- 1
Marc Lethiecq
1
Documents
Identifiants chercheurs
- marc-lethiecq
- IdRef : 093397798
- 0000-0003-0684-1751
- Google Scholar : https://scholar.google.fr/citations?hl=fr&user=PcS-p2oAAAAJ&view_op=list_works&sortby=pubdate
Présentation
Publications
- 1
- 1
- 1
- 1
- 1
- 1
- 1
- 1
- 1
Impact of Aluminum Wire and Ribbon Bonding Technologies on D 2 PAK Package Reliability during Thermal Cycling ApplicationsMicroelectronics Reliability, 2015, 55 (9-10), pp.1821-1825. ⟨10.1016/j.microrel.2015.06.012⟩
Article dans une revue
hal-01784763v1
|