Co-auteurs

Nombre de documents

35

Marc Legros, CEMES-CNRS


Article dans une revue28 documents

  • Roberta Ruffilli, Mounira Berkani, Philippe Dupuy, Stephane Lefebvre, Yann Weber, et al.. Mechanisms of power module source metal degradation during electro-thermal aging. Microelectronics Reliability, Elsevier, 2017, 76-77, pp.507 - 511. 〈10.1016/j.microrel.2017.06.086〉. 〈hal-01575130〉
  • Frédéric Mompiou, Marc Legros, Sylvie Lartigue-Korinek. Deformation mechanisms in submicron Be wires. Journal of Materials Research, Cambridge University Press (CUP), 2017, 32 (24), pp.4616 - 4625. 〈10.1557/jmr.2017.327〉. 〈hal-01789433〉
  • Nicolas Combe, Frédéric Mompiou, Marc Legros. Shear-coupled grain-boundary migration dependence on normal strain/stress. Physical Review Materials, American Physical Society, 2017, 1 (3), 〈10.1103/PhysRevMaterials.1.033605〉. 〈hal-01726446〉
  • Alexandre Tallaire, Thierry Ouisse, Arthur Lantreibecq, Robin Cours, Marc Legros, et al.. Identification of Dislocations in Synthetic Chemically Vapor Deposited Diamond Single Crystals. Crystal Growth and Design, American Chemical Society, 2016, 16 (5), pp.2741-2746. 〈10.1021/acs.cgd.6b00053〉. 〈hal-01456077〉
  • Ehsan Hosseinian, Marc Legros, Olivier N. Pierron. Quantifying and observing viscoplasticity at the nanoscale: Highly localized deformation mechanisms in ultrathin nanocrystalline gold films. Nanoscale, 2016, 8 (17), pp.9234-9244. 〈10.1039/c6nr00710d〉. 〈hal-01729243〉
  • Frédéric Mompiou, Marc Legros, Charlotte Ensslen, Olivier Kraft. Corrigendum to “In situ TEM study of twin boundary migration in sub-micron Be fibers” [Acta Mater. 96 (2015) 57–65]. Acta Materialia, 2016, 109, pp.406-407. 〈10.1016/j.actamat.2016.02.055〉. 〈hal-01729240〉
  • Nicolas Combe, Frédéric Mompiou, Marc Legros. Disconnections kinks and competing modes in shear-coupled grain boundary migration. Physical Review B : Condensed matter and materials physics, American Physical Society, 2016, 93 (2), pp.024109. 〈10.1103/PhysRevB.93.024109〉. 〈hal-01729242〉
  • Onofri C., Sabathier C., Baumier C., Bachelet C., Palancher H., et al.. Evolution of extended defects in polycrystalline Au-irradiated UO2 using in situ TEM: Temperature and fluence effects. Journal of Nuclear Materials, Elsevier, 2016, pp.105-113. 〈10.1016/j.jnucmat.2016.10.011〉. 〈in2p3-01389524〉
  • Claire Onofri, C. Sabathier, H. Palancher, G. Carlot, S. Miro, et al.. Evolution of extended defects in polycrystalline UO2 under heavy ion irradiation: Combined TEM, XRD and Raman study. Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, Elsevier, 2016, 374, pp.51-57. 〈10.1016/j.nimb.2015.08.091〉. 〈hal-01729241〉
  • Julien Dupré de Baubigny, Michael Benzaquen, Laure Fabié, Mathieu Delmas, Jean-Pierre Aimé, et al.. Shape and Effective Spring Constant of Liquid Interfaces Probed at the Nanometer Scale: Finite Size Effects. Langmuir, American Chemical Society, 2015, 31 (36), pp.9790-9798. 〈10.1021/acs.langmuir.5b02607〉. 〈hal-01715938〉
  • M. Naamoun, Alexandre Tallaire, Pascal Doppelt, Alix Gicquel, Marc Legros, et al.. Reduction of dislocation densities in single crystal CVD diamond by using self-assembled metallic masks. Diamond and Related Materials, 2015, 58, pp.62-68. 〈10.1016/j.diamond.2015.06.012〉. 〈hal-01729247〉
  • Q. Yu, Marc Legros, A.M. Minor. In situ TEM nanomechanics. MRS Bulletin, 2015, 40 (1), pp.62-68. 〈10.1557/mrs.2014.306〉. 〈hal-01729246〉
  • Frédéric Mompiou, Marc Legros, Charlotte Ensslen, Oliver Kraft. In situ TEM study of twin boundary migration in sub-micron Be fibers. Acta Materialia, Elsevier, 2015, 〈10.1016/j.actamat.2015.06.016〉. 〈hal-01274118v2〉
  • Frédéric Mompiou, Marc Legros. Quantitative grain growth and rotation probed by in-situ TEM straining and orientation mapping in small grained Al thin films. Scripta Materialia, Elsevier, 2015, 99, pp.5-8. 〈10.1016/j.scriptamat.2014.11.004〉. 〈hal-01729245〉
  • Roberta Ruffilli, M Berkani, P Dupuy, Stéphane Lefebvre, Y Weber, et al.. In-depth investigation of metallization aging in power MOSFETs. Microelectronics Reliability, Elsevier, 2015, Proceedings of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, SI:Proceedings of ESREF 2015, 55 (9-10), pp.1966-1970. 〈10.1016/j.microrel.2015.06.036〉. 〈hal-01700466v2〉
  • Marc Legros. In situ mechanical TEM: Seeing and measuring under stress with electrons. Comptes Rendus Physique, Elsevier Masson, 2014, 15 (2-3), pp.224-240. 〈10.1016/j.crhy.2014.02.002〉. 〈hal-01729251〉
  • Armin Rajabzadeh, Frédéric Mompiou, S. Lartigue-Korinek, Nicolas Combe, Marc Legros, et al.. The role of disconnections in deformation-coupled grain boundary migration. Acta Materialia, 2014, 77, pp.223-235. 〈10.1016/j.actamat.2014.05.062〉. 〈hal-01729252〉
  • Donatien Martineau, Colette Levade, Marc Legros, Philippe Dupuy, Thomas Mazeaud. Universal mechanisms of Al metallization ageing in power MOSFET devices. Microelectronics Reliability, 2014, 54 (11), pp.2432-2439. 〈10.1016/j.microrel.2014.06.010〉. 〈hal-01729249〉
  • Ludvig De Knoop, Marc Legros. Absorption of crystal/amorphous interfacial dislocations during in situ TEM nanoindentation of an Al thin film on Si. Scripta Materialia, Elsevier, 2014, 74, pp.44-47. 〈10.1016/j.scriptamat.2013.10.003〉. 〈hal-01729248〉
  • J.A. Sharon, Y. Zhang, Frédéric Mompiou, Marc Legros, K.J. Hemker. Discerning size effect strengthening in ultrafine-grained Mg thin films. Scripta Materialia, Elsevier, 2014, 75, pp.10-13. 〈10.1016/j.scriptamat.2013.10.016〉. 〈hal-01729250〉
  • Frédéric Mompiou, Marc Legros, A. Boe, M. Coulombier, J.P. Raskin, et al.. Inter- and intragranular plasticity mechanisms in ultrafine-grained Al thin films : an in situ TEM study. Acta Materialia, Elsevier, 2013, 61, pp.205-216. 〈10.1016/j.actamat.2012.09.051〉. 〈hal-00795948〉
  • P. Castany, Marc Legros. Preparation of H-bar cross-sectional specimen for in situ TEM straining experiments: a FIB-based method applied to a nitrided Ti-6Al-4V alloy. Materials Science and Engineering: A, Elsevier, 2011, 528 (3), pp.1367-1371. 〈10.1016/j.msea.2010.10.025〉. 〈hal-00864910〉
  • M. Chassagne, Marc Legros, D. Rodney. Atomic-scale simulation of screw dislocation/coherent twin boundary interaction in Al, Au, Cu and Ni. Acta Materialia, Elsevier, 2011, 59 (4), pp.1456-1463. 〈10.1016/j.actamat.2010.11.007〉. 〈hal-00633958〉
  • S. Brandstetter, E.F. Rauch, V. Carreau, S. Maitrejean, M. Verdier, et al.. Pattern size dependence of grain growth in Cu interconnects. Scripta Materialia, Elsevier, 2010, 63 (10), pp.965-968. 〈10.1016/j.scriptamat.2010.07.017〉. 〈hal-00532978〉
  • S. Brandstetter, V. Carreau, S. Maitrejean, M. Verdier, Marc Legros. Grain morphology of Cu damascene lines. Microelectronic Engineering, Elsevier, 2010, 87 (3), pp.383-386. 〈10.1016/j.mee.2009.05.033〉. 〈hal-00528039〉
  • Marc Legros, Olivier Ferry, Florent Houdellier, Alain Jacques, Amand George. Fatigue of single crystalline silicon: Mechanical behaviour and TEM observations. Materials Science and Engineering: A, Elsevier, 2008, 483-484, pp.353 - 364. 〈10.1016/j.msea.2006.10.200〉. 〈hal-01741996〉
  • Marc Legros, Belkhiri Kaouache, Patrice Gergaud, Olivier Thomas, Gerhard Dehm, et al.. Pipe diffusion ripening of Si precipitates in Al-0.5%Cu-1%Si thin films. Philosophical Magazine, Taylor & Francis, 2004, 85 (30), pp.3541. 〈10.1080/14786430500228374〉. 〈hal-00513555〉
  • F. Christensen, S. Abdali, P. Frederiksen, A. Hornstrup, I. Rasmussen, et al.. Some applications of nanometer scale structures for current and future X-ray space research. Journal de Physique III, EDP Sciences, 1994, 4 (9), pp.1599-1612. 〈10.1051/jp3:1994227〉. 〈jpa-00249210〉

Communication dans un congrès6 documents

  • A Lantreibecq, Jean-Philippe Monchoux, E Pihan, Benoit Marie, Marc Legros. Subgrains, micro-twins and dislocations characterization in monolike Si using TEM and in-situ TEM. Extended Defects In Semiconductors 2016 (EDS 2016), Sep 2016, Les Issambres, France. 2016, 〈https://eds2016.sciencesconf.org/〉. 〈hal-01571054v2〉
  • Marc Legros, Frédéric Mompiou. Tiny but mighty: Size effects on the strength of metals. Nanotechnology Materials and Devices Conference (NMDC), 2016 IEEE, 2016, Unknown, Unknown Region. Institute of Electrical and Electronics Engineers Inc., 2016, 〈10.1109/NMDC.2016.7777176〉. 〈hal-01729244〉
  • Roberta Ruffilli, Mounira Berkani, Gilles Rostaing, Marc Legros, Stéphane Lefebvre, et al.. Analyse du vieillissement de la métallisation d'un MOSFET par la distribution du potentiel de source. Symposium de Genie Electrique, Jun 2016, Grenoble, France. 〈hal-01361625〉
  • Frédéric Mompiou, Marc Legros, A. Boé, M. Coulombier, J.P. Raskin, et al.. Exploring grain boundary response to a mechanical stress in small grained metals by in-situ transmission electron microscopy. XIV International Conference on Intergranular and Interphase Boundaries in Materials, IIB 2013, 2013, Halkidiki, Greece. 〈hal-00878474〉
  • S. Maitrejean, V. Carreau, O. Thomas, S. Labat, B. Kaouache, et al.. Cu grain growth in damascene narrow trenches. Stress Induced phenomenan in Metallization, 2008, Austin, United States. 2008. 〈hal-00370064〉
  • S. Maitrejean, C. Cayron, M. Verdier, O. Thomas, Marc Legros. CRISTAL: Contrôle de la Résistivité des Interconnexions: maîtrise de la micro-Structure du métal. Journées Nanosciences & Nanotechnologies, Sep 2007, France. 〈hal-00214190〉

Pré-publication, Document de travail1 document

  • Roberta Ruffilli, M Berkani, P Dupuy, S Lefebvre, Y Weber, et al.. Aluminum metallization and wire bonding aging in power MOSFET modules. 2017. 〈hal-01491384〉