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Louis Pascal TRAN HUU HUE

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guy-feuillard

POROUS METAL BACKING FOR HIGH-TEMPERATURE ULTRASONIC TRANSDUCERS

Dang-Chi Nguyen , F. Navacchia , Louis-Pascal Tran-Huu-Hue , Guy Feuillard
16th Asia Pacific Conference for Non-Destructive, Feb 2023, Melbourne, Australia
Communication dans un congrès hal-04057216v1

Modelling and study of hysteretic behaviour of soft and hard piezoceramic materials under external mechanical stress

Mathieu Domenjoud , M. Lematre , Julien Bustillo , Guy Feuillard , Louis-Pascal Tran Huu Hue
Electroceramics for End-users, Mar 2013, Les Arcs, France. pp.37-40
Communication dans un congrès hal-01235747v1

Modeling and numerical study of the electroacoustic behavior of lithium niobate under an initial electrical stress

Mathieu Domenjoud , M. Lematre , Jérôme Fortineau , Guy Feuillard , Louis-Pascal Tran Huu Hue
IEEE International Symposium on the Applications of Ferroelectrics – Piezoresponse Force Microscopy, Jul 2013, Prague, Czech Republic. pp.30-33, ⟨10.1109/ISAF.2013.6748712⟩
Communication dans un congrès hal-01235721v1

Electro-acoustic characterisations of piezoelectric materials under external mechanical stress: Theory and experiments

Mathieu Domenjoud , Mickael Lematre , Louis-Pascal Tran Huu Hue , Guy Feuillard
, Electroceramics for End-users, Feb 2011, Sestriere, Italy
Communication dans un congrès hal-01235845v1

Integrated piezoelectric structures under external mechanical stress: Theory and experiments

Mathieu Domenjoud , M. Lematre , Louis-Pascal Tran Huu Hue , Guy Feuillard
IEEE International Ultrasonics Symposium, Oct 2010, San Diego, United States. pp.2080-2082, ⟨10.1109/ULTSYM.2010.5935880⟩
Communication dans un congrès hal-01235663v1