Karim Inal
58
Documents
Présentation
Thèse Orsay-ENSAM, ATER ENSAM Paris, MCF ENSAM Metz puis Aix en Provence, Pr ENSMSE Gardanne, Pr MinesParisTech Sophia
Publications
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The impact of nitrogen plasma treatments on SixNyHz moisture sensitivityConference on Plasma Based Ion Implantation & Deposition, Oct 2017, Shanghai, France
Communication dans un congrès
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Discharge frequency and reagents choice effects on robustness of silicon nitride (Si3N4) thin layers deposited by PECVD (Plasma-Enhanced Chemical Vapor Deposition)European Conference on Heat Treatment and Surface Engineering, Jun 2017, Nice, France
Communication dans un congrès
hal-01721378v1
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Etude XPS de la ré-oxydation de films de Nichrome dans la chambre d'analyse lors du profilage séquentiel par érosionELSPEC'16, 7eme conférence francophone sur les spectroscopies d’électrons, May 2016, Versailles_Meudon, France
Communication dans un congrès
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Packaging induced stress effects investigations on 40nm CMOS technology node: Measurements and optimization of device shifts2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), Dec 2015, Singapore, Singapore. pp.346-351, ⟨10.1109/EPTC.2015.7412333⟩
Communication dans un congrès
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Thermo-mechanical analysis of GaAs devices under temperature-humidity-bias testing16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE 2015, Apr 2015, Budapest, Hungary. 8 p. - ISBN 978-1-4799-9949-1 ⟨10.1109/EuroSimE.2015.7103140⟩
Communication dans un congrès
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On the material depletion rate due to electromigration in a copper TSV structure 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW) , IEEE, Oct 2014, S. Lake Tahoe, California, United States. pp.111-114 - ISBN 978-1-4799-7308-8 ⟨10.1109/IIRW.2014.7049523⟩
Communication dans un congrès
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Determination of material properties and failure using in-situ thermo-mechanical probe2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2014, Apr 2014, Cannes, France. pp.Article number 7056700 - ISBN 978-2-35500-028-7, ⟨10.1109/DTIP.2014.7056700⟩
Communication dans un congrès
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Microstrain and residual stress in thin-films made from silver nanoparticles deposited by inkjet-printing technology9th European Conference on Residual Stresses, ECRS 2014, Jul 2014, Troyes, France. pp.930-935, ⟨10.4028/www.scientific.net/AMR.996.930⟩
Communication dans un congrès
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Investigation of TSV induced thermo-mechanical stress: Implementation of piezoresistive sensors and correlation with simulation9th European Conference on Residual Stresses, ECRS 2014, Jul 2014, Troyes, France. pp.975-981, ⟨10.4028/www.scientific.net/AMR.996.975⟩
Communication dans un congrès
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CMOS stress sensor for 3D integrated circuits: Thermo-mechanical effects of Through Silicon Via (TSV) on surrounding silicon15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, Apr 2014, Ghent, Belgium. 8 p. - ISBN 978-1-4799-4791-1, ⟨10.1109/EuroSimE.2014.6813808⟩
Communication dans un congrès
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Hemispherical curved monolithic cooled and uncooled infrared focal plane arrays for compact camerasInfrared Technology and Applications XL, May 2014, Baltimore, Maryland, United States. art. no. 90702T - 8 p., ⟨10.1117/12.2049967⟩
Communication dans un congrès
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Improvement of freestanding CMOS-MEMS through detailed stress analysis in metallic layers15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, Apr 2014, Ghent, Belgium. 6 p. - ISBN 978-1-4799-4791-1, ⟨10.1109/EuroSimE.2014.6813834⟩
Communication dans un congrès
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Mechanical behavior of flexible silicon devices curved in spherical configurations14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Apr 2013, Wroclaw, Poland. 7 p. - Article number 6529978, ⟨10.1109/EuroSimE.2013.6529978⟩
Communication dans un congrès
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First in Operando SEM Observation of Electromigration-Induced Voids in TSV Structures39th International Symposium for Testing and Failure Analysis - ISTFA 2013, Nov 2013, San Jose, California, United States. pp.59-68 - ISBN 978-1-62708-022-4
Communication dans un congrès
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INVESTIGATION OF BORON AND NITROGEN ION BEAM IMPLANTATION IN GOLD THIN FILMS FOR OHMIC MEMS SWITCH CONTACT IMPROVEMENTTansducers and Eurosensors XXVII, Jun 2013, Barcelona, Spain
Communication dans un congrès
emse-00840099v1
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Chip integration using inkjet-printed silver conductive tracks reinforced by electroless plating for flexible board packagesMiNaPAD 2012. Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum, Apr 2012, Grenoble, France. pp.F01
Communication dans un congrès
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Selective Sintering of Inkjet-Printed Silver Inks Using Variable Frequency MicrowaveGlobal Congress on Microwave Energy Applications, Jul 2012, Long Beach, California, United States
Communication dans un congrès
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Investigation of local stress around TSVs by micro-Raman spectroscopy and finite element simulationInternational Interconnect Technology Conference and Materials for Advanced Metallization 2011, May 2011, Dresde, Germany. pp.1-3, ⟨10.1109/IITC.2011.5940351⟩
Communication dans un congrès
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Tailoring the Crystallographic Texture and Electrical Properties of Inkjet-printed Interconnects for Use in MicroelectronicsMaterials Research Society Spring Meeting, 2011, San Francisco, United States. pp.O8.10, ⟨10.1557/opl.2011.1264⟩
Communication dans un congrès
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Printed Ag nanoparticles on Evaporated Au System: Impact of Microstructure on Mechanical and Electrical PropertiesEuropean Materials Research Society Spring Meeting, May 2011, Nice, France
Communication dans un congrès
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Optimal sintering technologies applied to inkjet-printed silver nanoparticles for microelectronics applicationsInternational Conference on Sintering 2011, Aug 2011, Jeju, South Korea
Communication dans un congrès
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Microstructure evolution of gold thin films under spherical indentation for micro switches contact applicationsEuropean Materials Research Society 2010, Jun 2010, Strasbourg, France
Communication dans un congrès
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Nanoindentation de couches dures ultramines de ruthénium sur orMateriaux 2010, Oct 2010, Nantes, France. pp.0641
Communication dans un congrès
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Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packagesESTC 2010. Electronics System Integration Technology Conference, Sep 2010, Berlin, Germany. pp.AP-4, ⟨10.1109/ESTC.2010.5642997⟩
Communication dans un congrès
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Mechanical Issues Induced by Electrical Wafer Sort: Correlations from actual tests, Nanoindentation and 3D Dynamic ModelingElectronics System Integration Technology Conference ESTC 2010, Sep 2010, Berlin, Germany. pp.P0027, ⟨10.1109/ESTC.2010.5642863⟩
Communication dans un congrès
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Time dependence investigation of the electrical resistance of Au / Au thin film micro contacts25th International Conference on Electrical Contacts & 56th IEEE Holm Conference on Electrical Contacts, Oct 2010, Charleston, United States. pp.58-64, ⟨10.1109/HOLM.2010.5619563⟩
Communication dans un congrès
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Analyse de déformations et contraintes locales par couplage EBSD et microdiffraction KosselMatériaux 2010, Oct 2010, Nantes, France. pp.0461
Communication dans un congrès
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Hierarchical image analysis for roughness characterization5th International Colloquium Micro-Tribology '09, Sep 2009, Milowka, Poland
Communication dans un congrès
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Effect of Packaging Design on Wire Bond Interconnection ReliabilityARCSIS Micropackaging Days Thin and Flexible Packaging 2009, Oct 2009, Gardanne, France
Communication dans un congrès
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Contraintes résiduelles dans les interconnexions submicroniques. Prise en compte des dimensions des lignes de cuivre par microcapteurs embarquésCongrès Français de Mécanique CFM'2009, Aug 2009, Marseille, France. pp.1326
Communication dans un congrès
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Thermal optimization of silver nanoparticles sintering for low resistive printed applicationsMME 09. 20th MicroMechanics Europe Workshop, Sep 2009, Toulouse, France. pp.D07/ 1-4
Communication dans un congrès
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Mechanical study of the probing effect on PAD structuresARCSIS Micropackaging Days Thin and Flexible Packaging 2009, Oct 2009, Gardanne, France
Communication dans un congrès
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Direct-writing of conductive patterns based on printed and sintered silver nanoparticlesARCSIS Micropackaging Days Thin and Flexible Packaging 2009, Oct 2009, Gardanne, France
Communication dans un congrès
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Micro-mechanical modeling of brittle fracture of French RPV steel - A comprehensive study of stress triaxiality effectASME 2008 Pressure Vessels and Piping Conference, Jul 2008, Chicago, United States. pp.Volume 6: Materials and Fabrication, Parts A and B, ⟨10.1115/PVP2008-61334⟩
Communication dans un congrès
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A crystallographic approach of brittle fracture in the 16MND5 bainitic steel. In-situ X-ray diffraction and scanning electron microscope measurements at low temperatures9th European Mechanics of Materials Conference/ Euromech Mecamat 2006/ Local approach to fracture, May 2006, Moret-sur-Loing, France
Communication dans un congrès
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stress determination with Kossel microdiffraction in a scanning electron microscope7th European Conference on Residual Stresses (ECRS7, Berlin, Jan 2006, Germany
Communication dans un congrès
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Modélisation et simulation du comportement thermomécanique des aciers austénitiques à effet TWIP (TWinning Induced Plasticity)17e Congrès Français de Mécanique, 2005, Troyes, France. pp.1-6
Communication dans un congrès
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Impression et recuit de nanoparticules métalliques pour l’électronique impriméeTechniques de l'Ingénieur, Référence RE 222lab et Doc. RE 222, Editions T.I., 27 + 5 p., 2014
Chapitre d'ouvrage
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