Francois Bay
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Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influenceMicroelectronics Reliability, 2015, 55 (8), pp.1205-1213. ⟨10.1016/j.microrel.2015.05.019⟩
Article dans une revue
hal-01166314v1
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On the material depletion rate due to electromigration in a copper TSV structure 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW) , IEEE, Oct 2014, S. Lake Tahoe, California, United States. pp.111-114 - ISBN 978-1-4799-7308-8 ⟨10.1109/IIRW.2014.7049523⟩
Communication dans un congrès
hal-01298215v1
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First in Operando SEM Observation of Electromigration-Induced Voids in TSV Structures39th International Symposium for Testing and Failure Analysis - ISTFA 2013, Nov 2013, San Jose, California, United States. pp.59-68 - ISBN 978-1-62708-022-4
Communication dans un congrès
hal-01052908v1
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