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Karim Inal

10
Documents

Présentation

Thèse Orsay-ENSAM, ATER ENSAM Paris, MCF ENSAM Metz puis Aix en Provence, Pr ENSMSE Gardanne, Pr MinesParisTech Sophia

Publications

868636

Selective Sintering of Inkjet-Printed Silver Inks Using Variable Frequency Microwave

Romain Cauchois , Daniel Żymełka , Karim Inal , Mohamed Saadaoui
Global Congress on Microwave Energy Applications, Jul 2012, Long Beach, California, United States
Communication dans un congrès emse-00714123v1
Image document

Chip integration using inkjet-printed silver conductive tracks reinforced by electroless plating for flexible board packages

Romain Cauchois , Mohamed Saadaoui , Jacques Legeleux , Thierry Malia , Béatrice Dubois-Bonvalot
MiNaPAD 2012. Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum, Apr 2012, Grenoble, France. pp.F01
Communication dans un congrès emse-00691806v1
Image document

Tailoring the Crystallographic Texture and Electrical Properties of Inkjet-printed Interconnects for Use in Microelectronics

Romain Cauchois , Mohamed Saadaoui , Karim Inal , Béatrice Dubois-Bonvalot , Jean-Christophe Fidalgo
Materials Research Society Spring Meeting, 2011, San Francisco, United States. pp.O8.10, ⟨10.1557/opl.2011.1264⟩
Communication dans un congrès emse-00576968v1

Printed Ag nanoparticles on Evaporated Au System: Impact of Microstructure on Mechanical and Electrical Properties

Romain Cauchois , Mohamed Saadaoui , Karim Inal , Béatrice Dubois-Bonvalot , Jean-Christophe Fidalgo
European Materials Research Society Spring Meeting, May 2011, Nice, France
Communication dans un congrès emse-00594778v1

Optimal sintering technologies applied to inkjet-printed silver nanoparticles for microelectronics applications

Romain Cauchois , Mohamed Saadaoui , Abdelwahhab Yakoub , Karim Inal , Béatrice Dubois-Bonvalot
International Conference on Sintering 2011, Aug 2011, Jeju, South Korea
Communication dans un congrès emse-00638031v1

Investigation of local stress around TSVs by micro-Raman spectroscopy and finite element simulation

François Le Texier , Jessica Mazuir , Man Su , Mohamed Saadaoui , Jean-Luc Liotard
International Interconnect Technology Conference and Materials for Advanced Metallization 2011, May 2011, Dresde, Germany. pp.1-3, ⟨10.1109/IITC.2011.5940351⟩
Communication dans un congrès emse-00638030v1
Image document

Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages

Romain Cauchois , Mohamed Saadaoui , Jacques Legeleux , Thierry Malia , Béatrice Dubois-Bonvalot
ESTC 2010. Electronics System Integration Technology Conference, Sep 2010, Berlin, Germany. pp.AP-4, ⟨10.1109/ESTC.2010.5642997⟩
Communication dans un congrès emse-00530148v1

Direct-writing of conductive patterns based on printed and sintered silver nanoparticles

Romain Cauchois , Mohamed Saadaoui , Karim Inal , Béatrice Dubois-Bonvalot , Jean-Cristophe Fidalgo
ARCSIS Micropackaging Days Thin and Flexible Packaging 2009, Oct 2009, Gardanne, France
Communication dans un congrès emse-00470613v1

Impression et recuit de nanoparticules métalliques pour l’électronique imprimée

Romain Cauchois , Mohamed Saadaoui , Karim Inal
Techniques de l'Ingénieur, Référence RE 222lab et Doc. RE 222, Editions T.I., 27 + 5 p., 2014
Chapitre d'ouvrage hal-01107859v1