Karim Inal
2
Documents
Présentation
Thèse Orsay-ENSAM, ATER ENSAM Paris, MCF ENSAM Metz puis Aix en Provence, Pr ENSMSE Gardanne, Pr MinesParisTech Sophia
Publications
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Chip integration using inkjet-printed silver conductive tracks reinforced by electroless plating for flexible board packagesMiNaPAD 2012. Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum, Apr 2012, Grenoble, France. pp.F01
Communication dans un congrès
emse-00691806v1
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Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packagesESTC 2010. Electronics System Integration Technology Conference, Sep 2010, Berlin, Germany. pp.AP-4, ⟨10.1109/ESTC.2010.5642997⟩
Communication dans un congrès
emse-00530148v1
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