CV Accueil - Archive ouverte HAL

Publications

	« Investigation on TSV impact on 65nm CMOS devices and circuits » Henda Chaabouni , Rousseau M. , Leduc P. , Farcy A. , Farhane R. El , IEEE International Electron Devices Meeting,, Dec 2010, San Francisco, United States Communication dans un congrès hal-01074810v1
	« Integration and frequency dependent electrical modeling of Through Silicon Vias (TSV) for high density 3DICs” Cadix L. , Rousseau M. , Fuchs C. , Leduc P. , Thuaire A. IEEE International Interconnect Technology Conference,, Jun 2010, San Francisco, United States Communication dans un congrès hal-01074766v1