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Florent Morel

23

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Identifiants chercheurs

florent-morel
0000-0003-3098-7806
Google Scholar : https://scholar.google.fr/citations?user=OJ-AgGoAAAAJ&hl=fr
IdRef : 127986677

Présentation

Publications

cyril-buttay

	Thermal Considerations of a Power Converter with Components Embedded in Printed Circuit Boards Rémy Caillaud , Cyril Buttay , Roberto Mrad , Johan Le Lesle , Florent Morel IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019, 10 (2), ⟨10.1109/TCPMT.2019.2939969⟩ Article dans une revue hal-02291493v1
	Thermal Stability of Silicon Carbide Power JFETs Cyril Buttay , Rémy Ouaida , Hervé Morel , Dominique Bergogne , Christophe Raynaud IEEE Transactions on Electron Devices, 2013, 60 (12), pp.4191 - 4198. ⟨10.1109/TED.2013.2287714⟩ Article dans une revue hal-00881667v1
	Thermal Runaway Robustness of SiC VJFETs Rémy Ouaida , Cyril Buttay , Anh Dung Hoang , Raphaël Riva , Dominique Bergogne Materials Science Forum, 2013, 740-742, pp.929-933. ⟨10.4028/www.scientific.net/MSF.740-742.929⟩ Article dans une revue hal-00799884v1
	Thermal stability of silicon-carbide power diodes Cyril Buttay , Christophe Raynaud , Hervé Morel , Gabriel Civrac , Marie-Laure Locatelli IEEE Transactions on Electron Devices, 2012, 59 (3), pp.761-769. ⟨10.1109/TED.2011.2181390⟩ Article dans une revue hal-00672440v1
	A Comparative Study of Predictive Current Control Schemes for a Permanent Magnet Synchronous Machine Drive Florent Morel , Xuefang Lin-Shi , Jean-Marie Rétif , Bruno Allard , Cyril Buttay IEEE Transactions on Industrial Electronics, 2009, 56 (7), pp.2715 - 2728. ⟨10.1109/TIE.2009.2018429⟩ Article dans une revue hal-00386480v1

	Figures-of-Merit and current metric for the comparison of IGCTs and IGBTs in Modular Multilevel Converters Arthur Boutry , Cyril Buttay , Dong Dong , Rolando Burgos , Bruno Lefebvre 2020 CPES Annual conference, Center for Power Electronic Systems, Aug 2020, Blacksburg, VA, United States Communication dans un congrès hal-04525165v1
	Figures-of-Merit and current metric for the comparison of IGCTs and IGBTs in Modular Multilevel Converters Arthur Boutry , Cyril Buttay , Dong Dong , Rolando Burgos , Bruno Lefebvre EPE’20 ECCE Europe, Sep 2020, Lyon, France. ⟨10.23919/EPE20ECCEEurope43536.2020.9215711⟩ Communication dans un congrès hal-02968851v1
	Evaluation of the PCB-embedding technology for a 3.3 kW converter Rémy Caillaud , Johan Le Lesle , Cyril Buttay , Florent Morel , Roberto Mrad IEEE IWIPP, Apr 2019, Toulouse, France. ⟨10.1109/IWIPP.2019.8799080⟩ Communication dans un congrès hal-02291502v1
	Application of the PCB-Embedding Technology to a 3.3 kW Power Factor Corrector Rémy Caillaud , Johan Le Lesle , Cyril Buttay , Florent Morel , Roberto Mrad APEC, Mar 2019, Anaheim, Californie, United States Communication dans un congrès hal-02076184v1
	A 3D Folded Power Inductor with PCB based technology for applications in the kW range Johan Le Lesle , Corentin Darbas , Florent Morel , Nicolas Degrenne , Rémy Caillaud APEC, Mar 2019, Anaheim, Californie, United States. ⟨10.1109/APEC.2019.8722295⟩ Communication dans un congrès hal-02076182v1
	Optimisation of an Integrated Bidirectional Interleaved Single-Phase Power Factor Corrector Johan Le Lesle , Rémy Caillaud , Florent Morel , Nicolas Degrenne , Cyril Buttay PCIM Europe 2018, Jun 2018, Nuremberg, Germany Communication dans un congrès hal-01844988v1
	Optimum Design of a Single-Phase Power Pulsating Buffer (PPB) with PCB-integrated Inductor Technologies Johan Le Lesle , Rémy Caillaud , Cyril Buttay , Florent Morel , Nicolas Degrenne 2018 IEEE ICIT, Feb 2018, Lyon, France. ⟨10.1109/ICIT.2018.8352277⟩ Communication dans un congrès hal-01736332v1
	Application of the PCB-Embedding Technology in Power Electronics – State of the Art and Proposed Development Cyril Buttay , Christian Martin , Florent Morel , Rémy Caillaud , Johan Le Leslé 3D-PEIM, Jun 2018, College Park, Maryland, United States. ⟨10.1109/3DPEIM.2018.8525236⟩ Communication dans un congrès hal-01844981v1
	Design, manufacturing and characterization of printed circuit board embedded inductors for power applications Rémy Caillaud , Cyril Buttay , Roberto Mrad , Johan Le Lesle , Florent Morel 2018 IEEE ICIT, Feb 2018, Lyon, France. ⟨10.1109/ICIT.2018.8352262⟩ Communication dans un congrès hal-01736336v1
	Design of a 3kW power converter using PCB-embedding technology Rémy Caillaud , Johan Le Lesle , Cyril Buttay , Florent Morel , Roberto Mrad From Nano to Micro Power Electronics And Packaging Workshop (IMAPS), Nov 2018, Tours, France Communication dans un congrès hal-01935157v1
	Multi-objective optimisation of a bidirectional single-phase grid connected AC/DC converter (PFC) with two different modulation principles Johan Le Lesle , Rémy Caillaud , Florent Morel , Nicolas Degrenne , Cyril Buttay ECCE, Oct 2017, Cincinnati, OH, United States. ⟨10.1109/ECCE.2017.8096889⟩ Communication dans un congrès hal-01644174v1
	High power PCB-embedded inductors based on ferrite powder Rémy Caillaud , Cyril Buttay , Johan Le Lesle , Florent Morel , Roberto Mrad 5th Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum (MiNaPAD 2017, IMAPS, May 2017, Grenoble, France Communication dans un congrès hal-01535727v1
	Comparison of planar and Toroidal PCB integrated inductors for a multi-cellular 3.3 kW PFC Rémy Caillaud , Cyril Buttay , Roberto Mrad , Johan Le Lesle , Florent Morel 2017 IEEE IWIPP, Apr 2017, Delft, Netherlands. ⟨10.1109/IWIPP.2017.7936757⟩ Communication dans un congrès hal-01535721v1
	Layout modelling to predict compliance with EMC standards of power electronic converters Anne-Sophie Podlejski , Arnaud Bréard , Cyril Buttay , Eliana Rondon , Florent Morel EMC, Aug 2015, Dresden, Germany. pp.779-784, ⟨10.1109/ISEMC.2015.7256262⟩ Communication dans un congrès hal-01188561v1
	Thermal stability of SiC JFETs in conduction mode Rémy Ouaida , Cyril Buttay , Raphaël Riva , Dominique Bergogne , Christophe Raynaud EPE, Sep 2013, Lille, France. paper 223, ⟨10.1109/EPE.2013.6631881⟩ Communication dans un congrès hal-00874471v1
	Predicting Static Losses in an Inverter-Leg built with SiC Normally-Off JFETs and SiC diodes Xavier Fonteneau , Florent Morel , Cyril Buttay , Hervé Morel , Philippe Lahaye APEC, Mar 2013, Long Beach, CA, United States. pp.2636-2642, ⟨10.1109/APEC.2013.6520668⟩ Communication dans un congrès hal-00829353v1
	Thermal Runaway Robustness of SiC VJFETs Rémy Ouaida , Cyril Buttay , Anh Dung Hoang , Raphaël Riva , Dominique Bergogne CSCRM, Sep 2012, Saint-Pétersbourg, Russia. 2p Communication dans un congrès hal-00759975v2
	Thermal Requirements of SiC Power Devices Cyril Buttay , Christophe Raynaud , Hervé Morel , Gabriel Civrac , Marie-Laure Locatelli 6th European Advanced Technology Workshop on Micropackaging and Thermal Management, Feb 2011, La Rochelle, France Communication dans un congrès hal-00672631v1