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"J. Parain"   

Conference papers1 document

  • S. Pin, M. Sartor, L. Michel, J. Parain, S. Dareys. Characterizing and modelling the behaviour of an isotropic conductive adhesive in view of electronic assembly fatigue life studies under thermal cycling. 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2014, Belgium, France. pp.1-7, ⟨10.1109/EuroSimE.2014.6813820⟩. ⟨hal-02056739⟩