MD
Maxime Darnon
8
Documents
Identifiants chercheurs
- maxime-darnon
- 0000-0002-6188-7157
- Google Scholar : https://scholar.google.fr/citations?user=ZRXEV4AAAAAJ&hl=fr
- IdRef : 124051758
Présentation
Publications
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Selective dry etching of TiN nanostructures over SiO2 nanotrenches using a Cl2/Ar/N2 inductively coupled plasmaJournal of Vacuum Science and Technology, 2016, 34 (2), ⟨10.1116/1.4936885⟩
Article dans une revue
hal-01701405v1
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Inductively coupled plasma etching of ultra-shallow Si3N4 nanostructures using SF6/C4F8 chemistryMicroelectronic Engineering, 2015, 141, pp.68 - 71. ⟨10.1016/j.mee.2015.01.014⟩
Article dans une revue
hal-01916788v1
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Plasma Etching of Copper for the Microfabrication of High-Density Interconnects in Advanced PackagingAVS 68th International Symposium & Exhibition, Nov 2022, Pittsburgh, United States
Communication dans un congrès
hal-03910308v1
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Plasma Treatment For Fluxless Flip-chip Chip-Joining Process3S&Systems Summit, SEMI, Jan 2020, Dresden, Germany
Communication dans un congrès
hal-02463072v1
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Patterning Platinum using BEOL industrially compatible processes; Chemical Mechanical Polishing vs. ICP Plasma etching44th International Conference on Micro and Nanoengineering, Sep 2019, Copenhage, Denmark
Communication dans un congrès
hal-03178730v1
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Plasma Treatment for Fluxless Flip-Chip Chip-Joining Process2018 IEEE 68th Electronic Components and Technology Conference (ECTC), May 2018, San Diego, United States. ⟨10.1109/ECTC.2018.00069⟩
Communication dans un congrès
hal-01870584v1
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Selective dry etching of titanium nitride nanostructures with chlorine-based inductively coupled plasma40th Micro and Nano Engineering Conference, Sep 2014, Lausanne, Switzerland
Communication dans un congrès
hal-02339986v1
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Inductively coupled plasma etching of ultra-shallow Si3N4 and SiO2 nanostructures40th Micro and Nano Engineering Conference, Sep 2014, Lausanne, Switzerland
Communication dans un congrès
hal-02339985v1
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