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187 résultats
Using a two step plasma etching process for diamond power devicesInternational Conference on Diamond and Carbon Materials Granada, SPAIN, 2012, Granada, Spain
Communication dans un congrès
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Le Diamant pour l'Electronique de Puissance - Développement des Technologies AssociéesMGE 2008 4ème Colloque Matériaux du Génie Electrique, May 2008, TOULOUSE, France. 4 p
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Electrothermal simulations of silicon carbide current limiting devices2003 IEEE International Conference on Industrial Technology, Dec 2003, Maribor, Slovenia. pp.1135-1140, ⟨10.1109/ICIT.2003.1290823⟩
Communication dans un congrès
hal-02498210v1
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Low-doped 6H-SiC n-type epilayers grown by sublimation epitaxyMaterials Science and Engineering: B, 2000, 77 (1), pp.50-54
Article dans une revue
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3D Packaging Structure for High Temperature Power electronicsFrom Nano to Micro Power Electronics and Packaging Workshop, IMAPS France, Oct 2014, Tours, France
Communication dans un congrès
hal-01081697v1
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FEM simulation based study of electric field reduction by linear and nonlinear resistive solution for HV power module under switching operation2021 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Dec 2021, Vancouver, France. pp.502-505, ⟨10.1109/CEIDP50766.2021.9705425⟩
Communication dans un congrès
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Sur l'amélioration des propriétés diélectriques de films polyimides par la nanostructurationSymposium de Genie Electrique, Jun 2016, Grenoble, France
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hal-01361627v1
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Substrat céramique métallisé en structure mesa pour la montée en tension des modules de puissance3ème Symposium de Génie Electrique (SGE 2018), Université de Lorraine [UL], Jul 2018, Nancy, France. pp.189304
Communication dans un congrès
hal-02981914v1
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Investigation of Thermo-Oxidative Polyimide Thin Film Aging at High TemperatureCIMA 2011: Mediterranean Conference on Innovative Materials and Applications, Beyrouth, LEBANON, 2011, Beyrouth, Lebanon
Communication dans un congrès
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High Temperature Dielectric Properties of Polyimide / Boron Nitride Nanocomposites : Nanoparticle Size and Loading Content EffectsInternational Conference and Exhibition on High Temperature Electronics Network (HiTEN), July 06-08, 2015, Cambridge (UK), 2015, Cambridge, United Kingdom
Communication dans un congrès
hal-03965606v1
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Novel High Glass Transition Polyamide-imide : Tg Influence on Electrical Conductivity at High TemperatureIEEE Dielectrics and Electrical Insulation Society, 2015, 22 (5), pp.3053-3058. ⟨10.1109/TDEI.2015.004925⟩
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Improved Annealing Process for 6H-SiC p+-n Junction Creation by Al ImplantationMaterials Science Forum, 2000, 338-342, pp.921-924. ⟨10.4028/www.scientific.net/MSF.338-342.921⟩
Article dans une revue
hal-02275720v1
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Propriétés Diélectriques et Thermiques des Parylenes N et D pour l’Isolation de Surface en Électronique de PuissanceJournées Jeunes Chercheurs en Génie Électrique (JCGE 2015), 10-11 Juin 2019, Cherbourg (FRANCE), 2015, Cherbourg, France
Communication dans un congrès
hal-03998332v1
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Enhancement of Thermal Conduction of Polyimide/Boron Nitride NanocompositesIEEE Annual Report Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), IEEE, Oct 2013, Shenzhen, China. pp.543-546, ⟨10.1109/CEIDP.2013.6747082⟩
Communication dans un congrès
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Tuning electrical conductivity in AlN-based ceramics by incorporating grapheneJournal of the European Ceramic Society, 2023, 43 (5), pp.1887-1896. ⟨10.1016/J.JEURCERAMSOC.2022.12.039⟩
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Study of 6H-SiC high voltage bipolar diodes under reverse biasesApplied Surface Science, 2001, 184 (1-4), pp.477-482. ⟨10.1016/S0169-4332(01)00537-2⟩
Article dans une revue
istex
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Post-Implantation Annealing of Aluminium in 6H-SiCMaterials Science Forum, 1998, 264-268, pp.709-712. ⟨10.4028/www.scientific.net/MSF.264-268.709⟩
Article dans une revue
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Mécanismes de claquage de diodes bipolaires en SiC - Impact du milieu isolant en surfaceSymposium de Génie Electrique (SGE'16), Jun 2016, Grenoble, France
Communication dans un congrès
hal-01361631v1
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Electrical and electrothermal 2D simulations of a 4H-SiC high voltage current limiting device for serial protection applications12th International Symposium on Power Semiconductor Devices & ICs. Proceedings, May 2000, Toulouse, France. pp.287-290, ⟨10.1109/ISPSD.2000.856827⟩
Communication dans un congrès
hal-02972084v1
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Effect of ion implantation parameters on Al dopant redistribution in SiC after annealing: Defect recovery and electrical properties of p-type layersJournal of Applied Physics, 2003, 94 (5), pp.2992-2998
Article dans une revue
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Silicon Carbide specific components for power electronics system protectionInternational Conference on Silicon Carbide and Related Materials (ICSCRM'2003), Oct 2003, Lyon, France
Communication dans un congrès
hal-02503449v1
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Dielectrics for High Temperature SiC Device Insulation: Review of New Polymeric and Ceramic Materials, in Silicon CarbideSilicon Carbide - Materials, Processing and Applications in Electronic Devices, pp.409-430, 2011, Chapitre 17, 978-953-307-368-4
Chapitre d'ouvrage
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Dielectric properties of ceramic substrates and current developments for medium voltageSymposium Medium Voltage Power Electronics, Sept. 8, 2017, Berlin (GERMANY), 2017, Berlin, Germany
Communication dans un congrès
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Suitable Characterization Methods and Insulating Materials for Devices Operating above 200 °CAdvanced Materials Research, 2011, 324, pp.229-232. ⟨10.4028/www.scientific.net/AMR.324.229⟩
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Innovative ceramic-matrix composite substrates with tunable electrical conductivity for high-power applicationsScience and Technology of Advanced Materials, 2022, 23 (1), pp.735 - 751. ⟨10.1080/14686996.2022.2137695⟩
Article dans une revue
hal-03851417v2
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On the interpretation of high frequency capacitance data of 6H-SiC boron compensated pin junctionMaterials Science and Engineering: B, 1999, 61 (2), pp.429-432
Article dans une revue
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Effect of film thickness and electrode material on space charge formation and conductivity in polyimide films2019 IEEE International Workshop on Integrated Power Packaging (IWIPP), Apr 2019, Toulouse, France. pp.102-106, ⟨10.1109/IWIPP.2019.8799098⟩
Communication dans un congrès
hal-02396334v1
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Dielectric and Thermal Properties of Parylene N and D Films for Power Electronic Surface InsulationIEEE International Conference on the Properties and Applications of Dielectric Materials (ICPADM), 19-22 July, 2015, Sydney (AUSTRALIA), 2015, Sydney, Australia
Communication dans un congrès
hal-03965605v1
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Nanomechanical Characterization of Nanocomposite Polymers for Electrical EngineeringIEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP 2015), 18-21 October, 2015, Ann Arbor, Michigan (USA), 2015, Ann Arbor, United States. pp.551-554, ⟨10.1109/CEIDP.2015.7352157⟩
Communication dans un congrès
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High Temperature Power Module Packaging IssuesJournées SPEC, Lyon, France, 2011, Lyon, France
Communication dans un congrès
hal-03989429v1
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