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68

Laurent Dupont - Chargé de recherche SATIE-IFSTTAR


Article dans une revue25 documents

  • Son Ha Tran, Laurent Dupont, Zoubir Khatir. Electrothermal evaluation of single and multiple solder void effects on low-voltage Si MOSFET behavior in forward bias conditions. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017, 9p. 〈10.1109/TCPMT.2016.2633582〉. 〈hal-01466016〉
  • Nick Baker, Laurent Dupont, Stig Munk-Nielsen, Francesco Iannuzzo, Marco Liserre. IR Camera Validation of IGBT Junction Temperature Measurement via Peak Gate Current. IEEE Transactions on Power Electronics, 2017, 32 (4), pp.3099 - 3111. 〈10.1109/TPEL.2016.2573761〉. 〈hal-01704618〉
  • Ibrahima Ka, Yvan Avenas, Laurent Dupont, Mickael Petit. Realization and characterization of instrumented power diode with aluminum RTD sensor–application to thermal impedance evaluation. European Power Electronics and Drives Journal, 2017, 27, 〈10.1080/09398368.2017.1388626〉. 〈hal-01676095〉
  • Benoit Thollin, Laurent Dupont, Yvan Avenas, Jean Christophe Crebier, Zoubir Khatir. Numerical and Experimental Evaluation of the Microsecond Pulsed Heating Curve Technique Dedicated to Die Interconnection Characterization. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 6 (6), pp. 835-45. 〈10.1109/TCPMT.2016.2554538〉. 〈hal-01466101〉
  • Bassem Mouawad, Benoit Thollin, Cyril Buttay, Laurent Dupont, Vincent Bley, et al.. Direct Copper Bonding for Power Interconnects: Design, Manufacturing, and Test. Components, Packaging and Manufacturing Technology, IEEE Transactions on, 2015, 5 (1), pp.143-150. 〈http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6983597〉. 〈hal-01207014〉
  • Laurent Dupont, Yvan Avenas. Preliminary Evaluation of Thermo-Sensitive Electrical Parameters Based on the Forward Voltage for Online Chip Temperature Measurements of IGBT Devices. IEEE Transactions on Industry Applications, Institute of Electrical and Electronics Engineers, 2015, 6 (51), pp.4688-4698. 〈10.1109/TIA.2015.2458973〉. 〈hal-01466116〉
  • Yvan Avenas, Laurent Dupont, Nick Baker, Henri Zara, Franck Barruel. Condition Monitoring: A Decade of Proposed Techniques. IEEE Industrial Electronics Magazine, 2015, 9 (4), pp. 22-36. 〈10.1109/MIE.2015.2481564〉. 〈hal-01675317〉
  • Bassem Mouawad, Benoit Thollin, Cyril Buttay, Laurent Dupont, Vincent Bley, et al.. Direct Copper Bonding for Power Interconnects: Design, Manufacturing and Test. IEEE Transactions on Components and Packaging Technologies, Institute of Electrical and Electronics Engineers, 2015, 5 (1), pp.143-150. 〈10.1109/TCPMT.2014.2376882〉. 〈hal-01703959〉
  • Nick Baker, Marco Liserre, Laurent Dupont, Yvan Avenas. Improved reliability of power modules: A review of online junction temperature measurement methods. IEEE Industrial Electronics Magazine, 2014, 8 (3), pp.17-27. 〈10.1109/MIE.2014.2312427〉. 〈hal-01704723〉
  • Laurent Dupont, Yvan Avenas, Pierre Olivier Jannin. Comparison of junction temperature evaluations in a power IGBT module using an IR camera and three thermo-sensitive electrical parameters. IEEE Transactions on Industry Applications, Institute of Electrical and Electronics Engineers, 2013, 49 (4), pp. 1599-1608. 〈10.1109/TIA.2013.2255852〉. 〈hal-01059069〉
  • Laurent Dupont, Yvan Avenas, Pierre-Olivier Jeannin. Comparison of junction temperature evaluations in a power IGBT module using an IR camera and three thermo-sensitive electrical parameters. IEEE Transactions on Industry Applications, Institute of Electrical and Electronics Engineers, 2013, 49 (4), pp.1599-1608. 〈hal-00988200〉
  • Yvan Avenas, Laurent Dupont, Zoubir Khatir. Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters--A Review. IEEE Transactions on Power Electronics, Institute of Electrical and Electronics Engineers, 2012, 27 (6), pp.3081 - 3092. 〈hal-00709838〉
  • Yvan Avenas, Laurent Dupont, Zoubir Khatir. Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters – A Review. IEEE Transactions on Power Electronics, Institute of Electrical and Electronics Engineers, 2012, 27 (6), pp 3081-3092. 〈hal-01073933〉
  • Yvan Avenas, Laurent Dupont, Zoubir Khatir. Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters - A Review. IEEE Transactions on Power Electronics, Institute of Electrical and Electronics Engineers, 2012, p.3081-3092. 〈10.1109/TPEL.2011.2178433〉. 〈hal-01687280〉
  • Yvan Avenas, Laurent Dupont. Evaluation of IGBT thermo-sensitive electrical parameters under different dissipation conditions - Comparison with infrared measurements. Microelectronics Reliability, Elsevier, 2012, 52 (11), pp.2617-2626. 〈hal-00742139〉
  • Yvan Avenas, Laurent Dupont. Evaluation of IGBT thermo-sensitive electrical parameters under different dissipation conditions – Comparison with infrared measurements. Microelectronics Reliability, Elsevier, 2012, 52 (11), pp. 2617-2626. 〈10.1016/j.microrel.2012.03.032〉. 〈hal-01059453〉
  • Ali Ibrahim, Zoubir Khatir, Laurent Dupont. Characterization and aging test methodology for power electronic devices at high temperature. Advanced Materials Research, 2011, 324, pp 411-414. 〈10.4028/www.scientific.net/AMR.324.411〉. 〈hal-01701988〉
  • Zoubir Khatir, Laurent Dupont, Ali Ibrahim. Investigations on junction temperature estimation based on junction voltage measurements. Microelectronics Reliability, 2010, 50 (9-11), pp 1506-1510. 〈10.1016/j.microrel.2010.07.102〉. 〈hal-01704413〉
  • Laurent Dupont, Jean-Louis Blanchard, Richard Lallemand, Gérard Coquery, Jean-Michel Morelle, et al.. Experimental and numerical results correlation during extreme use of power MOSFET designed for avalanche functional mode. Microelectronics Reliability, Elsevier, 2010, 50 (9-11), pp 1804-1809. 〈10.1016/j.microrel.2010.07.127〉. 〈hal-01704309〉
  • Laurent Dupont, Zoubir Khatir, Stéphane Lefebvre, Serge Bontemps, Régis Meuret. Evaluation de technologies de substrats céramiques sous des cyclages en température de forte amplitude. Revue Internationale de Génie Électrique, 2007, 10 (5), p625-639. 〈hal-01704096〉
  • Laurent Dupont, Stéphane Lefebvre, Mounira Bouarroudj, Zoubir Khatir, Jean-Claude Faugieres. Failure modes on low voltage power MOSFETs under high temperature application. Microelectronics Reliability, 2007, 47 (9), p1767-1772. 〈10.1016/j.microrel.2007.07.066〉. 〈hal-01704346〉
  • Mounira Bouarroudj-Berkani, Zoubir Khatir, Jean-Pierre Ousten, F. Badel, Laurent Dupont, et al.. Degradation behavior of 600 V-200 A IGBT modules under power cycling and high temperature environment conditions. Microelectronics Reliability, Elsevier, 2007, 47, pp.719-1724. 〈hal-00869421〉
  • Laurent Dupont, Zoubir Khatir, Stéphane Lefebvre, Serge Bontemps. Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling. Microelectronics Reliability, 2006, 46 (9-11), pp.1766-1771. 〈10.1016/j.microrel.2006.07.057〉. 〈hal-01703983〉
  • Bruno Allard, Gérard Coquery, Laurent Dupont, Zoubir Khatir, Mihai Bogdan Lazar, et al.. Composants à semi-conducteur de puissance pour des applications à haute température de fonctionnement. J3eA, 2005, 4 (HS), pp. 18-19. 〈10.1051/bib-j3ea:2005610〉. 〈hal-01702019〉
  • Laurent Dupont, Stéphane Lefebvre, Zoubir Khatir, Gérard Coquery, Jean-Claude Faugiere. Banc de cyclage actif pour l'analyse de la fatigue thermique des brasures de composants IGBTs. Revue de l'Electricité et de l'Electronique REE, 2004, pp.45-51. 〈hal-00861641〉

Communication dans un congrès41 documents

  • Badr El Boudour Bidouche, Yvan Avenas, Mouslim Essakili, Laurent Dupont. Thermal characterization of an IGBT power module with on-die temperature sensors. APEC 2017 - IEEE Applied Power Electronics Conference and Exposition, May 2017, Tampa, United States. Institute of Electrical and Electronics Engineers - IEEE, APEC 2017 - IEEE Applied Power Electronics Conference and Exposition, pp. 2317-2322, 2017, 〈10.1109/APEC.2017.7931023〉. 〈hal-01687242〉
  • Mouhannad-G Dbeiss, Yvan Avenas, Henri Zara, Laurent Dupont. A method for accelerated ageing tests of photovoltaic inverters considering the application's mission profiles. EPE'17 ECCE Europe - 19th European Conference on Power Electronics and Applications, Sep 2017, Varsovie, Poland. IEEE, EPE'17 ECCE Europe - 19th European Conference on Power Electronics and Applications, pp.1-10, 2017, 〈10.23919/EPE17ECCEEurope.2017.8099055〉. 〈hal-01689604〉
  • Nick Baker, Francesco Iannuzzo, Stig Munk-Nielsen, Laurent Dupont, Yvan Avenas. Experimental Evaluation of IGBT Junction Temperature Measurement via a Modified-VCE (VCE_VGE) Method with Series Resistance Removal. CIPS2016 - 9th Conference on Integrated Power Electronics Systems, Mar 2016, Nuremberg, Germany. Institute of Electrical and Electronics Engineers - IEEE, CIPS2016 - 9th Conference on Integrated Power Electronics Systems, 6p, 2016. 〈hal-01466153〉
  • Ibrahima Ka, Yvan Avenas, Laurent Dupont, Mickael Petit. Développement d'une puce instrumentée adaptée à la mesure de température dans les modules de puissance. 2ème Symposium de Génie Electrique (SGE 2016), Jun 2016, Grenoble, France. SGE 2016 - Symposium de Génie Electrique, 2016, 〈https://sge2016.sciencesconf.org/〉. 〈hal-01466194〉
  • Ibrahima Ka, Yvan Avenas, Laurent Dupont, Mickaël Petit. Développement d'une puce instrumentée adaptée à la mesure de température dans les modules de puissance. Symposium de Genie Electrique, Jun 2016, Grenoble, France. 〈hal-01361641〉
  • Ibrahima Ka, Yvan Avenas, Laurent Dupont, Raha Vafaei, Benoit Thollin, et al.. Instrumented Chip Dedicated to Semiconductor Temperature Measurements in Power ElectronicConverters. Energy Conversion Congress and Exposition (ECCE 2016), Oct 2016, Milwaukee, United States. 〈hal-01377217〉
  • Ibrahima Ka, Yvan Avenas, Laurent Dupont, Raha Vafaei, Benoît Thollin, et al.. Instrumented chip dedicated to semiconductor temperature measurements in power electronic converters. ECCE 2016 - IEEE Energy Conversion Congress and Exposition, Sep 2016, Milwaukee, United States. Institute of Electrical and Electronics Engineers - IEEE, ECCE 2016 - IEEE Energy Conversion Congress and Exposition, 11p, 2016, 〈10.1109/ECCE.2016.7855208〉. 〈hal-01684165〉
  • Nick Baker, Stig Munk-Nielsen, Francesco Iannuzzo, Laurent Dupont, Marco Liserre. Experimental evaluation of IGBT junction temperature measurement via peak gate current. EPE'15 ECCE-Europe, 2015 17th European Conference on Power Electronics and Applications, Sep 2015, Genève, Switzerland. EPE'15 ECCE-Europe, 2015 17th European Conference on Power Electronics and Applications, 11p., 2015, 〈10.1109/EPE.2015.7311733〉. 〈hal-01704586〉
  • Son Ha Tran, Laurent Dupont, Zoubir Khatir. Evaluation du comportement électrothermique de transistors MOSFET en conduction en présence de défaut dans la brasure. Symposium de Génie Électrique 2014, Jul 2014, Cachan, France. 〈hal-01065178〉
  • Laurent Dupont, Yvan Avenas. Evaluation de paramètres thermosensibles basés sur la mesure de la tension directe de composants IGBT pour une utilisation dans des conditions d'usage. Symposium de Génie Électrique 2014, Jul 2014, Cachan, France. 〈hal-01065323〉
  • Laurent Dupont, Yvan Avenas. Evaluation de paramètres thermosensibles basés sur la mesure de la tension directe de composants IGBT pour une utilisation dans des conditions d'usage. Symposium de Génie Electrique - SGE2014, Jul 2014, Cachan, France. 2014. 〈hal-01024080〉
  • Son Ha Tran, Laurent Dupont, Zoubir Khatir. Evaluation du comportement électrothermique de transistors MOSFET en conduction en présence de défaut dans la brasure. SGE'14 - Symposium de Génie Électrique, Jul 2014, Cachan, France. ENGINEERING FOUNDATION - EF, SGE'14 - Symposium de Génie Électrique, 2014. 〈hal-01319239〉
  • Laurent Dupont, Yvan Avenas. Evaluation of Thermo-Sensitive Electrical Parameters Based on the Forward Voltage for On-line Chip Temperature Measurements of IGBT Devices. ECCE2014, Sep 2014, Pittsburg, United States. 2014. 〈hal-01069990〉
  • Son Ha Tran, Laurent Dupont, Zoubir Khatir. Solder void position and size effects on electro thermal behaviour of MOSFET transistors in forward bias conditions. ESREF-25th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Sep 2014, BERLIN, Germany. ELSEVIER, ESREF-25th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, 54 (9-10), pp.PP.1921-1926, 2014, 〈10.1016/j.microrel.2014.07.152〉. 〈hal-01471815〉
  • Benoît Thollin, Laurent Dupont, Zoubir Khatir, Yvan Avenas, Jean-Christophe Crébier, et al.. Partial Thermal Impedance Measurement for Die Interconnection Characterization by a microsecond "Pulsed Heating Curve Technique. EPE'13 ECCE Europe, 2013, Lille, France. 2013. 〈hal-00988257〉
  • N. Baker, M. Liserre, Laurent Dupont, Yvan Avenas. Junction temperature measurements via thermo-sensitive electrical parameters and their application to condition monitoring and active thermal control of power converters. Annual Conference of the IEEE Industrial Electronics Society, IECON, 2013, Vienne, Austria. pp.942-948, 2013. 〈hal-00988264〉
  • Benoit Thollin, Laurent Dupont, Zoubir Khatir, Yvan Avenas, Jean Christophe Crebier, et al.. Partial Thermal Impedance Measurement for Die Interconnection Characterization by a Microsecond 'Pulsed Heating Curve Technique'. European Conference on Power Electronics and Applications, Sep 2013, France. 10p, 2013. 〈hal-01056909〉
  • Nick Baker, Marco Liserre, Laurent Dupont, Yvan Avenas. Junction temperature measurements via thermo-sensitive electrical parameters and their application to condition monitoring and active thermal control of power converters. IECON 2013 - 39th Annual Conference of the IEEE Industrial Electronics Society, Nov 2013, Vienne, Austria. Institute of Electrical and Electronics Engineers - IEEE, IECON 2013 - 39th Annual Conference of the IEEE Industrial Electronics Society, p. 942-948, 2013, 〈10.1109/IECON.2013.6699260〉. 〈hal-01704649〉
  • Laurent Dupont, Yvan Avenas, Pierre Olivier Jeannin. Comparison of junction temperature evaluations in a power IGBT module using an IR camera and three thermo-sensitive electrical parameters. APEC 2012 - IEEE Applied Power Electronics Conference and Exposition, Feb 2012, Orlando, United States. Institute of Electrical and Electronics Engineers - IEEE, APEC 2012 - IEEE Applied Power Electronics Conference and Exposition, p. 182-189, 2012, 〈10.1109/APEC.2012.6165817〉. 〈hal-01703887〉
  • Laurent Dupont, Yvan Avenas, Pierre-Olivier Jeannin. Comparison of junction temperature evaluations in a power IGBT module using an IR camera and three thermo-sensitive electrical parameters. Applied Power Electronics Conference and Exposition APEC 2012, Feb 2012, Orlando, United States. p 182 à 189, 2012. 〈hal-00673411〉
  • Souad Bachti, Laurent Dupont, Serge Loudot, Gérard Coquery. The combined effect of failure factors in power modules for automotive applications. PCIM Europe 2012 - International Exhibition & Conference for Power Electronics, Intelligent Motion and Power Quality 2012, May 2012, Nuremberg, Germany. Curran Associates, Inc., PCIM Europe 2012 - International Exhibition & Conference for Power Electronics, Intelligent Motion and Power Quality 2012, pp.502-509, 2012. 〈hal-01687269〉
  • Benoit Thollin, Jean-Christophe Crebier, Yvan Avenas, Pierre-Olivier Jeannin, Zoubir Khatir, et al.. Development and electrical characterization of a vertical electrical and thermal test chip (VTTC). ECCE 2011 - IEEE Energy Conversion Congress and Exposition: Energy Conversion Innovation for a Clean Energy Future, Sep 2011, PHOENIX, United States. IEEE, ECCE 2011 - IEEE Energy Conversion Congress and Exposition: Energy Conversion Innovation for a Clean Energy Future, pp.60-67, 2011, 〈10.1109/ECCE.2011.6063749〉. 〈hal-00881531〉
  • Yoshua Celnikier, Laurent Dupont, Eveline Herve, Gérard Coquery, Lahouari Benabou. Optimization of wire connections design for power electronics. ESREF 2011 - 22nd European Symposium Reliability of Electron Devices, Failure Physics and Analysis, Oct 2011, Bordeaux, France. ELSEVIER, ESREF 2011 - 22nd European Symposium Reliability of Electron Devices, Failure Physics and Analysis, 51 (9-11), pp 1892-1897, 2011, 〈10.1016/j.microrel.2011.06.058〉. 〈hal-01704479〉
  • Benoît Thollin, Jean-Christophe Crébier, Yvan Avenas, Pierre-Olivier Jeannin, Zoubir Khatir, et al.. Development and Electrical Characterization of a Vertical Electrical and Thermal Test Chip (VTTC). ECCE 2011, Sep 2011, Phoenix, United States. 2011. 〈hal-00627287〉
  • Jean Pierre Ousten, Ludovic Menager, Zoubir Khatir, Laurent Dupont. Etude d'interfaces thermiques pour le management thermique des modules de puissance. EPF 2010 - 10th European Power Electronics Conference, Jun 2010, St Nazaire, France. EPF 2010 - 10th European Power Electronics Conference, 5p, 2010. 〈hal-01704057〉
  • Son Ha Tran, Laurent Dupont, Zoubir Khatir. Evaluation of multi-void and drain metallization thickness effects on the electro thermal behavior of Si MOSFET under forward bias conditions. EPE'17 ECCE Europe - 19th European Conference on Power Electronics and Applications, Sep 2010, Varsovie, Poland. Institute of Electrical and Electronics Engineers - IEEE, EPE'17 ECCE Europe - 19th European Conference on Power Electronics and Applications, pp.1-10, 2017, 〈10.23919/EPE17ECCEEurope.2017.8099235〉. 〈hal-01703938〉
  • Laurent Dupont, Gérard Coquery, Kai Kriegel, Ashot Melkonyan. Accelerated Active Ageing Test on SiC JFETs Power Module with Silver Joining Technology for High Temperature Application. ESREF 2009 - 20th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis, Oct 2009, Bordeaux, France. Elsevier, ESREF 2009 - 20th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis, 49 (9-11), pp. 1375-1380, 2009, 〈10.1016/j.microrel.2009.07.050〉. 〈hal-01701967〉
  • Jean-Michel Morelle, Laurent Dupont, Gérard Coquery, Yoshua Celnikier. Innovative connectivity for double side cooling and connection of power dice in the context of automotive power mechatronic packaging for high power inverters. APE 2009 - 3rd International Conference Automotive power electronics, Mar 2009, PARIS, France. APE 2009 - 3rd International Conference Automotive power electronics, 6p, 2009. 〈hal-01704384〉
  • Laurent Dupont, Stéphane Lefebvre, Mounira Bouarroudj, Zoubir Khatir, Jean-Claude Faugieres, et al.. Ageing Test Results of low voltage MOSFET Modules for Electrical Vehicles. EPE 2007 - 12th European Conference on Power Electronics and Applications, Sep 2007, Aalborg, Denmark. Aalborg University, EPE 2007 - 12th European Conference on Power Electronics and Applications, 10p, 2007. 〈hal-01701952〉
  • Mounira Bouarroudj-Berkani, Zoubir Khatir, Jean-Pierre Ousten, Stéphane Lefebvre, Laurent Dupont. Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules. Power Electronics and Applications, 2007 European Conference on, Sep 2007, Aalborg, Denmark. 〈hal-01677171〉
  • Mounira Bouarroudj, Zoubir Khatir, Jean Pierre Ousten, Frédéric Badel, Laurent Dupont, et al.. Degradation behavior of 600V-200A IGBT modules under Power cycling and high temperature environment conditions. 18th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Oct 2007, BORDEAUX, France. Elsevier, 18th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, 47 (9-11), pp. 1719-1724, 2007, 〈10.1016/j.microrel.2007.07.027〉. 〈hal-01702036〉
  • Mounira Bouarroudj, Zoubir Khatir, Jean Pierre Ousten, Laurent Dupont, Stéphane Lefebvre, et al.. Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules. EPE 2007 - 12th European Conference on Power Electronics and Applications, Sep 2007, Aalborg, Denmark. Institute of Electrical and Electronics Engineers - IEEE, EPE 2007 - 12th European Conference on Power Electronics and Applications, 10p, 2007, 〈10.1109/EPE.2007.4417457〉. 〈hal-01702003〉
  • Laurent Dupont, Zoubir Khatir, Stéphane Lefebvre, Régis Meuret, Serge Bontemps. Fiabilité des composants de puissance dans des environnements hautes températures. (ITCT 2006 - Journées internationales d'études Ingénieries des Technologies Communes aux Transports terrestres, maritimes, aériens et spatiaux, Nov 2006, Paris, France. Association Aéronautique et Astronautique de France, (ITCT 2006 - Journées internationales d'études Ingénieries des Technologies Communes aux Transports terrestres, maritimes, aériens et spatiaux, 6p, 2006. 〈hal-01704363〉
  • Laurent Dupont, Stéphane Lefebvre, Zoubir Khatir, Serge Bontemps. Evaluation of Substrate Technologies under High Temperature Cycling. CIPS 2006 - 4th International Conference on Integrated Power Electronics Systems, Jun 2006, Naples, Italy. CIPS 2006 - 4th International Conference on Integrated Power Electronics Systems, 6p, 2006. 〈hal-01704198〉
  • Laurent Dupont, Stéphane Lefebvre, Zoubir Khatir, Serge Bontemps, Régis Meuret. Evaluation de technologies de substrats céramiques sous des cyclages en température de forte amplitude. EPF 2006 - Electronique de Puissance du Futur, Jul 2006, Grenoble, France. EPF 2006 - Electronique de Puissance du Futur, 6p, 2006. 〈hal-01704147〉
  • Laurent Dupont, Régis Meuret, Zoubir Khatir, B Parmentier, Stéphane Lefebvre, et al.. Evaluation of thermo-mechanical stresses of a power module dedicated to high temperature applications. HITEN 2005 - International Conference on High Temperature Electronics, Sep 2005, Paris, France. HITEN 2005 - International Conference on High Temperature Electronics, 6p, 2005. 〈hal-01704218〉
  • Laurent Dupont, Zoubir Khatir, Stéphane Lefebvre, Régis Meuret, B Parmentier, et al.. Electrical Characterizations and evaluation of thermo-mechanical stresses of a power module dedicated to high temperature applications. EPE 2005 - 11th European Conférence on Power Electronics and Applications, Sep 2005, Dresde, Germany. Institute of Electrical and Electronics Engineers - IEEE, EPE 2005 - 11th European Conférence on Power Electronics and Applications, 11p, 2005, 〈10.1109/EPE.2005.219580〉. 〈hal-01704015〉
  • Laurent Dupont, Stéphane Lefebvre, Serge Bontemps, Zoubir Khatir, Régis Meuret. Development of high temperature power module for avionics applications. PCIM 2004 - International conference power electronics, intelligent motion, power quality, May 2004, Nuremberg, Germany. PCIM 2004 - International conference power electronics, intelligent motion, power quality, pp.6P, 2004. 〈hal-01702065〉
  • Laurent Dupont, Stéphane Lefebvre, Zoubir Khatir, Serge Bontemps, Régis Meuret. Characterisation of silicon carbide schottky diodes and COOLMOS transistors at high temperature. PESC 04 - IEEE 35th annual Power Electronics Specialists Conference, Jun 2004, AIX LA CHAPELLE, Germany. Institute of Electrical and Electronics Engineers - IEEE, PESC 04 - IEEE 35th annual Power Electronics Specialists Conference, 2004, 〈10.1109/PESC.2004.1355810〉. 〈hal-01701982〉
  • Laurent Dupont, Stéphane Lefebvre, Zoubir Khatir, Serge Bontemps, Régis Meuret. Développement d'un module de puissance pour tester la fiabilité d'un convertisseur haute température. SAAEI-EPF 2004 - Annual seminar on automatic control, industrial electronics and instrumentation, Electronique de puissance du futur, Sep 2004, Toulouse, France. SAAEI-EPF 2004 - Annual seminar on automatic control, industrial electronics and instrumentation, Electronique de puissance du futur, pp.3-6, 2004. 〈hal-01702105〉
  • Laurent Dupont, Stéphane Lefebvre, Zoubir Khatir, Jean Claude Faugiere. Power Cycling Test Circuit for Thermal Fatigue Resistance Analysis of Solder Joints in IGBT. 10th European Conférence on Power Electronics and Applications, Sep 2003, France. 8p, 2003. 〈hal-00868868〉

Autre publication1 document

  • Laurent Dupont. Contribution à l’étude de la durée de vie des assemblages de puissance dans des environnements haute température avec des cycles thermiques de grande amplitude. déjà déposée dans TEL. 2006, 189 p. 〈hal-00983098〉

Thèse1 document

  • Laurent Dupont. Contribution à l'étude de la durée de vie des assemblages de puissance dans des environnements haute température et avec des cycles thermiques de grande amplitude. Energie électrique. École normale supérieure de Cachan - ENS Cachan, 2006. Français. 〈tel-00091782〉