Number of documents

61

CV Francis Calmon sur HAL


Journal articles21 documents

  • M.M. Vignetti, F. Calmon, G. Pares, R. Cellier, L. Quiquerez, et al.. 3D Silicon Coincidence Avalanche Detector (3D-SiCAD) for charged particle detection. Nucl.Instrum.Meth.A, 2018, 881, pp.53-59. 〈10.1016/j.nima.2017.10.089〉. 〈hal-01703734〉
  • Tao Zhou, Yazi Cao, Zhiqun Cheng, Martine Le Berre, Francis Calmon. A High-Efficiency Compact Planar Antenna for ISM Wireless Systems. International Journal of Antennas and Propagation, Hindawi Publishing Corporation, 2017, 2017, pp.1 - 5. ⟨10.1155/2017/7319275⟩. ⟨hal-01888316⟩
  • M.M. Vignetti, F. Calmon, P. Lesieur, A. Savoy-Navarro. Simulation study of a novel 3D SPAD pixel in an advanced FD-SOI technology. Solid-State Electronics, Elsevier, 2017, 128, pp.163 - 171. ⟨10.1016/j.sse.2016.10.014⟩. ⟨hal-01885619⟩
  • Daniel Thomas, Etienne Puyoo, Martine Le Berre, Liviu Militaru, Siddardha Koneti, et al.. Investigation of the in-plane and out-of-plane electrical properties of metallic nanoparticles in dielectric matrix thin films elaborated by atomic layer deposition. Nanotechnology, Institute of Physics, 2017, 28 (45), 455602 (8 p.). ⟨http://iopscience.iop.org/article/10.1088/1361-6528/aa8b5e/pdf⟩. ⟨hal-01644827⟩
  • Yue Ma, Latifa Fakri-Bouchet, Francis Calmon, Christian Gontrand. Electrothermal Modeling for 3-D Nanoscale Circuit Substrates: Noise. IEEE Transactions on Components and Packaging Technologies, Institute of Electrical and Electronics Engineers, 2016, 6 (7), pp.1042-1052. ⟨10.1109/TCPMT.2016.2575363⟩. ⟨hal-01701400⟩
  • N. Guillaume, E. Puyoo, M. Le Berre, D. Albertini, N. Baboux, et al.. Study and characterization of the irreversible transformation of electrically stressed planar Ti/TiO x /Ti junctions. Journal of Applied Physics, American Institute of Physics, 2015, 118 (14), pp.144502. ⟨hal-02048470⟩
  • K. El Hajjam, Mohamed-Amine Bounouar, Nicolas Baboux, S. Ecoffey, M. Guilmain, et al.. Tunnel junction engineering for optimized Metallic Single Electron Transistor. IEEE Transactions on Electron Devices, Institute of Electrical and Electronics Engineers, 2015, 62 (9), pp.2298-3003. ⟨10.1109/TED.2015.2452575⟩. ⟨hal-01489315⟩
  • Tao Zhou, Z. Cheng, H. Zhang, M. Le Berre, Liviu Militaru, et al.. Miniaturized Tunable TeraHertz Antenna Based on Graphene. Microwave and Optical Technology Letters, Wiley, 2015, 56 (8), pp. 1792-1794. ⟨hal-01489440⟩
  • Inga Zbierska, Liviu Militaru, Françis Calmon, Sylvain Feruglio, Guo-Neng Lu. Electrical characterization and TCAD simulations of multi-gate bulk nMOSFET. Microelectronics Journal, Elsevier, 2015, 46 (7), pp.588-592. ⟨10.1016/j.mejo.2015.03.018⟩. ⟨hal-01488981⟩
  • Jean-Etienne Lorival, Francis Calmon, Fengyuan Sun, Felipe Frantz, Carole Plossu, et al.. An efficient and simple compact modeling approach for 3-D interconnects with IC׳s stack global electrical context consideration. Microelectronics Journal, Elsevier, 2015, 46 (2), pp.153-165. ⟨10.1016/j.mejo.2014.12.002⟩. ⟨hal-02060679⟩
  • M.M. Vignetti, F. Calmon, R. Cellier, P. Pittet, L. Quiquerez, et al.. Design guidelines for the integration of Geiger-mode avalanche diodes in standard CMOS technologies. Microelectronics Journal, Elsevier, 2015, 46 (10), pp.900 - 910. ⟨10.1016/j.mejo.2015.07.002⟩. ⟨hal-01886644⟩
  • Jean-Etienne Lorival, Francis Calmon, Fengyuan Sun, Felipe Frantz, Carole Plossu, et al.. An efficient and simple compact modeling approach for 3-D interconnects with IC's stack global electrical context consideration. Microelectronics Journal, Elsevier, 2015, 46 (2), pp.153-165. ⟨hal-01489397⟩
  • Matteo Vignetti, Francis Calmon, Rémy Cellier, Patrick Pittet, Laurent Quiquerez, et al.. Preliminary simulation study of a Coincidence Avalanche Pixel Sensor. Journal of Instrumentation, IOP Publishing, 2015, 10, pp.C06007. 〈hal-01489375〉
  • Fengyuan Sun, Jean-Etienne Lorival, Francis Calmon, Christian Gontrand. Through silicon vias: from a physical point of view to a compact models initiation. The International Journal for Computation and Mathematics in Electrical and Elec, 2014, 33, pp.1462-1484. 〈hal-01489936〉
  • K. El Hajjam, Nicolas Baboux, Francis Calmon, Abdelkader Souifi, O. Poncelet, et al.. Highly transparent low capacitance PEALD Al2O3-HfO2 tunnel junction engineering. Journal of Vacuum Science and Technology, American Vacuum Society (AVS), 2014, 32, pp.01A132. 〈hal-01490344〉
  • Christian Gontrand, Fengyuan Sun, R. Cardenas, P. Ma, Carole Plossu, et al.. 3D substrate modeling; from a first order electrical analysis, towards some possible signal fluctuations consideration, for radiofrequency circuits. Microelectronics Journal, Elsevier, 2014, 45, pp.1061-1068. ⟨hal-01490330⟩
  • E. Eid, T. Lacrevaz, C. Bermond, S. de Rivaz, S. Capraro, et al.. "Characterization and Modelling of Substrate Coupling Effects in 3D Integrated Circuit Stacking". Microelectronic Engineering, Elsevier, 2011, 88 (5), pp.729-733. ⟨hal-01068838⟩
  • T. Zhou, M. Le Berre, Evangéline Bènevent, A.-S. Dehlinger, F. Calmon, et al.. Coplanar waveguides with or without barium ferrite thin films. Microwave and Optical Technology Letters, Wiley, 2010, 52 (9), pp.2007-2010. ⟨10.1002/mop.25393⟩. ⟨ujm-00733387⟩
  • E. Buccafurri, R. Clerc, F. Calmon, M.G. Pala, A. Poncet, et al.. Performances Comparison of Si and GaAs Based Resonant Tunneling Diodes. Physica Stat. Sol. (c), 2009, 6 (6), pp.1408-1411. 〈hal-00596139〉
  • F. Calmon, M. Fathallah, Pierre-Jean Viverge, C. Gontrand, J. Carrabina, et al.. FPGA and mixed FPGA-DSP implementations of electrical drive algorithms. FIELD-PROGRAMMABLE LOGIC AND APPLICATIONS, PROCEEDINGS LECTURE NOTES IN COMPUTER SCIENCE, 2002, 2438, pp.1144-1147. 〈hal-00141474〉
  • F. Calmon, J.-P. Chante, A. Sénès, B. Reymond. Numerical and Analytical Investigations on IGBTs Thermal Behaviour. Journal de Physique III, EDP Sciences, 1997, 7 (3), pp.689-705. 〈10.1051/jp3:1997149〉. 〈jpa-00249607〉

Conference papers30 documents

  • T. Chaves De Albuquerque, F. Calmon, R. Clerc, P. Pittet, Y. Benhammou, et al.. Integration of SPAD in 28nm FDSOI CMOS technology. ESSDERC, 2018, Dresden, Germany. 〈10.1109/ESSDERC.2018.8486852〉. 〈hal-01958249〉
  • Daniel Thomas, Etienne Puyoo, Martine Le Berre, Liviu Militaru, S. Koneti, et al.. Pt nanoislands embedded in Al2O3 matrix: from ALD-based fabrication to structural to electrical characterization. EMRS Spring Meeting, Jan 2017, Strasbourg, France. 2017. 〈hal-01701466〉
  • Daniel Thomas, Etienne Puyoo, M. Le Berre, Liviu Militaru, S. Koneti, et al.. PEALD Platinum Nano-island SET Fabrication and Electrical Characterization. AVS 17th International Conference on Atomic Layer Deposition, Jan 2017, Denver, United States. 2017. 〈hal-01701467〉
  • M. Vignetti, F. Calmon, P. Pittet, G. Pares, R. Cellier, et al.. Development of a 3D silicon coincidence avalanche detector for charged particle tracking in medical applications. 2016 IEEE Nuclear Science Symposium, Medical Imaging Conference and Room-Temperature Semiconductor Detector Workshop (NSS/MIC/RTSD), Oct 2016, Strasbourg, France. IEEE, 〈10.1109/NSSMIC.2016.8069553〉. 〈hal-01886637〉
  • Francis Calmon, Matteo Vignetti. Novel 3D SPAD architecture in an advanced FDSOI technology. 8th International Workshop on Intelligent Fast Interconnected and Efficient Devices for Frontier Exploitation in Research and Industry (INFIERI), 2016, FermiLab, USA, United States. 2016. 〈hal-01489097〉
  • Daniel Thomas, Etienne Puyoo, M. Le Berre, Liviu Militaru, S. Koneti, et al.. Shadow Edge Lithography coupled with ALD growth of Alumina and Platinum Nanoislands Towards the Fabrication of Single Electron Transistors. EMRS Fall Meeting, 2016, Warsaw, Poland. 2016. 〈hal-01489069〉
  • Etienne Puyoo, Nicolas Guillaume, M. Le Berre, David Albertini, Nicolas Baboux, et al.. On the irreversible transformation of Ti/TiOx/Ti junctions under electrical stress. Energy Materials and Nanotechnology, 2016, Prague, Czech Republic. 2016. 〈hal-01489096〉
  • K. El Hajjam, Mohamed-Amine Bounouar, D. Drouin, Francis Calmon. Enhancing electrical performances of Metallic DG-SET based circuits by Tunnel junction engineering. Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon, 2016, Vienna, Austria. 2016. 〈hal-01489101〉
  • Matteo Vignetti, Francis Calmon, P. Lesieur, T. Graziosi, A. Savoy-Navarro. A novel 3D pixel concept for Geiger-mode detection in SOI technology. Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon, 2016, Vienna, Austria. 2016. 〈hal-01489132〉
  • M. Vignetti, F. Calmon, R. Cellier, P. Pittet, L. Quiquerez, et al.. A time-integration based quenching circuit for Geiger-mode avalanche diodes. 2015 IEEE 13th International New Circuits and Systems Conference (NEWCAS), Jun 2015, Grenoble, France. IEEE, 〈10.1109/NEWCAS.2015.7182007〉. 〈hal-01886653〉
  • Inga Jolanta Zbierska, L. Militaru, F. Calmon, Sylvain Feruglio, Guo-Neng Lu. Investigation of Electrical Characteristics of Multi-Gate Bulk nMOSFET. IEEE. 29th International Conference on Microelectronics - MIEL 2014, May 2014, Belgrade, Serbia. Microelectronics Proceedings - MIEL 2014, 2014 29th International Conference on, pp.95 - 98, 〈10.1109/MIEL.2014.6842094〉. 〈hal-01201800〉
  • Nicolas Guillaume, Etienne Puyoo, Martine Le Berre, David Albertini, Nicolas Baboux, et al.. Oxydation locale d’une couche de titane par AFM pour la réalisation de composants mono-électroniques : étude paramétrée de différents modes de types de pointes. 17èmes Journées Nationales du Réseau Doctoral en Micro-Nanoélectronique, 2014, Lille, France. 2014. 〈hal-01489838〉
  • Mohamed-Amine Bounouar, D. Drouin, Francis Calmon. Towards Nano-Computing Blocks Using Room Temperature Double-Gate Single Electron Transistors. 12th IEEE International New Circuits and Systems Conference (NEWCAS 2014), 2014, Trois-Rivières, Canada. 2014. 〈hal-01489822〉
  • Francis Calmon, Christian Gontrand. Electrical modeling of 3D interconnects: a set of tools under development. Fourth International Workshop on Intelligent Fast Interconnected and Efficient Devices for Frontier Exploitation in Research and Industry, 2014, Madrid, Spain. 2014. 〈hal-01490294〉
  • P. Coudrain, Dominique Henry, A. Berthelot, J. Charbonnier, S. Verrun, et al.. 3D Integration of CMOS Image Sensor with Coprocessor Using TSV last and Micro-Bumps Technologies. IEEE 63rd Electronic Components and Technology Conf., May 2013, Las Vegas, United States. pp.674-682, 2013. 〈hal-01018405〉
  • Inga Zbierska, Liviu Militaru, Françis Calmon, Sylvain Feruglio, Guo-Neng Lu. Experimental Study of a Bulk-Technology Tri-gates nMOSFET. Colloque du GDR Systemes materiels-logiciels integres, Jun 2013, Lyon, France. 〈hal-01217536〉
  • Guillaume Nicolas, Etienne Puyoo, Martine Le Berre, David Albertini, Nicolas Baboux, et al.. Nano fabrication of oxide patterns using Atomic Force Microscopy on titanium towards the development of Nano devices. ICQNM (Seventh International Conference on Quantum, Nano and Micro Technologies), Aug 2013, Barcelone, Spain. 〈hal-02074965〉
  • E. Eid, T. Lacrevaz, G. Houzet, C. Bermond, B. Fléchet, et al.. "Effects of silicon substrate coupling phenomena on signal integrity for RF or high speed communications in 3D-IC.". IEEE 62nd Electronic Components and Technology Conf.,, May 2012, San Diego, United States. IEEE 62nd Electronic Components and Technology Conf.,, 2012. 〈hal-01062188〉
  • Mohamed Amine Bounouar, Arnaud Beaumont, Khalil El Hajjam, Francis Calmon, Dominique Drouin. Room temperature double gate single electron transistor based standard cell library. 2012 IEEE/ACM International Symposium on Nanoscale Architectures, Jul 2012, Amsterdam, France. pp.146-151, ⟨10.1145/2765491.2765518⟩. ⟨hal-02074668⟩
  • E. Eid, T. Lacrevaz, C. Bermond, S. Capraro, A. Farcy, et al.. " Caractérisation des couplages électriques RF par les substrats de silicium en intégration 3D de circuits ". JNM'11, May 2011, Brest, France. 17èmes journées nationales micro-ondes, 2011. 〈hal-01073528〉
  • E. Eid, T. Lacrevaz, C. Bermond, S. De Rivaz, S. Capraro, et al.. "Characterization and Modelling of Substrate Coupling Effects in 3D Integrated Circuit Stacking". Materials for Advanced Metallization, Mar 2010, Mechelen, Belgium. 2010. 〈hal-00604323〉
  • E. Eid, T. Lacrevaz, C. Bermond, S. De Rivaz, S. Capraro, et al.. " Effets de couplage RF par les substrats de silicium dans les empilements de circuits intégrés 3D ". 11e Journées Caractérisation Microondes et Matériaux, Apr 2010, Brest, France. 2010. 〈hal-00604503〉
  • O. Valorge, F. Calmon, M. Le Berre, C. Gontrand, E. Eid, et al.. " Modélisation RLCG de lignes coplanaires sur un substrat Silicium pour applications CMOS ". 15e Compatibilité Electromagnétique CEM 2010, Apr 2010, Limoges, France. 2010. 〈hal-00604508〉
  • E. Eid, T. Lacrevaz, C. Bermond, S. De Rivaz, S. Capraro, et al.. "Characterization and Modeling of RF Substrate Coupling Effects due to Vertical Interconnects in 3D Integrated Circuit Stacking ". IEEE Signal Propagation on Interconnects,, May 2010, Hidelsheim, Germany. 2010. 〈hal-00604327〉
  • E. Eid, T. Lacrevaz, C. Bermond, S. Capraro, J. Roullard, et al.. Frequency and Time Domain Characterization of Substrate Coupling Effects in 3D Integration Stack. IEEE Int. Electronics Manufacturing Technology Conf.,, Dec 2010, Melaka, Malaysia. 2010. 〈hal-00604338〉
  • Eid E., Lacrevaz T., Bermond C., Rivaz S. De, Capraro S., et al.. “Characterization and Modelling of Substrate Coupling Effects in 3D Integrated Circuit Stacking” Materials for Advanced Metallization, March 7-10, 2010, Mechelen, Belgium.. Materials for Advanced Metallization, Mechelen, Belgium., Mar 2010, Mechelen, Belgium. 〈hal-01074511〉
  • E. Buccafurri, R. Clerc, F. Calmon, M. Pala, A. Poncet, et al.. Intrinsic Cut Off Frequency of Si and GaAs Based Resonant Tunneling Diodes. Int. Conference on Ultimate Integration of Silicon, Aachen, Mar 2009, Germany. pp.91-94, 2009. 〈hal-00604239〉
  • E. Eid, T. Lacrevaz, S. De Rivaz, C. Bermond, B. Fléchet, et al.. Predictive High Frequency Effects of Substrate Coupling in 3D Integrated Circuits Stacking. Predictive High Frequency Effects of Substrate Coupling in 3D Integrated Circuits Stacking, Sep 2009, San Francisco, United States. 2009. 〈hal-00602866〉
  • E. Buccafurri, A. Medjahdi, F. Calmon, R. Clerc, M. Pala, et al.. Challenges and Prospects of RF Oscillators Using Silicon Resonant Tunneling Diodes. European Solid-State Device Research Conference, Sep 2009, Athènes, Greece. Proceeding of ESSDERC, IEEE, pp.237-241, 2009. 〈hal-00603719〉
  • E. Buccafurri, R. Clerc, F. Calmon, M. Pala, A. Poncet, et al.. Performances Comparison of Si and GaAs Based Resonant Tunneling Diodes. ISCS 2008, The International Symposium on Compound Semiconductors, Sep 2008, France. 2008. 〈hal-00391921〉

Poster communications9 documents

  • M. Vignetti, F. Calmon, P. Pittet, G. Pares, R. Cellier, et al.. 3D Silicon Coincidence Avalanche Detector (3D-SiCAD) for Hadrontherapy and Proton Tomography : Preliminary Results on Charged Particle Detection. Forum de la Recherche en Cancérologie Auvergne-Rhône-Alpes 2017, Apr 2017, Lyon, France. 〈hal-01504838〉
  • Daniel Thomas, Etienne Puyoo, Martine Le Berre, Liviu Militaru, S. Koneti, et al.. ALD growth of Platinum Nanoislands on Alumina for Single Electron Transistors Applications. ALD growth of Platinum Nanoislands on Alumina for Single Electron Transistors Applications, 2016, Paris, Unknown Region. 2016. 〈hal-01489072〉
  • Nicolas Guillaume, Etienne Puyoo, M. Le Berre, David Albertini, Nicolas Baboux, et al.. On the behavior of electrically stressed Ti/TiOx/Ti junctions fabricated by local anodic oxidation. On the behavior of electrically stressed Ti/TiOx/Ti junctions fabricated by local anodic oxidation, 2015, Lille, Unknown Region. 2015. 〈hal-01489627〉
  • Daniel Thomas, Etienne Puyoo, Martine Le Berre, Liviu Militaru, David Albertini, et al.. Shadow Edge Evaporation for Single Electron Transistors. Shadow Edge Evaporation for Single Electron Transistors, 2015, Lyon, Unknown Region. 2015. 〈hal-01489632〉
  • Nicolas Guillaume, Etienne Puyoo, Martine Le Berre, David Albertini, Nicolas Baboux, et al.. Oxydation locale d’une couche de titane par AFM pour la réalisation de composants mono-électroniques : étude paramétrée de différents modes de types de pointes. Journées Nationales du Réseau Doctoral en Micro-Nanoélectronique, May 2014, Lille, France. 〈hal-02075131〉
  • Nicolas Guillaume, Etienne Puyoo, Martine Le Berre, David Albertini, Nicolas Baboux, et al.. Oxydation par AFM de fines couches métalliques pour la réalisation de composants mono-électroniques. Journées Nationales du Réseau Doctoral en Micro-Nanoélectronique, Jun 2013, Grenoble, France. 〈hal-02075185〉
  • Nicolas Guillaume, Etienne Puyoo, David Albertini, Nicolas Baboux, Martine Le Berre, et al.. Comparison of two conductive AFM probes for the local nano-oxidation of Ti thin films. Journées Nationales sur les Technologies Emergentes en micro-nanofabrication, May 2013, Evian, France. 〈hal-02075206〉
  • Nicolas Guillaume, Etienne Puyoo, David Albertini, Nicolas Baboux, Martine Le Berre, et al.. Elaboration by AFM lithography of nanostructured Ti/TiOx/Ti tunnel junction. Euromat 2013 (European Congress & Exhibition on Advanced Materials and Processes), Sep 2013, Seville, Spain. 〈hal-02075164〉
  • Nicolas Guillaume, Etienne Puyoo, David Albertini, Nicolas Baboux, Martine Le Berre, et al.. Use of Atomic Force Microscopy towards the Development of Nano Devices by Fabricating Oxide Patterns on Titanium thin Film. First French-German Summer School on Noncontact Atomic Force Microscopy, Oct 2013, Porquerolles, France. 〈hal-02075144〉

Book sections1 document

  • Olivier Valorge, Fengyuan Sun, Jean-Etienne Lorival, Francis Calmon, Christian Gontrand. Mixed-Signal IC Design addressed to Substrate Noise Immunity in Bulk Silicon ; towards 3D circuits. CRC Press, Germany. Mixed-Signal IC Design addressed to Substrate Noise Immunity in Bulk Silicon ; towards 3D circuits, VALORGE, SUN, LORIVAL, CALMON, GONTRAND, 2015. 〈hal-01489586〉