Laurent DUPONT

Documents

Identifiants chercheurs

ldupont
0000-0001-7597-0317
Google Scholar : https://scholar.google.fr/citations?user=5vok71cAAAAJ&hl=fr
IdRef : 080021638

Présentation

Publications

	Proof-of-Concept for an On-Chip Kelvin-Emitter RTD Sensor for Junction Temperature Monitoring of IGBTs Nick Baker , Laurent Dupont , Szymon Michal Beczkowski , Francesco Iannuzzo IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024, pp.1-1. ⟨10.1109/TCPMT.2024.3370951⟩ Article dans une revue hal-04489095v1
	A Method for Accelerated Aging Tests of Power Modules for Photovoltaic Inverters Considering the Inverter Mission Profiles Mouhannad Dbeiss , Yvan Avenas , Henri Zara , Laurent Dupont , Laurent Dupont IEEE Transactions on Power Electronics, 2019, 34 (12), pp.12226-12234. ⟨10.1109/TPEL.2019.2907218⟩ Article dans une revue hal-03230523v1
	Electrothermal evaluation of single and multiple solder void effects on low-voltage Si MOSFET behavior in forward bias conditions Son Ha Tran , Laurent Dupont , Zoubir Khatir IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017, 99, ⟨10.1109/TCPMT.2016.2633582⟩ Article dans une revue hal-01466016v1
	Realization and characterization of instrumented power diode with aluminum RTD sensor–application to thermal impedance evaluation Ibrahima Ka , Yvan Avenas , Laurent Dupont , Mickael Petit European Power Electronics and Drives Journal, 2017, 27, ⟨10.1080/09398368.2017.1388626⟩ Article dans une revue hal-01676095v1
	IR Camera Validation of IGBT Junction Temperature Measurement via Peak Gate Current Nick Baker , Laurent Dupont , Stig Munk-Nielsen , Francesco Iannuzzo , Marco Liserre IEEE Transactions on Power Electronics, 2017, 32 (4), pp.3099 - 3111. ⟨10.1109/TPEL.2016.2573761⟩ Article dans une revue hal-01704618v1
	Numerical and Experimental Evaluation of the Microsecond Pulsed Heating Curve Technique Dedicated to Die Interconnection Characterization Benoit Thollin , Laurent Dupont , Yvan Avenas , Jean Christophe Crebier , Zoubir Khatir IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 6 (6), pp. 835-45. ⟨10.1109/TCPMT.2016.2554538⟩ Article dans une revue hal-01466101v1
	Condition Monitoring: A Decade of Proposed Techniques Yvan Avenas , Laurent Dupont , Nick Baker , Henri Zara , Franck Barruel IEEE Industrial Electronics Magazine, 2015, 9 (4), pp. 22-36. ⟨10.1109/MIE.2015.2481564⟩ Article dans une revue hal-01675317v1
	Preliminary Evaluation of Thermo-Sensitive Electrical Parameters Based on the Forward Voltage for Online Chip Temperature Measurements of IGBT Devices Laurent Dupont , Yvan Avenas IEEE Transactions on Industry Applications, 2015, 6 (51), pp.4688-4698. ⟨10.1109/TIA.2015.2458973⟩ Article dans une revue hal-01466116v1
	Direct Copper Bonding for Power Interconnects: Design, Manufacturing, and Test Bassem Mouawad , Benoit Thollin , Cyril Buttay , Laurent Dupont , Vincent Bley IEEE Transactions on Components, Packaging and Manufacturing Technology. Part A, Manufacturing Technology, 2015, 5 (1), pp.143-150. ⟨10.1109/TCPMT.2014.2376882⟩ Article dans une revue hal-01207014v1
	Improved reliability of power modules: A review of online junction temperature measurement methods Nick Baker , Marco Liserre , Laurent Dupont , Yvan Avenas IEEE Industrial Electronics Magazine, 2014, 8 (3), pp.17-27. ⟨10.1109/MIE.2014.2312427⟩ Article dans une revue hal-01704723v1
	Comparison of junction temperature evaluations in a power IGBT module using an IR camera and three thermo-sensitive electrical parameters Laurent Dupont , Yvan Avenas , Pierre Olivier Jannin IEEE Transactions on Industry Applications, 2013, 49 (4), pp.1599-1608. ⟨10.1109/TIA.2013.2255852⟩ Article dans une revue hal-01059069v1
	Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters - A Review Yvan Avenas , Laurent Dupont , Zoubir Khatir IEEE Transactions on Power Electronics, 2012, 27, p.3081-3092. ⟨10.1109/TPEL.2011.2178433⟩ Article dans une revue hal-01687280v1
	Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters – A Review Yvan Avenas , Laurent Dupont , Zoubir Khatir IEEE Transactions on Power Electronics, 2012, 27 (6), pp.3081-3092 Article dans une revue hal-01073933v1
	Evaluation of IGBT thermo-sensitive electrical parameters under different dissipation conditions – Comparison with infrared measurements Yvan Avenas , Laurent Dupont Microelectronics Reliability, 2012, 52 (11), pp.2617-2626. ⟨10.1016/j.microrel.2012.03.032⟩ Article dans une revue hal-01059453v1
	Characterization and aging test methodology for power electronic devices at high temperature Ali Ibrahim , Zoubir Khatir , Laurent Dupont Advanced Materials Research, 2011, 324, pp 411-414. ⟨10.4028/www.scientific.net/AMR.324.411⟩ Article dans une revue hal-01701988v1
	Investigations on junction temperature estimation based on junction voltage measurements Zoubir Khatir , Laurent Dupont , Ali Ibrahim Microelectronics Reliability, 2010, 50 (9-11), pp 1506-1510. ⟨10.1016/j.microrel.2010.07.102⟩ Article dans une revue hal-01704413v1
	Experimental and numerical results correlation during extreme use of power MOSFET designed for avalanche functional mode Laurent Dupont , Jean-Louis Blanchard , Richard Lallemand , Gérard Coquery , Jean-Michel Morelle Microelectronics Reliability, 2010, 50 (9-11), pp 1804-1809. ⟨10.1016/j.microrel.2010.07.127⟩ Article dans une revue hal-01704309v1
	Degradation behavior of 600 V-200 A IGBT modules under power cycling and high temperature environment conditions Mounira Bouarroudj-Berkani , Zoubir Khatir , Jean-Pierre Ousten , F. Badel , Laurent Dupont Microelectronics Reliability, 2007, 47, pp.719-1724 Article dans une revue hal-00869421v1
	Evaluation de technologies de substrats céramiques sous des cyclages en température de forte amplitude Laurent Dupont , Zoubir Khatir , Stéphane Lefebvre , Serge Bontemps , Régis Meuret Revue Internationale de Génie Électrique, 2007, 10 (5), p625-639 Article dans une revue hal-01704096v1
	Failure modes on low voltage power MOSFETs under high temperature application Laurent Dupont , Stéphane Lefebvre , Mounira Bouarroudj , Zoubir Khatir , Jean-Claude Faugieres Microelectronics Reliability, 2007, 47 (9), p1767-1772. ⟨10.1016/j.microrel.2007.07.066⟩ Article dans une revue hal-01704346v1
	Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling Laurent Dupont , Zoubir Khatir , Stéphane Lefebvre , Serge Bontemps Microelectronics Reliability, 2006, 46 (9-11), pp.1766-1771. ⟨10.1016/j.microrel.2006.07.057⟩ Article dans une revue hal-01703983v1
	Composants à semi-conducteur de puissance pour des applications à haute température de fonctionnement Bruno Allard , Gérard Coquery , Laurent Dupont , Zoubir Khatir , Mihai Lazar Journal sur l'enseignement des sciences et technologies de l'information et des systèmes, 2005, 4 (HS), pp. 18-19. ⟨10.1051/bib-j3ea:2005610⟩ Article dans une revue hal-01702019v1
	Banc de cyclage actif pour l'analyse de la fatigue thermique des brasures de composants IGBTs Laurent Dupont , Stéphane Lefebvre , Zoubir Khatir , Gérard Coquery , Jean-Claude Faugiere La Revue de l'électricité et de l'électronique, 2004, 2, pp.45-51 Article dans une revue hal-00861641v1

	État de l'art de la recherche vers une électronique de puissance soutenable Bruno Allard , Morgan Almanza , Matthieu Beley , H. Ben Ahmed , Daniel Chatroux Symposium de Génie Electrique (SGE2023), Jul 2023, Lille, France Communication dans un congrès hal-04244521v1
	Optimal energy management of offshore wind farms considering the combination of overplanting and dynamic rating Ildar Daminov , Anne Blavette , Salvy Bourguet , Hamid Ben Ahmed , Pierre Warlop Cigré Paris session, Aug 2022, Paris, France Communication dans un congrès hal-03767635v1
	TAPIR (compacT and modulAr Power modules with IntegRated cooling) Technology: Goals and Challenges Wendpanga-Fadel Bikinga , Bachir Mezrag , Yvan Avenas , Jean-Luc Schanen , Jean-Michel Guichon 3D-PEIM, Jun 2021, Osaka, Japan. pp.1-6, ⟨10.1109/3D-PEIM49630.2021.9497263⟩ Communication dans un congrès hal-03629431v1
	In-situ condition monitoring system to study the ageing of power semi-conductor devices in photovoltaic inverters Mouhannad Dbeiss , Yvan Avenas , Henri Zara , Laurent Dupont CIPS 2018, Mar 2018, stuutgart, Germany Communication dans un congrès hal-01753108v1
	A method for accelerated ageing tests of photovoltaic inverters considering the application's mission profiles Mouhannad-G Dbeiss , Yvan Avenas , Henri Zara , Laurent Dupont 2017 19th European Conference on Power Electronics and Applications (EPE'17 ECCE Europe), Sep 2017, Varsovie, Poland. pp.1-10, ⟨10.23919/EPE17ECCEEurope.2017.8099055⟩ Communication dans un congrès hal-01689604v1
	Thermal characterization of an IGBT power module with on-die temperature sensors Badr El Boudour Bidouche , Yvan Avenas , Mouslim Essakili , Laurent Dupont APEC 2017 - IEEE Applied Power Electronics Conference and Exposition, May 2017, Tampa, United States. pp. 2317-2322, ⟨10.1109/APEC.2017.7931023⟩ Communication dans un congrès hal-01687242v1
	Experimental Evaluation of IGBT Junction Temperature Measurement via a Modified-VCE (VCE_VGE) Method with Series Resistance Removal Nick Baker , Francesco Iannuzzo , Stig Munk-Nielsen , Laurent Dupont , Yvan Avenas CIPS2016 - 9th Conference on Integrated Power Electronics Systems, Mar 2016, Nuremberg, Germany. 6p Communication dans un congrès hal-01466153v1
	Instrumented chip dedicated to semiconductor temperature measurements in power electronic converters Ibrahima Ka , Yvan Avenas , Laurent Dupont , Raha Vafaei , Benoît Thollin ECCE 2016 - IEEE Energy Conversion Congress and Exposition, Sep 2016, Milwaukee, United States. 11p, ⟨10.1109/ECCE.2016.7855208⟩ Communication dans un congrès hal-01684165v1
	Développement d'une puce instrumentée adaptée à la mesure de température dans les modules de puissance Ibrahima Ka , Yvan Avenas , Laurent Dupont , Mickael Petit 2ème Symposium de Génie Electrique (SGE 2016), Jun 2016, Grenoble, France Communication dans un congrès hal-01466194v2
	Instrumented Chip Dedicated to Semiconductor Temperature Measurements in Power Electronic Converters Ibrahima Ka , Yvan Avenas , Laurent Dupont , Raha Vafaei , Benoit Thollin Energy Conversion Congress and Exposition (ECCE 2016), Oct 2016, Milwaukee, United States Communication dans un congrès hal-01377217v1
	Experimental evaluation of IGBT junction temperature measurement via peak gate current Nick Baker , Stig Munk-Nielsen , Francesco Iannuzzo , Laurent Dupont , Marco Liserre EPE'15 ECCE-Europe, 2015 17th European Conference on Power Electronics and Applications, Sep 2015, Genève, Switzerland. 11p., ⟨10.1109/EPE.2015.7311733⟩ Communication dans un congrès hal-01704586v1
	Evaluation de paramètres thermosensibles basés sur la mesure de la tension directe de composants IGBT pour une utilisation dans des conditions d'usage Laurent Dupont , Yvan Avenas Symposium de Génie Électrique 2014, Jul 2014, Cachan, France Communication dans un congrès hal-01065323v1
	Evaluation of Thermo-Sensitive Electrical Parameters Based on the Forward Voltage for On-line Chip Temperature Measurements of IGBT Devices Laurent Dupont , Yvan Avenas ECCE2014, Sep 2014, Pittsburg, United States Communication dans un congrès hal-01069990v1
	Evaluation du comportement électrothermique de transistors MOSFET en conduction en présence de défaut dans la brasure Son Ha Tran , Laurent Dupont , Zoubir Khatir Symposium de Génie Électrique 2014, Jul 2014, Cachan, France Communication dans un congrès hal-01065178v1
	Solder void position and size effects on electro thermal behaviour of MOSFET transistors in forward bias conditions Son Ha Tran , Laurent Dupont , Zoubir Khatir ESREF-25th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Sep 2014, BERLIN, Germany. pp.PP.1921-1926, ⟨10.1016/j.microrel.2014.07.152⟩ Communication dans un congrès hal-01471815v1
	Evaluation de paramètres thermosensibles basés sur la mesure de la tension directe de composants IGBT pour une utilisation dans des conditions d'usage Laurent Dupont , Yvan Avenas Symposium de Génie Electrique - SGE2014, Jul 2014, Cachan, France Communication dans un congrès hal-01024080v1
	Partial Thermal Impedance Measurement for Die Interconnection Characterization by a Microsecond 'Pulsed Heating Curve Technique' Benoit Thollin , Laurent Dupont , Zoubir Khatir , Yvan Avenas , Jean Christophe Crebier European Conference on Power Electronics and Applications, Sep 2013, France. 10p Communication dans un congrès hal-01056909v1
	Junction temperature measurements via thermo-sensitive electrical parameters and their application to condition monitoring and active thermal control of power converters Nick Baker , Marco Liserre , Laurent Dupont , Yvan Avenas IECON 2013 - 39th Annual Conference of the IEEE Industrial Electronics Society, Nov 2013, Vienne, Austria. p. 942-948, ⟨10.1109/IECON.2013.6699260⟩ Communication dans un congrès hal-01704649v1
	Partial Thermal Impedance Measurement for Die Interconnection Characterization by a microsecond "Pulsed Heating Curve Technique Benoît Thollin , Laurent Dupont , Zoubir Khatir , Yvan Avenas , Jean-Christophe Crébier EPE'13 ECCE Europe, 2013, Lille, France Communication dans un congrès hal-00988257v1
	Junction temperature measurements via thermo-sensitive electrical parameters and their application to condition monitoring and active thermal control of power converters N. Baker , M. Liserre , Laurent Dupont , Yvan Avenas Annual Conference of the IEEE Industrial Electronics Society, IECON, 2013, Vienne, Austria. pp.942-948 Communication dans un congrès hal-00988264v1
	Comparison of junction temperature evaluations in a power IGBT module using an IR camera and three thermo-sensitive electrical parameters Laurent Dupont , Yvan Avenas , Pierre Olivier Jeannin APEC 2012 - IEEE Applied Power Electronics Conference and Exposition, Feb 2012, Orlando, United States. p. 182-189, ⟨10.1109/APEC.2012.6165817⟩ Communication dans un congrès hal-01703887v1
	Comparison of junction temperature evaluations in a power IGBT module using an IR camera and three thermo-sensitive electrical parameters Laurent Dupont , Yvan Avenas , Pierre-Olivier Jeannin Applied Power Electronics Conference and Exposition APEC 2012, Feb 2012, Orlando, United States. p 182 à 189 Communication dans un congrès hal-00673411v1
	The combined effect of failure factors in power modules for automotive applications Souad Bachti , Laurent Dupont , Serge Loudot , Gérard Coquery PCIM Europe 2012 - International Exhibition & Conference for Power Electronics, Intelligent Motion and Power Quality 2012, May 2012, Nuremberg, Germany. pp.502-509 Communication dans un congrès hal-01687269v1
	Development and electrical characterization of a vertical electrical and thermal test chip (VTTC) Benoit Thollin , Jean-Christophe Crebier , Yvan Avenas , Pierre-Olivier Jeannin , Zoubir Khatir ECCE 2011 - IEEE Energy Conversion Congress and Exposition: Energy Conversion Innovation for a Clean Energy Future, Sep 2011, PHOENIX, United States. pp.60-67, ⟨10.1109/ECCE.2011.6063749⟩ Communication dans un congrès hal-00881531v1
	Optimization of wire connections design for power electronics Yoshua Celnikier , Laurent Dupont , Eveline Herve , Gérard Coquery , Lahouari Benabou ESREF 2011 - 22nd European Symposium Reliability of Electron Devices, Failure Physics and Analysis, Oct 2011, Bordeaux, France. pp 1892-1897, ⟨10.1016/j.microrel.2011.06.058⟩ Communication dans un congrès hal-01704479v1
	Development and Electrical Characterization of a Vertical Electrical and Thermal Test Chip (VTTC) Benoît Thollin , Jean-Christophe Crébier , Yvan Avenas , Pierre-Olivier Jeannin , Zoubir Khatir ECCE 2011, Sep 2011, Phoenix, United States Communication dans un congrès hal-00627287v1
	Etude d'interfaces thermiques pour le management thermique des modules de puissance Jean Pierre Ousten , Ludovic Menager , Zoubir Khatir , Laurent Dupont EPF 2010 - 10th European Power Electronics Conference, Jun 2010, St Nazaire, France. 5p Communication dans un congrès hal-01704057v1
	Evaluation of multi-void and drain metallization thickness effects on the electro thermal behavior of Si MOSFET under forward bias conditions Son Ha Tran , Laurent Dupont , Zoubir Khatir EPE'17 ECCE Europe - 19th European Conference on Power Electronics and Applications, Sep 2010, Varsovie, Poland. pp.1-10, ⟨10.23919/EPE17ECCEEurope.2017.8099235⟩ Communication dans un congrès hal-01703938v1
	Accelerated Active Ageing Test on SiC JFETs Power Module with Silver Joining Technology for High Temperature Application Laurent Dupont , Gérard Coquery , Kai Kriegel , Ashot Melkonyan ESREF 2009 - 20th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis, Oct 2009, Bordeaux, France. pp. 1375-1380, ⟨10.1016/j.microrel.2009.07.050⟩ Communication dans un congrès hal-01701967v1
	Innovative connectivity for double side cooling and connection of power dice in the context of automotive power mechatronic packaging for high power inverters Jean-Michel Morelle , Laurent Dupont , Gérard Coquery , Yoshua Celnikier APE 2009 - 3rd International Conference Automotive power electronics, Mar 2009, PARIS, France. 6p Communication dans un congrès hal-01704384v1
	Degradation behavior of 600V-200A IGBT modules under Power cycling and high temperature environment conditions Mounira Bouarroudj , Zoubir Khatir , Jean Pierre Ousten , Frédéric Badel , Laurent Dupont 18th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Oct 2007, BORDEAUX, France. pp. 1719-1724, ⟨10.1016/j.microrel.2007.07.027⟩ Communication dans un congrès hal-01702036v1
	Ageing Test Results of low voltage MOSFET Modules for Electrical Vehicles Laurent Dupont , Stéphane Lefebvre , Mounira Bouarroudj , Zoubir Khatir , Jean-Claude Faugieres EPE 2007 - 12th European Conference on Power Electronics and Applications, Sep 2007, Aalborg, Denmark. 10p Communication dans un congrès hal-01701952v1
	Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules Mounira Bouarroudj , Zoubir Khatir , Jean Pierre Ousten , Laurent Dupont , Stéphane Lefebvre EPE 2007 - 12th European Conference on Power Electronics and Applications, Sep 2007, Aalborg, Denmark. 10p, ⟨10.1109/EPE.2007.4417457⟩ Communication dans un congrès hal-01702003v1
	Evaluation de technologies de substrats céramiques sous des cyclages en température de forte amplitude Laurent Dupont , Stéphane Lefebvre , Zoubir Khatir , Serge Bontemps , Régis Meuret EPF 2006 - Electronique de Puissance du Futur, Jul 2006, Grenoble, France. 6p Communication dans un congrès hal-01704147v1
	Evaluation of Substrate Technologies under High Temperature Cycling Laurent Dupont , Stéphane Lefebvre , Zoubir Khatir , Serge Bontemps CIPS 2006 - 4th International Conference on Integrated Power Electronics Systems, Jun 2006, Naples, Italy. 6p Communication dans un congrès hal-01704198v1
	Fiabilité des composants de puissance dans des environnements hautes températures Laurent Dupont , Zoubir Khatir , Stéphane Lefebvre , Régis Meuret , Serge Bontemps (ITCT 2006 - Journées internationales d'études Ingénieries des Technologies Communes aux Transports terrestres, maritimes, aériens et spatiaux, Nov 2006, Paris, France. 6p Communication dans un congrès hal-01704363v1
	Evaluation of thermo-mechanical stresses of a power module dedicated to high temperature applications Laurent Dupont , Régis Meuret , Zoubir Khatir , B Parmentier , Stéphane Lefebvre HITEN 2005 - International Conference on High Temperature Electronics, Sep 2005, Paris, France. 6p Communication dans un congrès hal-01704218v1
	Electrical Characterizations and evaluation of thermo-mechanical stresses of a power module dedicated to high temperature applications Laurent Dupont , Zoubir Khatir , Stéphane Lefebvre , Régis Meuret , B Parmentier EPE 2005 - 11th European Conférence on Power Electronics and Applications, Sep 2005, Dresde, Germany. 11p, ⟨10.1109/EPE.2005.219580⟩ Communication dans un congrès hal-01704015v1
	Characterisation of silicon carbide schottky diodes and COOLMOS transistors at high temperature Laurent Dupont , Stéphane Lefebvre , Zoubir Khatir , Serge Bontemps , Régis Meuret PESC 04 - IEEE 35th annual Power Electronics Specialists Conference, Jun 2004, AIX LA CHAPELLE, Germany. ⟨10.1109/PESC.2004.1355810⟩ Communication dans un congrès hal-01701982v1
	Development of high temperature power module for avionics applications Laurent Dupont , Stéphane Lefebvre , Serge Bontemps , Zoubir Khatir , Régis Meuret PCIM 2004 - International conference power electronics, intelligent motion, power quality, May 2004, Nuremberg, Germany. pp.6P Communication dans un congrès hal-01702065v1
	Développement d'un module de puissance pour tester la fiabilité d'un convertisseur haute température Laurent Dupont , Stéphane Lefebvre , Zoubir Khatir , Serge Bontemps , Régis Meuret SAAEI-EPF 2004 - Annual seminar on automatic control, industrial electronics and instrumentation, Electronique de puissance du futur, Sep 2004, Toulouse, France. pp.3-6 Communication dans un congrès hal-01702105v1
	Power Cycling Test Circuit for Thermal Fatigue Resistance Analysis of Solder Joints in IGBT Laurent Dupont , Stéphane Lefebvre , Zoubir Khatir , Jean Claude Faugiere 10th European Conférence on Power Electronics and Applications, Sep 2003, France. 8p Communication dans un congrès hal-00868868v1

	Procédé appliqué à un module de puissance d'un onduleur photovoltaïque pour obtenir un vieillissement accéléré Laurent Dupont France, Patent n° : FR3066605A1·2018-11-23. 2018 Brevet hal-04482388v1

	Contribution à l’étude de la durée de vie des assemblages de puissance dans des environnements haute température avec des cycles thermiques de grande amplitude Laurent Dupont 2006, 189 p Autre publication scientifique hal-00983098v1

	Contribution à l'étude de la durée de vie des assemblages de puissance dans des environnements haute température et avec des cycles thermiques de grande amplitude Laurent Dupont Energie électrique. École normale supérieure de Cachan - ENS Cachan, 2006. Français. ⟨NNT : ⟩ Thèse tel-00091782v1

Laurent DUPONT

Présentation

Publications

Proof-of-Concept for an On-Chip Kelvin-Emitter RTD Sensor for Junction Temperature Monitoring of IGBTs

A Method for Accelerated Aging Tests of Power Modules for Photovoltaic Inverters Considering the Inverter Mission Profiles

Electrothermal evaluation of single and multiple solder void effects on low-voltage Si MOSFET behavior in forward bias conditions

Realization and characterization of instrumented power diode with aluminum RTD sensor–application to thermal impedance evaluation

IR Camera Validation of IGBT Junction Temperature Measurement via Peak Gate Current

Numerical and Experimental Evaluation of the Microsecond Pulsed Heating Curve Technique Dedicated to Die Interconnection Characterization

Condition Monitoring: A Decade of Proposed Techniques

Preliminary Evaluation of Thermo-Sensitive Electrical Parameters Based on the Forward Voltage for Online Chip Temperature Measurements of IGBT Devices

Direct Copper Bonding for Power Interconnects: Design, Manufacturing, and Test

Improved reliability of power modules: A review of online junction temperature measurement methods

Comparison of junction temperature evaluations in a power IGBT module using an IR camera and three thermo-sensitive electrical parameters

Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters - A Review

Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters – A Review

Evaluation of IGBT thermo-sensitive electrical parameters under different dissipation conditions – Comparison with infrared measurements

Characterization and aging test methodology for power electronic devices at high temperature

Investigations on junction temperature estimation based on junction voltage measurements

Experimental and numerical results correlation during extreme use of power MOSFET designed for avalanche functional mode

Degradation behavior of 600 V-200 A IGBT modules under power cycling and high temperature environment conditions

Evaluation de technologies de substrats céramiques sous des cyclages en température de forte amplitude

Failure modes on low voltage power MOSFETs under high temperature application

Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling

Composants à semi-conducteur de puissance pour des applications à haute température de fonctionnement

Banc de cyclage actif pour l'analyse de la fatigue thermique des brasures de composants IGBTs

État de l'art de la recherche vers une électronique de puissance soutenable

Optimal energy management of offshore wind farms considering the combination of overplanting and dynamic rating

TAPIR (compacT and modulAr Power modules with IntegRated cooling) Technology: Goals and Challenges

In-situ condition monitoring system to study the ageing of power semi-conductor devices in photovoltaic inverters

A method for accelerated ageing tests of photovoltaic inverters considering the application's mission profiles

Thermal characterization of an IGBT power module with on-die temperature sensors

Experimental Evaluation of IGBT Junction Temperature Measurement via a Modified-VCE (VCE_VGE) Method with Series Resistance Removal

Instrumented chip dedicated to semiconductor temperature measurements in power electronic converters

Développement d'une puce instrumentée adaptée à la mesure de température dans les modules de puissance

Instrumented Chip Dedicated to Semiconductor Temperature Measurements in Power Electronic Converters

Experimental evaluation of IGBT junction temperature measurement via peak gate current

Evaluation de paramètres thermosensibles basés sur la mesure de la tension directe de composants IGBT pour une utilisation dans des conditions d'usage

Evaluation of Thermo-Sensitive Electrical Parameters Based on the Forward Voltage for On-line Chip Temperature Measurements of IGBT Devices

Evaluation du comportement électrothermique de transistors MOSFET en conduction en présence de défaut dans la brasure

Solder void position and size effects on electro thermal behaviour of MOSFET transistors in forward bias conditions

Evaluation de paramètres thermosensibles basés sur la mesure de la tension directe de composants IGBT pour une utilisation dans des conditions d'usage

Partial Thermal Impedance Measurement for Die Interconnection Characterization by a Microsecond 'Pulsed Heating Curve Technique'

Junction temperature measurements via thermo-sensitive electrical parameters and their application to condition monitoring and active thermal control of power converters

Partial Thermal Impedance Measurement for Die Interconnection Characterization by a microsecond "Pulsed Heating Curve Technique

Junction temperature measurements via thermo-sensitive electrical parameters and their application to condition monitoring and active thermal control of power converters

Comparison of junction temperature evaluations in a power IGBT module using an IR camera and three thermo-sensitive electrical parameters

Comparison of junction temperature evaluations in a power IGBT module using an IR camera and three thermo-sensitive electrical parameters

The combined effect of failure factors in power modules for automotive applications

Development and electrical characterization of a vertical electrical and thermal test chip (VTTC)

Optimization of wire connections design for power electronics

Development and Electrical Characterization of a Vertical Electrical and Thermal Test Chip (VTTC)

Etude d'interfaces thermiques pour le management thermique des modules de puissance

Evaluation of multi-void and drain metallization thickness effects on the electro thermal behavior of Si MOSFET under forward bias conditions

Accelerated Active Ageing Test on SiC JFETs Power Module with Silver Joining Technology for High Temperature Application

Innovative connectivity for double side cooling and connection of power dice in the context of automotive power mechatronic packaging for high power inverters

Degradation behavior of 600V-200A IGBT modules under Power cycling and high temperature environment conditions

Ageing Test Results of low voltage MOSFET Modules for Electrical Vehicles

Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules

Evaluation de technologies de substrats céramiques sous des cyclages en température de forte amplitude

Evaluation of Substrate Technologies under High Temperature Cycling

Fiabilité des composants de puissance dans des environnements hautes températures

Evaluation of thermo-mechanical stresses of a power module dedicated to high temperature applications

Electrical Characterizations and evaluation of thermo-mechanical stresses of a power module dedicated to high temperature applications

Characterisation of silicon carbide schottky diodes and COOLMOS transistors at high temperature

Development of high temperature power module for avionics applications

Développement d'un module de puissance pour tester la fiabilité d'un convertisseur haute température

Power Cycling Test Circuit for Thermal Fatigue Resistance Analysis of Solder Joints in IGBT

Procédé appliqué à un module de puissance d'un onduleur photovoltaïque pour obtenir un vieillissement accéléré

Contribution à l’étude de la durée de vie des assemblages de puissance dans des environnements haute température avec des cycles thermiques de grande amplitude

Contribution à l'étude de la durée de vie des assemblages de puissance dans des environnements haute température et avec des cycles thermiques de grande amplitude