Damien Deleruyelle
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Modelling of vertical and ferroelectric junctionless technology for efficient 3D neural network compute cube dedicated to embedded artificial intelligence (Invited)67th Annual IEEE International Electron Devices Meeting (IEDM 2021), Dec 2021, San Fransisco, United States. ⟨10.1109/IEDM19574.2021.9720572⟩
Communication dans un congrès
hal-03408078v1
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Why neuromorphic computing need novel 3D technologies? A view from FVLLMONTI European project consortium (Invited)High Performance Embedded Architecture and Compilation, Computing Systems Week, (HiPEAC CSW) Autumn 2021, Oct 2021, Lyon, France
Communication dans un congrès
hal-03408071v1
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