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	Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence Simon Gousseau , Stéphane Moreau , David Bouchu , Alexis Farcy , Pierre Montmitonnet Microelectronics Reliability, 2015, 55 (8), pp.1205-1213. ⟨10.1016/j.microrel.2015.05.019⟩ Article dans une revue hal-01166314v1