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Francois Bay

2
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865598

On the material depletion rate due to electromigration in a copper TSV structure

Roberto Lacerda de Orio , Simon Gousseau , Stéphane Moreau , Hajdin Ceric , Siegfried Selberherr
2014 IEEE International Integrated Reliability Workshop Final Report (IIRW) , IEEE, Oct 2014, S. Lake Tahoe, California, United States. pp.111-114 - ISBN 978-1-4799-7308-8 ⟨10.1109/IIRW.2014.7049523⟩
Communication dans un congrès hal-01298215v1

First in Operando SEM Observation of Electromigration-Induced Voids in TSV Structures

Simon Gousseau , Stéphane Moreau , David Bouchu , Alexis Farcy , Pierre Montmitonnet
39th International Symposium for Testing and Failure Analysis - ISTFA 2013, Nov 2013, San Jose, California, United States. pp.59-68 - ISBN 978-1-62708-022-4
Communication dans un congrès hal-01052908v1