KZ
Khatir Zoubir
134
Documents
Présentation
Publications
Prédiction de la durée de vie restante d'un module de puissance par inférence bayesienneJournée thématique de la F2M: Approches probabilistes en mécanique, 2023, Marne la Vallée, France
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Non-intrusive electro-mechanical reduced model of IGBT power modules24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EUROSIME 2023), 2023, Graz, Austria
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Subpixel Cross Correlation Registration for High Spatial Resolution Thermal Image on IGBT Emitter Metallization by Thermoreflectance Measurements2023 39th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), Mar 2023, San Jose, United States. pp.1-6, ⟨10.23919/SEMI-THERM59981.2023.10267896⟩
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A non-intrusive multi-physics PGD-based reduced model for the prediction of power electronic module lifetime6th International Workshop on Model Reduction Techniques, Nov 2023, Paris-Saclay, France
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Non-intrusive reduced order modelling for a coupled electro-thermo-mechanical problem10th International Conference on Computational Methods for Coupled Problems in Science and Engineering (COUPLED 2023), 2023, Chania, Greece
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Non-intrusive electro-thermo-mechanical reduced model for diagnosis and prognostic on IGBT power modules2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2023, Graz, Austria. pp.1-9, ⟨10.1109/EuroSimE56861.2023.10100766⟩
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Non-intrusive multi-physics PGD-based reduced model for the modeling of power electronic modulesModel Reduction and Surrogate Modeling, 2022, Berlin, Germany
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Construction d'un modèle réduit PGD pour l'étude de la fissuration thermo-mécanique des modules de puissance15ème colloque national en calcul des structures, Université Polytechnique Hauts-de-France [UPHF], May 2022, 83400 Hyères-les-Palmiers, France
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Physicochemical-microstructural approach for modeling the crack passage at topside metallic parts in IGBT semiconductor power electronics2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2022, St Julian, Malta. pp.1-6, ⟨10.1109/EuroSimE54907.2022.9758895⟩
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Analytical Model for Real-Time Junction Temperature Estimation of Multi-chip Power Module in PWM operation2022 IEEE 13th International Symposium on Power Electronics for Distributed Generation Systems (PEDG), Jun 2022, Kiel, Germany. pp.1-6, ⟨10.1109/PEDG54999.2022.9923091⟩
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Model reduction for sensitivity analysis of solder joint fracture in power electronic modulesInternational Conference on integrated Power Electronics Systems (CIPS), Mar 2022, Berlin, Germany
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Condition monitoring and evaluation of Ron degradation during power cycling of SiC-Mosfets power modulesInternational Conference on integrated Power Electronics Systems (CIPS), Mar 2022, Berlin, Germany
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Condition monitoring and evaluation of Ron degradation during power cycling in switching mode of SiC-Mosfets power modules12th International Conference on Integrated Power Electronics Systems (CIPS 2022), Mar 2022, Berlin, Germany
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Remaining Useful Lifetime estimation for Electronic Power modules using an analytical degradation modelFifth European Conference of the PHM Society 2020 (The Prognostics and Health Management), Jul 2020, Turin (virtual conference), Italy. pp.10
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Cross Correlation Method for Images Alignment: Application to 4 Buckets Calculation in Thermoreflectance2020 36th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), Mar 2020, San Jose, United States. pp.137-142, ⟨10.23919/SEMI-THERM50369.2020.9142843⟩
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Wire-bond Contact Degradation Modelling for Remaining Useful Lifetime Prognosis of IGBT Power ModulesESREF 2020, 31st European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Oct 2020, Athènes, Greece
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Investigations on the evolution of dynamic Ron of GaN power transistors during switching cyclesInternational Conference on integrated Power Electronics Systems (CIPS), Mar 2018, Nuremberg, Germany
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Dispersion of electrical characteristics and short-circuit robustness of 600V E-mode GaN transistors2017 International Exhibition and Conference for Power Electronics and Energy Management (PCIM 2017), May 2017, Nuremberg, Germany. pp.1-9
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New Electro-Thermal Model for a Multichip Power Module Used in a Motor Drive2017 International Exhibition and Conference for Power Electronics and Energy Management (PCIM 2017), May 2017, Nuremberg, Germany. 8p
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Integration of different modules of an electric vehicle powered by a battery-flywheel storage system during traction operationIMCET - IEEE International Multidisciplinary Conference on Engineering Technology, Dec 2016, Beyrouth, France. pp.126 - 131, ⟨10.1109/IMCET.2016.7777439⟩
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Power Cycling Tests in High Temperature Conditions of SiC-MOSFET Power Modules and Ageing AssessmentCIPS 2016 - 9th International Conference on integrated Power Electronics Systems, Mar 2016, Nuremberg, Germany. 6p
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Energy management of a battery-flywheel storage system used for regenerative braking recuperation of an electric vehicleIECON 2016 - 42nd Annual Conference of the IEEE Industrial Electronics Society, Oct 2016, Florence, Italy. pp. 2034 - 2039, ⟨10.1109/IECON.2016.7793595⟩
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Optimal Traction and Regenerative Braking Reference Current Synthesis for an IPMSM Motor using Three Combined Torque Control Methods for an Electric VehicleITEC 2016 - IEEE Transportation Electrification Conference and Expo, Jun 2016, Dearborn, United States. 6p, ⟨10.1109/ITEC.2016.7520214⟩
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Control strategy for extreme conditions regenerative braking of a hybrid energy storage system for an electric vehicleINDIN 2016 - IEEE 14th International Conference on Industrial Informatics, Jul 2016, Poitiers, France. 6p, ⟨10.1109/INDIN.2016.7819170⟩
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Integration of different modules for regenerative braking control of a two front wheel-driven EVREDEC 2016 - 3rd International Conference on Renewable Energies for Developing Countries, Jul 2016, Zouk Mosbeh, Lebanon. 6p, ⟨10.1109/REDEC.2016.7577539⟩
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Temperature and strain mappings over forward biased power IGBT cross-section area by Œ-Raman spectroscopyEPE'15 ECCE-Europe, 2015 17th European Conference on Power Electronics and Applications, Sep 2015, Geneve, Switzerland. 9p, ⟨10.1109/EPE.2015.7309315⟩
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Design and control of a high frequency six-phase interleaved DC/DC converter based on SiC power MOSFETs for a PEMFC 6th International Conference on Fundamentals & Development of Fuel Cells (FDFC2015), Feb 2015, Toulouse, France. pp.OPR3-25
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Mechanical and Thermal Stresses Characterization Maps on Cross-sections of Forward Biased Electronic Power DevicesIRPS 2015 - IEEE International Reliability Physics Symposium, Apr 2015, Monterey, United States. 10p, ⟨10.1109/IRPS.2015.7112800⟩
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Part-load control stategy of a 20kW SiC power converter for embedded PEMFC multi-stack architectures41st Annual Conference of the IEEE Industrial Electronics Society (IECON 2015), Nov 2015, Yokohama, Japan. pp.004627 - 004632, ⟨10.1109/IECON.2015.7392821⟩
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Solder void position and size effects on electro thermal behaviour of MOSFET transistors in forward bias conditionsESREF-25th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Sep 2014, BERLIN, Germany. pp.PP.1921-1926, ⟨10.1016/j.microrel.2014.07.152⟩
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Modélisation Electrothermique distribuée d'une puce IGBT : Application aux effets du vieillissement de la métallisation sur les régimes de court-circuitSymposium de Génie Électrique 2014, Jul 2014, Cachan, France
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Evaluation du comportement électrothermique de transistors MOSFET en conduction en présence de défaut dans la brasureSymposium de Génie Électrique 2014, Jul 2014, Cachan, France
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Top-metal ageing effects on electro-thermal distributions in an IGBT chip under short circuit conditionsEuropean Conference on Power Electronics and Applications, Sep 2013, France. 9p
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Power cycling ageing tests at 200°C of SiC assemblies for high temperature electronicsEuropean Conference on Power Electronics and Applications, Sep 2013, France. 10p
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Investigation of 1.2 kV investigation of SiC MOSFETs for aeronautics applicationsPower Electronics and Applications (EPE), 2013 15th European Conference on, Sep 2013, Lille, France. pp.1-9, ⟨10.1109/EPE.2013.6634665⟩
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Partial Thermal Impedance Measurement for Die Interconnection Characterization by a microsecond "Pulsed Heating Curve TechniqueEPE'13 ECCE Europe, 2013, Lille, France
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Power cycling aging tests at 200°C of SiC assemblies for high temperature electronicsEPE 13 - European Conference on Power Electronics and Applications, Sep 2013, Lille, France. 10p
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Robustness of 1.2 kV SiC MOSFET devicesESREF, 2013, Arcachon, France
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Main issues and limitations in Power cycling tests for future integrated power convertersAutomotive Power Electronics, Apr 2013, France. 6p
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Reliability of power MOSFET-based smart switches under normal and extreme conditions for 24 V battery system applicationsESREF, 2013, Arcachon, France
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Partial Thermal Impedance Measurement for Die Interconnection Characterization by a Microsecond 'Pulsed Heating Curve Technique'European Conference on Power Electronics and Applications, Sep 2013, France. 10p
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Study of Thermal Interfaces Aging for Power Electronics ApplicationsSemiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2011 27th Annual IEEE, Mar 2011, San José, United States. pp.10-17, ⟨10.1109/STHERM.2011.5767171⟩
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Development and electrical characterization of a vertical electrical and thermal test chip (VTTC)ECCE 2011 - IEEE Energy Conversion Congress and Exposition: Energy Conversion Innovation for a Clean Energy Future, Sep 2011, PHOENIX, United States. pp.60-67, ⟨10.1109/ECCE.2011.6063749⟩
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Failure modes and robustness of SiC JFET transistors under current limiting operationsPower Electronics and Applications (EPE 2011),, Aug 2011, Birmingham, United Kingdom. pp.1-10
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Development and Electrical Characterization of a Vertical Electrical and Thermal Test Chip (VTTC)ECCE 2011, Sep 2011, Phoenix, United States
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Study of thermal interfaces aging for power electronics applicationsEPE'11 ECCE Europe Power Electronics and Adjustable Speed Drives: Towards the 20-20-20 Target, Aug 2011, Birmingham, United Kingdom. pp.1 - 10
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Etude d'interfaces thermiques pour le management thermique des modules de puissance13ème EPF, Jun 2010, St Nazaire, France. pp.1-5
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Evaluation of multi-void and drain metallization thickness effects on the electro thermal behavior of Si MOSFET under forward bias conditionsEPE'17 ECCE Europe - 19th European Conference on Power Electronics and Applications, Sep 2010, Varsovie, Poland. pp.1-10, ⟨10.23919/EPE17ECCEEurope.2017.8099235⟩
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Etude du vieillissement de la couche de métallisation de composants de puissance à semi-conducteurÉlectronique de Puissance du Futur, Jun 2010, Saint Nazaire, France. pp.1-10
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Thermo-mechanical simulations in double-sided heat transfer power assembliesEUROSIME, Apr 2010, Bordeaux, France. pp.73
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Etude d'interfaces thermiques pour le management thermique des modules de puissanceEPF 2010 - 10th European Power Electronics Conference, Jun 2010, St Nazaire, France. 5p
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Fabrication of bottom die substrate solderless interconnection based on nano copper wiresEuropean Conference on Power Electronics and Applications, 2009, Barcelone, Spain
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Investigations on ageing of IGBT transistors under repetitive short-circuits operationsInternational Conference & Exhibition on Power Electronics/Intelligent Motion/Power Quality, Jun 2009, Shanghai, China. pp.237-242
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Etude de l'Elaboration d'Interconnexions Electrodéposées en Electronique de PuissanceMGE'2008, May 2008, Toulouse, France. pp.on CD - 78-81/215
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Temperature Levels Effects on the Thermo-Mechanical Behaviour of Solder Attach During Thermal Cycling of Power Electronic ModulesPower Electronics Specialists Conference, 2008. PESC 2008. IEEE, Jun 2008, Rhodes, Greece
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Programme EPO-Auto+ : Électronique de puissance pour l'automobile de demain: du module au systèmeEPF'2008, ÉLECTRONIQUE DE PUISSANCE DU FUTUR, Jul 2008, TOURS, France. pp.00
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Degradation behavior of 600V-200A IGBT modules under Power cycling and high temperature environment conditions18th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Oct 2007, BORDEAUX, France. pp. 1719-1724, ⟨10.1016/j.microrel.2007.07.027⟩
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Ageing Test Results of low voltage MOSFET Modules for Electrical VehiclesEPE 2007 - 12th European Conference on Power Electronics and Applications, Sep 2007, Aalborg, Denmark. 10p
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Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modulesEPE 2007 - 12th European Conference on Power Electronics and Applications, Sep 2007, Aalborg, Denmark. 10p, ⟨10.1109/EPE.2007.4417457⟩
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Evaluation of Substrate Technologies under High Temperature CyclingCIPS 2006 - 4th International Conference on Integrated Power Electronics Systems, Jun 2006, Naples, Italy. 6p
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Fiabilité des composants de puissance dans des environnements hautes températures(ITCT 2006 - Journées internationales d'études Ingénieries des Technologies Communes aux Transports terrestres, maritimes, aériens et spatiaux, Nov 2006, Paris, France. 6p
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Evaluation de technologies de substrats céramiques sous des cyclages en température de forte amplitudeEPF 2006 - Electronique de Puissance du Futur, Jul 2006, Grenoble, France. 6p
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Evaluation of thermo-mechanical stresses of a power module dedicated to high temperature applicationsHITEN 2005 - International Conference on High Temperature Electronics, Sep 2005, Paris, France. 6p
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Electrical Characterizations and evaluation of thermo-mechanical stresses of a power module dedicated to high temperature applicationsEPE 2005 - 11th European Conférence on Power Electronics and Applications, Sep 2005, Dresde, Germany. 11p, ⟨10.1109/EPE.2005.219580⟩
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Développement d'un module de puissance pour tester la fiabilité d'un convertisseur haute températureSAAEI-EPF 2004 - Annual seminar on automatic control, industrial electronics and instrumentation, Electronique de puissance du futur, Sep 2004, Toulouse, France. pp.3-6
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Characterisation of silicon carbide schottky diodes and COOLMOS transistors at high temperaturePESC 04 - IEEE 35th annual Power Electronics Specialists Conference, Jun 2004, AIX LA CHAPELLE, Germany. ⟨10.1109/PESC.2004.1355810⟩
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Development of high temperature power module for avionics applicationsPCIM 2004 - International conference power electronics, intelligent motion, power quality, May 2004, Nuremberg, Germany. pp.6P
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Power Cycling Test Circuit for Thermal Fatigue Resistance Analysis of Solder Joints in IGBT10th European Conférence on Power Electronics and Applications, Sep 2003, France. 8p
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Détection et Diagnostic de défauts dans un convertisseur statiqueTrigeassou J.C. Diagnostic des Machines Electriques, Hermès / Lavoisier, pp.317-371, 2011
Chapitre d'ouvrage
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Faults Detection and Diagnosis in a Static ConverterJ.C. Trigeassou. Electrical Machines Diagnosis, Wiley, ISTE, pp.271-316, 2011
Chapitre d'ouvrage
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Method and device for measuring the state of health of semiconductor-based electronic componentsFrance, N° de brevet: WO/2023/094205. 2023
Brevet
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