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Karim Inal

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pierre-montmitonnet

	Micro-Indentation of oxidized low carbon steel to evaluate properties of oxides Victor Claverie-Burgué , Pierre Montmitonnet , Karim Inal , Alain Burr , Alexis Nicolaÿ IOP Conference Series: Materials Science and Engineering, 2022, 1270 (1), pp.012106. ⟨10.1088/1757-899X/1270/1/012106⟩ Article dans une revue hal-03924281v1
	Investigation on the effect of external mechanical stress on the DC characteristics of GaAs microwave devices Kokou Adokanou , Karim Inal , Pierre Montmitonnet , Francis Pressecq , Barbara Bonnet Microelectronics Reliability, 2015, Proceedings of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - Proceedings of ESREF 2015, 55 (9-10), pp.1697-1702. ⟨10.1016/j.microrel.2015.06.033⟩ Article dans une revue hal-01180774v1
	Robust design of thermo-mechanical MEMS switch embedded in aluminium BEOL interconnect Sebastian Orellana , Brice Arrazat , Pascal Fornara , Christian Rivero , Sylvain Blayac Microelectronics Reliability, 2015, Proceedings of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - Proceedings of ESREF 2015, 55 (9-10), pp.1896-1900. ⟨10.1016/j.microrel.2015.06.032⟩ Article dans une revue hal-01180626v1
	Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence Simon Gousseau , Stéphane Moreau , David Bouchu , Alexis Farcy , Pierre Montmitonnet Microelectronics Reliability, 2015, 55 (8), pp.1205-1213. ⟨10.1016/j.microrel.2015.05.019⟩ Article dans une revue hal-01166314v1

	Thermo-mechanical analysis of GaAs devices under temperature-humidity-bias testing Kokou Adokanou , Karim Inal , Pierre Montmitonnet , Frédéric Courtade , Barbara Bonnet 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE 2015, Apr 2015, Budapest, Hungary. 8 p. - ISBN 978-1-4799-9949-1 ⟨10.1109/EuroSimE.2015.7103140⟩ Communication dans un congrès hal-01247921v1
	Improvement of freestanding CMOS-MEMS through detailed stress analysis in metallic layers Sebastian Orellana , Brice Arrazat , P. Fornara , Christian Rivero , Antonio Di Giacomo 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, Apr 2014, Ghent, Belgium. 6 p. - ISBN 978-1-4799-4791-1, ⟨10.1109/EuroSimE.2014.6813834⟩ Communication dans un congrès hal-01024062v1
	On the material depletion rate due to electromigration in a copper TSV structure Roberto Lacerda de Orio , Simon Gousseau , Stéphane Moreau , Hajdin Ceric , Siegfried Selberherr 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW) , IEEE, Oct 2014, S. Lake Tahoe, California, United States. pp.111-114 - ISBN 978-1-4799-7308-8 ⟨10.1109/IIRW.2014.7049523⟩ Communication dans un congrès hal-01298215v1
	Determination of material properties and failure using in-situ thermo-mechanical probe Brice Arrazat , Sebastian Orellana , C. Rivero , P. Fornara , Antonio Di Giacomo 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2014, Apr 2014, Cannes, France. pp.Article number 7056700 - ISBN 978-2-35500-028-7, ⟨10.1109/DTIP.2014.7056700⟩ Communication dans un congrès hal-01143767v1
	First in Operando SEM Observation of Electromigration-Induced Voids in TSV Structures Simon Gousseau , Stéphane Moreau , David Bouchu , Alexis Farcy , Pierre Montmitonnet 39th International Symposium for Testing and Failure Analysis - ISTFA 2013, Nov 2013, San Jose, California, United States. pp.59-68 - ISBN 978-1-62708-022-4 Communication dans un congrès hal-01052908v1