature plasma diagnostics, 2011, zinowitz, Germany
Communication dans un congrès
hal-00641436v1
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Impact of ambient atmosphere on plasma-damaged porous low-k characterizationIEEE International Interconnect Technology Conference / Materials for Advanced Metallization, May 2011, Dresde, Germany
Communication dans un congrès
hal-00647635v1
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Impact of Synchronized Plasma Pulsing Technologies on Key Parameters Governing STI Etch ProcessesAVS 58h international symposium, Oct 2011, Nashville, United States
Communication dans un congrès
hal-00647636v1
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Time-Modulation of High density Plasmas for Advanced Dry Etching Processes4th Plasma Etch and Strip in Microelectronics Workshop, May 2011, Mechelen, Belgium
Communication dans un congrès
hal-00647608v1
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Etch processes with pulsed plasmas for advanced CMOS technologies3rd International Conference on Microelectronics and Plasma Technology, Jul 2011, Dalian, China
Communication dans un congrès
hal-00647643v1
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Scatterometric Porosimetry for porous low-k patterns characterizationInterconnect Technology Conference and Materials for Advanced Metallization (IITC/MAM), May 2011, Dresde, Germany
Communication dans un congrès
hal-00647417v1
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Characterization of Plasma-Induced Damages on low-k during Interconnection Integration by Scatterometric PorosimetryAVS 58h international symposium, Oct 2011, Nashville, United States
Communication dans un congrès
hal-00647640v1
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Time-resolved diagnostics of pulsed plasmas by UV and VUV absorption spectroscopy and by modulated beam Mass spectrometry64th Gaseous Electronic Conference, 2011, Salt lake city, United States
Communication dans un congrès
hal-00647602v1
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Time-resolved diagnostics of pulsed HBr and Cl2 plasmas64rd Gaseous Electronics Conference, Nov 2011, Salt Lake City, United States
Communication dans un congrès
hal-00944932v1
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Low k Integration Using Metallic Hard MasksMaterials Research Society spring meeting (MRS) 2011, Apr 2011, San Francisco, United States
Communication dans un congrès
hal-00647612v1
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Through cell vias contacts for multijunction solar cells11TH INTERNATIONAL CONFERENCE ON CONCENTRATOR PHOTOVOLTAIC SYSTEMS: CPV-11, May 2011, Aix-les-Bains, France. pp.060003, ⟨10.1063/1.4931537⟩
Communication dans un congrès
hal-02338413v1
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Characterizing plasma-damaged porous low-k4th Plasma Etch and Strip in Microelectronics Workshop, May 2011, Mechelen, Belgium
Communication dans un congrès
hal-00647611v1
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Improving Etch Processes by Using Pulsed PlasmasAVS 58h international symposium, Oct 2011, Nashville, United States
Communication dans un congrès
hal-00647630v1
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Plasma Etching Process Scalability and challenges for ULK MaterialsIITC 2010, Jun 2010, Burlingame USA., United States
Communication dans un congrès
hal-00623452v1
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Pulsed plasma for nanoCMOS and nanoelectronic device elaborationThe Second International Symposium on Plasma Nanoscience (iPlasmaNano-II), Dec 2010, Sydney, Australia
Communication dans un congrès
hal-00643911v1
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Synchronized pulsed plasmas: potential process improvements for patterning technologies63rd Annual Gaseous Electronics Conference and 7th International Conference on Reactive Plasmas, Oct 2010, Paris, France
Communication dans un congrès
hal-02338411v1
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Plasma etching processes for nanoCMOS and nanoelectronics devicesMinatech upstream crossroad, 2010, Grenoble, France
Communication dans un congrès
hal-00643917v1
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Synchronous Plasma Pulsing For Etch ApplicationsAVS 57th international symposium, Oct 2010, Albuquerque, United States
Communication dans un congrès
hal-00625368v1
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Challenges and future prospects in plasma etching processes3rd International Conference on PLAsma NanoTechnology and Science, Mar 2010, Nagoya,, Japan
Communication dans un congrès
hal-00625378v1
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Challenges in sub-100 nm Dual Damascene Etch of Porous Oxycarbosilane Ultra Low-k Dielectrics for BEOL IntegrationAVS 57th international symposium, Oct 2010, Albuquerque, United States
Communication dans un congrès
hal-00625371v1
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Plasma Processes Challenges for Porous SiOCH Patterning in Advanced InterconnectsAVS 57th international symposium, 2010, Albuquerque, United States
Communication dans un congrès
hal-00625365v1
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Molecularly Reinforced Sol-gel Glasses: Preparation, Characterization and Integration StudiesMaterial Research Society Spring Meeting, Nov 2010, United States
Communication dans un congrès
hal-00625377v1
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Synchronous Plasma Pulsing for silicon Etch ApplicationsChina Semiconductor Technology International Conference (CSTIC), 2010, Shangai, China
Communication dans un congrès
hal-00643921v1
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Plasma Pulsing for Atomic Layer Etching Application3rd Plasma Etch and Strip in Microelectronics Workshop, Mar 2010, Grenoble, France
Communication dans un congrès
hal-00625384v1
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Synchronized pulsed plasmas: potential process improvements for patterning technologies63rd Gaseous Electronic Conference and 7th International Conference on Reactive Plasmas, Oct 2010, Paris, France
Communication dans un congrès
hal-00625370v1
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Reduction of Plasma Induced Silicon-Recess During Gate Over-Etch Using Synchronous Pulsed PlasmasAVS 57th international symposium, Oct 2010, Albuquerque, United States
Communication dans un congrès
hal-00625366v1
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Etching Process Scalability and Challenges for ULK MaterialsInternational Interconnect Technology Conference, IITC, Jun 2010, Dresde, Germany. ⟨10.1109/IITC.2010.5510735⟩
Communication dans un congrès
hal-00625314v1
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Sidewall Modification of Porous SiOCH Induced by Etching and Post Etching Plasma Treatments3rd Plasma Etch and Strip in Microelectronics Workshop, Mar 2010, Grenoble, France
Communication dans un congrès
hal-00625382v1
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Synchronous Plasma Pulsing for Etch ApplicationsChina Semiconductor Technology International Conference (CSTIC), Mar 2010, Shanghaï, China
Communication dans un congrès
hal-00647616v1
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Pulsed plasmas for nanoCMOS and nanoelectronics devices elaboration2nd International Conference on Plasma Nanoscience (iPlasma Nano-II), 2010, Bateman's Bay, Australia
Communication dans un congrès
hal-00944937v1
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Trigate 6T SRAM scaling to 0.06 μm2Proceeding of 2009 International Electron Devices Meeting, IEDM 2009, Dec 2009, San Francisco, United States
Communication dans un congrès
hal-00625310v1
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Inductively-Coupled Pulsed Plasmas in the Presence of Synchronous Pulsed Substrate Bias for Advanced Gate EtchingAVS 56th international symposium, Nov 2009, San José, United States
Communication dans un congrès
hal-00461590v1
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Hydrogen Silsesquioxane-Based Hybrid Electron Beam And Optical Lithography For High Density CMOS Prototyping53rd Iinternational Conference on Electron, Ion, and Photon Beam Technology & Nanoffabrication, 2009, United States
Communication dans un congrès
hal-00461591v1
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Deposition and Etching of Hexagonal and Cubic Boron NitrideAVS 55th international symposium, October 2008, 2008, United States
Communication dans un congrès
hal-00461592v1
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Plasma challenges of porous SiOCH patterning for advanced interconnect levels55th American Vacuum Society Symposium, 2008, boston, United States
Communication dans un congrès
hal-00397847v1
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Plasma Etching Challenges for Porous SiOCH Integration in Advanced Interconnect Levels30th Symposium on Dry Process (DPS), 2008, tokyo, Japan
Communication dans un congrès
hal-00397846v1
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Dielectric Trenches Patterning: Metallic Vs Organic Hard MaskProceeding of MAM, Metal Advanced Metallization (Workshop), 2007, bruges, Belgium
Communication dans un congrès
hal-00398866v1
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Metallic versus Organic Hard Mask Strategies for Advanced Dielectric Trenches PatterningProceeding of DPS, Symposium on Dry Process, 2007, tokyo, Japan
Communication dans un congrès
hal-00399993v1
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Chamber walls coating during patterning of dielectric damascene structures with a metal hard mask: consequence on cleaning strategiesPlasma Etch and Strip in Microelectronics Workshop, 2007, Detroit, United States
Communication dans un congrès
hal-00461598v1
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Porous SiOCH Modification by O2, NH3 and CH4 plasmas Used as ashing and Pore sealing StepsProceeding of PESM, Plasma Etch and Strip in Microelectronics (Workshop), 2007, leuven, Belgium
Communication dans un congrès
hal-00398871v1
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Ash Plasma Exposure of Hybrid Material (SiOCH and porogen): Comparisaon with Porous SiOCHAVS 54th, 2007, United States
Communication dans un congrès
hal-00461593v1
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Chamber Walls Coatings During Patterning of Dielectric Damascene Structures With a Metallic Hard Mask: Consequences on Cleaning StrategiesProceeding of PESM, Plasma Etch and Strip in Microelectronics (Workshop), 2007, leuven, Belgium
Communication dans un congrès
hal-00398870v1
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Evaluation of ellipsometric porosimetry for in-line characterization of low- dielectricsISCE, 4th International Conference on Spectroscopic Ellipsometry, 2007, stockolm, Sweden
Communication dans un congrès
hal-00398872v1
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Comprehensive study of metal-fluoride crystals issues with trench first hard mask back end architectureSurface Preparation and Cleaning Conference, 2007, United States
Communication dans un congrès
hal-00461607v1
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Ash plasma exposure of hybrid material (SiOCH and porogen)54th International AVS symposium, 2007, seattle, United States
Communication dans un congrès
hal-00400650v1
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Chamber Walls Coatings during hard mask patterning of Ultra Low-k Materials: Consequences on Cleaning StrategiesAVS 54th international symposium, 2007, United States
Communication dans un congrès
hal-00461594v1
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Challenges of Plasma Processes for Advanced ULK PatterningMaterials for Advanced Metallization 2006 Conference (MAM 2006), 2006, grenoble, France
Communication dans un congrès
hal-00397760v1
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Emerging Application of Fluorocarbon Plasmas for Integrated Circuits Fabrication8th International workshop on fluorocarbon plasma, 2006, autrans, France
Communication dans un congrès
hal-00400476v1
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Critical Dimensions Control of Narrow Low-k TrenchesMaterials for Advanced Metallization, 2006, grenoble, France
Communication dans un congrès
hal-00461614v1
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Profile control and sidewall modifications of narrow porous ULK trenches after plasma etching and pore sealing treatments53rd International AVS Symposium, 2006, San Francisco, United States
Communication dans un congrès
hal-00400479v1
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Patterning of narrow SiOCH trenches using the late porogen removal processAVS, 53rd International AVS Symposium, 2006, san francisco, United States
Communication dans un congrès
hal-00400477v1
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Material Modifications and Surface Roughness during Porous SiOCH Etching ProcessesAVS 53rd international symposium, 2006, United States
Communication dans un congrès
hal-00461612v1
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Comparison between metallic and inorganic hard masks used for advanced porous low k patterning15th International Colloquium on Plasma Processes (CIP), 2005, autrans, France
Communication dans un congrès
hal-00398848v1
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A Study of Plasma Treatments Limiting Metal Barrier Diffusion into Porous Low-k MaterialsProceeding of ADMETA, Advanced Metallization Asian Session, 2005, tokyo, Japan
Communication dans un congrès
hal-00398855v1
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Impact of Hard Mask Composition and Etching Chemistry on Porous Ultra Low-k Material Modification6th International Conference on Microelectronics and Interfaces, 2005, United States
Communication dans un congrès
hal-00649906v1
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Comparison Between Metallic and Inorganic Hard Masks Used for Advanced Porous Low-k Patterning15th International Colloquium on Plasma Processes, 2005, Autrans, France
Communication dans un congrès
hal-00461955v1
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Etching Mechanisms of Low-k Materials with the Solid FirstTM ILD Process in Fluorocarbon Based PlasmaAVS 52nd international symposium, 2005, United States
Communication dans un congrès
hal-00461617v1
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Etching of Narrow Porous SiOCH Trenches Using a TiN Metallic Hard MaskAVS 52nd international symposium, Oct 2005, Boston, United States
Communication dans un congrès
hal-00647625v1
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Time−Modulation of High density Plasmas for Advanced Dry Etching Processes4th PESM workshop, May 2001, Belgium
Communication dans un congrès
hal-00944972v1
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Les Procédés par Plasmas Impliqués dans l'Intégration des Matériaux SiOCH Poreux pour les Interconnexions en MicroélectroniqueMicro et nanotechnologies/Microélectronique. Université Joseph-Fourier - Grenoble I, 2007. Français. ⟨NNT : ⟩
Thèse
tel-00181477v2
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Patterning Challenges in MicroelectronicsPlasma Etching Processes for CMOS Devices Realization, Elsevier, pp.59-94, 2017, ⟨10.1016/B978-1-78548-096-6.50003-1⟩
Chapitre d'ouvrage
hal-02338425v1
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Plasma Etching in MicroelectronicsPlasma Etching Processes for CMOS Devices Realization, Elsevier, pp.23-58, 2017, ⟨10.1016/B978-1-78548-096-6.50002-X⟩
Chapitre d'ouvrage
hal-02338424v1
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Plasma Etch Challenges for Gate PatterningPlasma Etching Processes for CMOS Devices Realization, Elsevier, pp.95-118, 2017, ⟨10.1016/B978-1-78548-096-6.50004-3⟩
Chapitre d'ouvrage
hal-02338426v1
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IntroductionPlasma Etching Processes for Interconnect Realization in VLSI, Elsevier, pp.1-13, 2015, ⟨10.1016/B978-1-78548-015-7.50001-9⟩
Chapitre d'ouvrage
hal-02339199v1
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Interaction Plasma/DielectricPlasma Etching Processes for Interconnect Realization in VLSI, Elsevier, pp.15-43, 2015, ⟨10.1016/B978-1-78548-015-7.50002-0⟩
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Porous SiOCH Film IntegrationPlasma Etching Processes for Interconnect Realization in VLSI, Elsevier, pp.45-76, 2015, ⟨10.1016/B978-1-78548-015-7.50003-2⟩
Chapitre d'ouvrage
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Interconnects for TomorrowPlasma Etching Processes for Interconnect Realization in VLSI, Elsevier, pp.77-91, 2015, ⟨10.1016/B978-1-78548-015-7.50004-4⟩
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