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Number of documents

139

Publications de Cyril BUTTAY


Journal articles39 documents

  • Rémy Caillaud, Cyril Buttay, Roberto Mrad, Johan Le Lesle, Florent Morel, et al.. Thermal Considerations of a Power Converter with Components Embedded in Printed Circuit Boards. IEEE Transactions on Components, Packaging and Manufacturing Technology, Institute of Electrical and Electronics Engineers, 2019, 10 (2), ⟨10.1109/TCPMT.2019.2939969⟩. ⟨hal-02291493⟩
  • Oriol Aviñó-Salvadó, Besar Asllani, Cyril Buttay, Christophe Raynaud, Hervé Morel. Extraction of the 4H-SiC/SiO₂ Barrier Height Over Temperature. IEEE Transactions on Electron Devices, Institute of Electrical and Electronics Engineers, 2019, 67 (1), pp.63 - 68. ⟨10.1109/TED.2019.2955181⟩. ⟨hal-02418097⟩
  • Layachi Boussouar, Hervé Morel, Bruno Allard, Cyril Buttay. Analysis and modelling of the role of temperature in the static forward characteristics of an IGBT. International Journal of Power Electronics, Inderscience, 2019, 10 (3), pp.187. ⟨10.1504/ijpelec.2019.099337⟩. ⟨hal-02121811⟩
  • Oriol Aviño Salvado, C. Cheng, Cyril Buttay, Hervé Morel, D Labrousse, et al.. SiC MOSFETs robustness for diode-less applications. European Power Electronics and Drives Journal, Taylor & Francis, 2018, pp.1 - 8. ⟨10.1080/09398368.2018.1456836⟩. ⟨hal-01844980⟩
  • Oriol Aviño Salvado, Hervé Morel, Cyril Buttay, Denis Labrousse, Stéphane Lefebvre. Threshold voltage instability in SiC MOSFETs as a consequence of current conduction in their body diode. Microelectronics Reliability, Elsevier, 2018, 88-90, pp.636-640. ⟨10.1016/j.microrel.2018.06.033⟩. ⟨hal-01895791⟩
  • Wissam Sabbah, Pierre Bondue, Oriol Aviño Salvado, Cyril Buttay, Héìène Frémont, et al.. High temperature ageing of microelectronics assemblies with SAC solder joints. Microelectronics Reliability, Elsevier, 2017, ⟨10.1016/j.microrel.2017.06.065⟩. ⟨hal-01564755⟩
  • Aymen Ben Kabaar, Cyril Buttay, Olivier Dezellus, R Estevez, Anthony Gravouil, et al.. Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications. Microelectronics Reliability, Elsevier, 2017, ⟨10.1016/j.microrel.2017.06.001⟩. ⟨hal-01541230⟩
  • Ilyas Dchar, Cyril Buttay, Hervé Morel. SiC power devices packaging with a short-circuit failure mode capability. Microelectronics Reliability, Elsevier, 2017, ⟨10.1016/j.microrel.2017.07.003⟩. ⟨hal-01562547⟩
  • Wissam Sabbah, Faical Arabi, Oriol Aviño Salvado, Cyril Buttay, Loic Théolier, et al.. Lifetime of power electronics interconnections in accelerated test conditions: High temperature storage and thermal cycling. Microelectronics Reliability, Elsevier, 2017, ⟨10.1016/j.microrel.2017.06.091⟩. ⟨hal-01562549⟩
  • Oriol Aviño Salvado, Wissam Sabbah, Cyril Buttay, Hervé Morel, Pascal Bevilacqua. Evaluation of printed-circuit boards materials for high temperature operation. Journal of Microelectronics and Electronic Packaging, International Microelectronics And Packaging Society (IMAPS), 2017, 14 (4), ⟨10.4071/imaps.516313⟩. ⟨hal-01674483⟩
  • Ilyas Dchar, Cyril Buttay, Hervé Morel. Avalanche robustness of SiC Schottky diode. Microelectronics Reliability, Elsevier, 2016, ⟨10.1016/j.microrel.2016.07.086⟩. ⟨hal-01373039⟩
  • Jean-Louis Marchesini, Pierre-Olivier Jeannin, Yvan Avenas, Johan Delaine, Cyril Buttay, et al.. Implementation and Switching Behavior of a PCB-DBC IGBT Module Based on the Power Chip-on-Chip 3D Concept. IEEE Transactions on Industry Applications, Institute of Electrical and Electronics Engineers, 2016, PP (99), ⟨10.1109/TIA.2016.2604379⟩. ⟨hal-01373011⟩
  • Chenjiang Yu, Cyril Buttay, Eric Labouré. Thermal management and electromagnetic analysis for GaN devices packaging on DBC substrate. IEEE Transactions on Power Electronics, Institute of Electrical and Electronics Engineers, 2016, 32 (2), pp. 906 - 910. ⟨10.1109/TPEL.2016.2585658⟩. ⟨hal-01373065⟩
  • Justine Billore, Stanislas Hascoët, Rémi Robutel, Cyril Buttay, Jianfeng Li. Sintered-Silver Bonding of High-Temperature Piezoelectric Ceramic Sensors. IEEE Transactions on Components and Packaging Technologies, Institute of Electrical and Electronics Engineers, 2016, pp.1-7. ⟨10.1109/TCPMT.2016.2628874⟩. ⟨hal-01419042⟩
  • Cheng Chen, Denis Labrousse, Stéphane Lefebvre, Mickael Petit, Cyril Buttay, et al.. Study of short-circuit robustness of SiC MOSFETs, analysis of the failure modes and comparison with BJTs. Microelectronics Reliability, Elsevier, 2015, pp.6. ⟨10.1016/j.microrel.2015.06.097⟩. ⟨hal-01198584⟩
  • Bassem Mouawad, Benoit Thollin, Cyril Buttay, Laurent Dupont, Vincent Bley, et al.. Direct Copper Bonding for Power Interconnects: Design, Manufacturing, and Test. IEEE Transactions on Components, Packaging and Manufacturing Technology. Part A, Manufacturing Technology, Institute of Electrical and Electronics Engineers (IEEE), 2015, 5 (1), pp.143-150. ⟨10.1109/TCPMT.2014.2376882⟩. ⟨hal-01207014⟩
  • Jianfeng Li, Mark Johnson, Cyril Buttay, Wissam Sabbah, Stephane Azzopardi. Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles. Journal of Materials Processing Technology, Elsevier, 2015, pp.299-308. ⟨10.1016/j.jmatprotec.2014.08.002⟩. ⟨hal-01065130⟩
  • Faouzi Kahlouche, Khamis Youssouf, Mahamat Hassan Béchir, Stéphane Capraro, A. Siblini, et al.. Fabrication and characterization of a planar interleaved micro-transformer with magnetic core. Microelectronics Journal, Elsevier, 2014, 45 (7), pp.893-897. ⟨10.1016/j.mejo.2014.03.003⟩. ⟨hal-01058212⟩
  • Sami Ghedira, Cyril Buttay, Hervé Morel, Kamel Besbes. Measurement and numerical analysis of C-V characteristics for normally-on SiCED-JFET. European Physical Journal: Applied Physics, EDP Sciences, 2014, 66 (2), pp.20103. ⟨10.1051/epjap/2014130533⟩. ⟨hal-01005929⟩
  • Rémy Ouaida, Cyril Buttay, Anh Dung Hoang, Raphaël Riva, Dominique Bergogne, et al.. Thermal Runaway Robustness of SiC VJFETs. Materials Science Forum, Trans Tech Publications Inc., 2013, 740-742, pp.929-933. ⟨10.4028/www.scientific.net/MSF.740-742.929⟩. ⟨hal-00799884⟩
  • Amandine Masson, Wissam Sabbah, Raphaël Riva, Cyril Buttay, Stephane Azzopardi, et al.. Die attach using silver sintering. Practical implementation and analysis. European Journal of Electrical Engineering, Lavoisier, 2013, 16 (3-4), pp.293-305. ⟨10.3166/ejee.16.293-305⟩. ⟨hal-00874465⟩
  • Wissam Sabbah, Stephane Azzopardi, Cyril Buttay, Régis Meuret, Eric Woirgard. Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy. Microelectronics Reliability, Elsevier, 2013, 53 (9-11), pp.1617-1621. ⟨10.1016/j.microrel.2013.07.101⟩. ⟨hal-00881584⟩
  • Raphaël Riva, Cyril Buttay, Bruno Allard, Pascal Bevilacqua. Migration issues in sintered-silver die attaches operating at high temperature. Microelectronics Reliability, Elsevier, 2013, 53 (9-11), pp.1592-1596. ⟨10.1016/j.microrel.2013.07.103⟩. ⟨hal-00874458⟩
  • Rémi Robutel, Christian Martin, Cyril Buttay, Hervé Morel, Paulo Mattavelli, et al.. Design and Implementation of Integrated Common Mode Capacitors for SiC JFET Inverters. IEEE Transactions on Power Electronics, Institute of Electrical and Electronics Engineers, 2013, PP (99), pp.1. ⟨10.1109/TPEL.2013.2279772⟩. ⟨hal-00874455⟩
  • Cyril Buttay, Rémy Ouaida, Hervé Morel, Dominique Bergogne, Christophe Raynaud, et al.. Thermal Stability of Silicon Carbide Power JFETs. IEEE Transactions on Electron Devices, Institute of Electrical and Electronics Engineers, 2013, 60 (12), pp.4191 - 4198. ⟨10.1109/TED.2013.2287714⟩. ⟨hal-00881667⟩
  • Dominique Bergogne, Cyril Buttay, Rémi Robutel, Fabien Dubois, Rémy Ouaida, et al.. Electro-Thermal Behaviour of a SiC JFET Stressed by Lightning Induced Over-Voltages. European Power Electronics and Drives Journal, Taylor & Francis, 2013, 23 (3), pp.5--12. ⟨hal-00997389⟩
  • Bassem Mouawad, Maher Soueidan, D. Fabregue, Cyril Buttay, Vincent Bley, et al.. Full densification of Molybdenum powders using Spark Plasma Sintering. Metallurgical and Materials Transactions A, Springer Verlag/ASM International, 2012, pp.1-8. ⟨10.1007/s11661-012-1144-2⟩. ⟨hal-00707782⟩
  • Bassem Mouawad, Maher Soueidan, D. Fabregue, Cyril Buttay, Bruno Allard, et al.. Application of the Spark Plasma Sintering Technique to Low-Temperature Copper Bonding. IEEE Transactions on Components and Packaging Technologies, Institute of Electrical and Electronics Engineers, 2012, 2 (4), pp.553 - 560. ⟨10.1109/TCPMT.2012.2186453⟩. ⟨hal-00672244⟩
  • Cyril Buttay, Christophe Raynaud, Hervé Morel, Gabriel Civrac, Marie-Laure Locatelli, et al.. Thermal stability of silicon-carbide power diodes. IEEE Transactions on Electron Devices, Institute of Electrical and Electronics Engineers, 2012, 59 (3), pp.761-769. ⟨10.1109/TED.2011.2181390⟩. ⟨hal-00672440⟩
  • Fabien Dubois, Dominique Bergogne, Cyril Buttay, Hervé Morel, Régis Meuret. Normally-On SIC JFETs: Active Protections. European Power Electronics and Drives Journal, Taylor & Francis, 2012, 22 (3), pp.6-13. ⟨hal-00821756⟩
  • Stanislas Hascoët, Cyril Buttay, Dominique Planson, Rodica Chiriac, Amandine Masson. Pressureless Silver Sintering Die-Attach for SiC Power Devices. Materials Science Forum, Trans Tech Publications Inc., 2012, 740 - 742, pp.851-854. ⟨10.4028/www.scientific.net/MSF.740-742.851⟩. ⟨hal-00799893⟩
  • Cyril Buttay, Dominique Planson, Bruno Allard, Dominique Bergogne, Pascal Bevilacqua, et al.. State of the art of high temperature power electronics. Materials Science and Engineering: B, Elsevier, 2011, 176 (4), pp.283-288. ⟨10.1016/j.mseb.2010.10.003⟩. ⟨hal-00597432⟩
  • Elias Haddad, Christian Martin, Charles Joubert, Bruno Allard, Maher Soueidan, et al.. Modeling, Fabrication, and Characterization of Planar Inductors on YIG Substrates. Advanced Materials Research, Trans Tech Publications, 2011, 324, pp.294-297. ⟨10.4028/www.scientific.net/AMR.324.294⟩. ⟨hal-00672240⟩
  • Bassem Mouawad, Maher Soueidan, D. Fabregue, Cyril Buttay, Vincent Bley, et al.. Mechanical Study of Copper Bonded at Low Temperature Using Spark Plasma Sintering Process. Advanced Materials Research, Trans Tech Publications, 2011, 324, pp.177-180. ⟨10.4028/www.scientific.net/AMR.324.177⟩. ⟨hal-00799899⟩
  • Rémi Robutel, Christian Martin, Hervé Morel, Cyril Buttay, Nicolas Gazel, et al.. Design of a High Temperature EMI Input Filter for a 2 kW HVDC-Fed Inverter. Journal of Microelectronics and Electronic Packaging, International Microelectronics And Packaging Society (IMAPS), 2011, 8 (1), pp.23-30. ⟨hal-00729066⟩
  • Florent Morel, Xuefang Lin-Shi, Jean-Marie Rétif, Bruno Allard, Cyril Buttay. A Comparative Study of Predictive Current Control Schemes for a Permanent Magnet Synchronous Machine Drive. IEEE Transactions on Industrial Electronics, Institute of Electrical and Electronics Engineers, 2009, 56 (7), pp.2715 - 2728. ⟨10.1109/TIE.2009.2018429⟩. ⟨hal-00386480⟩
  • Tarek Ben Salah, Cyril Buttay, Bruno Allard, Hervé Morel, Sami Ghedira, et al.. Experimental Analysis of Punch-Through Conditions in Power P-I-N Diodes. IEEE Transactions on Power Electronics, Institute of Electrical and Electronics Engineers, 2007, 22 (1), pp.13-20. ⟨10.1109/TPEL.2006.886648⟩. ⟨hal-00135198⟩
  • Cyril Buttay, Hervé Morel, Bruno Allard, Pierre Lefranc, Olivier Brevet. Model Requirements for Simulation of Low-Voltage MOSFET in Automotive Applications. IEEE Transactions on Power Electronics, Institute of Electrical and Electronics Engineers, 2006, 21 (3), pp.613-624. ⟨10.1109/TPEL.2006.872383⟩. ⟨hal-00138878⟩
  • Cyril Buttay, Tarek Ben Salah, Dominique Bergogne, Bruno Allard, Hervé Morel, et al.. Avalanche Behavior of Low-Voltage Power MOSFETs. IEEE Power Electronics Letters, Institute of Electrical and Electronics Engineers, 2004, 2 (3), pp.104-107. ⟨10.1109/LPEL.2004.839638⟩. ⟨hal-00138863⟩

Conference papers93 documents

  • Vincent Bley, Cyril Buttay, Denis Labrousse, Mickael Petit, Bojan Djuric, et al.. Die Interconnection for Power Module 3.0. ECPE Workshop "Power Module 2.0", Oct 2019, Hambourg, Germany. ⟨hal-02405800⟩
  • Rémy Caillaud, Johan Le Lesle, Cyril Buttay, Florent Morel, Roberto Mrad, et al.. Application of the PCB-Embedding Technology to a 3.3 kW Power Factor Corrector. APEC, Mar 2019, Anaheim, Californie, United States. ⟨hal-02076184⟩
  • Ilyas Dchar, Cyril Buttay, Hervé Morel. Packaging Solution for SiC Power Modules with a Fail-to-Short Capability. APEC, Mar 2019, Anaheim, Californie, United States. ⟨hal-02076181⟩
  • Pierre Demumieux, Oriol Avino-Salvado, Cyril Buttay, Christian Martin, Fabien Sixdenier, et al.. Design of a Low-Capacitance Planar Transformer for a 4 kW/500 kHz DAB Converter. APEC, Mar 2019, Anaheim, Californie, United States. pp.18720757, ⟨10.1109/APEC.2019.8722279⟩. ⟨hal-02076183⟩
  • Johan Le Lesle, Corentin Darbas, Florent Morel, Nicolas Degrenne, Rémy Caillaud, et al.. A 3D Folded Power Inductor with PCB based technology for applications in the kW range. APEC, Mar 2019, Anaheim, Californie, United States. ⟨hal-02076182⟩
  • Rémy Caillaud, Johan Le Lesle, Cyril Buttay, Florent Morel, Roberto Mrad, et al.. Evaluation of the PCB-embedding technology for a 3.3 kW converter. IEEE IWIPP, Apr 2019, Toulouse, France. ⟨10.1109/IWIPP.2019.8799080⟩. ⟨hal-02291502⟩
  • Thilini Wickramasinghe, Cyril Buttay, Christian Martin, Hervé Morel, Pascal Bevilacqua, et al.. An investigation of current distribution over four GaN HEMTs in parallel configurations. The 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA 2019), Oct 2019, Raleigh, United States. ⟨hal-02405882⟩
  • Thilini Wickramasinghe, Bruno Allard, Cyril Buttay, Charles Joubert, Christian Martin, et al.. A Study on Shunt Resistor-based Current Measurements for Fast Switching GaN Devices. 45th IEEE IECON, Oct 2019, Lisbonne, Portugal. ⟨hal-02405883⟩
  • Cyril Buttay, Christian Martin, Charles Joubert, Hervé Morel, Bruno Allard, et al.. Benefits of GaN transistors and embedding in PCB laminates. SIA Power Train & Electronics, Jun 2019, Paris, France. ⟨hal-02291496⟩
  • Majed Moustaid, Vincent Platel, Cyril Buttay. Study of convective condensation in a thermosiphon loop. 14th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics (HEFAT 2019), Jul 2019, Wicklow, Ireland. ⟨hal-02417004⟩
  • Maxime Semard, Christian Martin, Cyril Buttay, Charles Joubert. High-Temperature Coplanar Transformer. 2018 IEEE ICIT, A. Sari, Laboratoire Ampère, Feb 2018, Lyon, France. pp.730 - 735, ⟨10.1109/ICIT.2018.8352268⟩. ⟨hal-01736329⟩
  • Rémy Caillaud, Cyril Buttay, Roberto Mrad, Johan Le Lesle, Florent Morel, et al.. Design, manufacturing and characterization of printed circuit board embedded inductors for power applications. 2018 IEEE ICIT, Feb 2018, Lyon, France. ⟨10.1109/ICIT.2018.8352262⟩. ⟨hal-01736336⟩
  • Thomas Lagier, Laurent Chédot, François Wallart, Layal Ghossein, Bruno Lefebvre, et al.. A 100 kW 1.2 kV 20 kHz DC-DC converter prototype based on the Dual Active Bridge topology. 2018 IEEE ICIT, Feb 2018, Lyon, France. ⟨10.1109/ICIT.2018.8352238⟩. ⟨hal-01747437⟩
  • Cyril Buttay, Christian Martin, Florent Morel, Rémy Caillaud, Johan Le Leslé, et al.. Application of the PCB-Embedding Technology in Power Electronics – State of the Art and Proposed Development. 3D-PEIM, Jun 2018, College Park, Maryland, United States. ⟨10.1109/3DPEIM.2018.8525236⟩. ⟨hal-01844981⟩
  • Johan Le Lesle, Rémy Caillaud, Florent Morel, Nicolas Degrenne, Cyril Buttay, et al.. Optimisation of an Integrated Bidirectional Interleaved Single-Phase Power Factor Corrector. PCIM Europe 2018, Jun 2018, Nuremberg, Germany. ⟨hal-01844988⟩
  • Johan Le Lesle, Rémy Caillaud, Cyril Buttay, Florent Morel, Nicolas Degrenne, et al.. Optimum Design of a Single-Phase Power Pulsating Buffer (PPB) with PCB-integrated Inductor Technologies. 2018 IEEE ICIT, Feb 2018, Lyon, France. ⟨10.1109/ICIT.2018.8352277⟩. ⟨hal-01736332⟩
  • Cyril Buttay, Hugo Reynes. Packaging of 10 kV SiC MOSFETs: Trade-Off Between Electrical and Thermal Performances. International Forum on Wide Bandgap Semiconductors China (IFWS), Oct 2018, Shenzhen, China. ⟨hal-01895875⟩
  • Thomas Lagier, Cyril Buttay, Piotr Dworakowski, Benhur Zolett. Design of a 1200 V, 100 kW Power Converter: How Good are the Design and Modelling Tools?. ECPE Workshop "The Future of Simulation in Power Electronics Packaging for Thermal and Stress Management", Nov 2018, Nuremberg, Germany. ⟨hal-01939745⟩
  • Majededdine Moustaid, Cyril Buttay, Vincent Platel. Design considerations for the 2-phase cooling system of a 5 MW MVDC converter. Troisième ATW Européen Micropackaging et management thermique, Jan 2018, La Rochelle, France. ⟨hal-01895892⟩
  • Maxime Semard, Christian Martin, Cyril Buttay, Charles Joubert. Procédé de microfabrication de transformateurs intégrés. Symposium de Génie Electrique (SGE'18), Jul 2018, Nancy, France. ⟨hal-01844983⟩
  • Cyril Buttay, Raphaël Riva, Bruno Allard, Marie-Laure Locatelli, Vincent Bley. Packaging with double-side cooling capability for SiC devices, based on silver sintering. 44th IEEE IECON, IEEE, Oct 2018, Washington DC, United States. ⟨10.1109/IECON.2018.8591117⟩. ⟨hal-01895805⟩
  • Aymen Kabaar, Cyril Buttay, Olivier Dezellus, Rafael Estevez, Anthony Gravouil, et al.. Characterization of Materials and their Interfaces in a DBC Substrate for Power Electronics Applications. ECPE Workshop "Future of Simulation in Power Electronics Packaging for Thermal and Stress Management", Nov 2018, Nuremberg, Germany. ⟨hal-01935060⟩
  • Rémy Caillaud, Johan Le Lesle, Cyril Buttay, Florent Morel, Roberto Mrad, et al.. Design of a 3kW power converter using PCB-embedding technology. From Nano to Micro Power Electronics And Packaging Workshop (IMAPS), Nov 2018, Tours, France. ⟨hal-01935157⟩
  • Vincent Bley, Cyril Buttay, Mickael Petit. Etat de l’art de l’intégration en électronique de puissance et axes de recherches associés. ISP3D, Mar 2017, Toulouse, France. ⟨hal-01802078⟩
  • Oriol Aviño Salvado, Hervé Morel, Cyril Buttay. Étude de la robustesse de l’oxyde de grille pour des applications aéronautiques. JCGE, May 2017, Arras, France. pp.146345. ⟨hal-01534712⟩
  • Johan Le Lesle, Rémy Caillaud, Florent Morel, Nicolas Degrenne, Cyril Buttay, et al.. Multi-objective optimisation of a bidirectional single-phase grid connected AC/DC converter (PFC) with two different modulation principles. ECCE, Oct 2017, Cincinnati, OH, United States. ⟨10.1109/ECCE.2017.8096889⟩. ⟨hal-01644174⟩
  • Hugo Reynes, Cyril Buttay, Hervé Morel. Protruding Ceramic Substrates for High Voltage Packaging Of Wide Bandgap Semiconductors. WiPDA, Oct 2017, Albuquerque, United States. ⟨10.1109/WiPDA.2017.8170581⟩. ⟨hal-01645029⟩
  • Hugo Reynes, Jose Maneiro, Cyril Buttay, Piotr Dworakowski. Thermal Management Optimization of a 5 MW Power Electronic Converter. 12th european advanced technology workshop on micropackaging and thermal management (iMaps), IMAPS, Feb 2017, La Rochelle, France. ⟨hal-01473614⟩
  • Ilyas Dchar, Marion Zolkos, Cyril Buttay, Hervé Morel. Robustness of SiC MOSFET under avalanche conditions. APEC, Mar 2017, Tampa, FL, United States. pp.2263-2268, ⟨10.1109/APEC.2017.7931015⟩. ⟨hal-01535735⟩
  • Rémy Caillaud, Cyril Buttay, Roberto Mrad, Johan Le Lesle, Florent Morel, et al.. Comparison of planar and Toroidal PCB integrated inductors for a multi-cellular 3.3 kW PFC. 2017 IEEE IWIPP, Apr 2017, Delft, Netherlands. ⟨10.1109/IWIPP.2017.7936757⟩. ⟨hal-01535721⟩
  • Rémy Caillaud, Cyril Buttay, Johan Le Lesle, Florent Morel, Roberto Mrad, et al.. High power PCB-embedded inductors based on ferrite powder. 5th Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum (MiNaPAD 2017, IMAPS, May 2017, Grenoble, France. ⟨hal-01535727⟩
  • Oriol Aviño Salvado, Wissam Sabbah, Cyril Buttay, Hervé Morel, Pascal Bevilacqua. Evaluation of printed-circuit boards materials for high temperature operation. HiTEN, IMAPS, Jul 2017, Cambridge, United Kingdom. ⟨hal-01565131⟩
  • Jose Maneiro, Roland Ryndzionek, Thomas Lagier, Piotr Dworakowski, Cyril Buttay. Design of a SiC based triple active bridge ceil for a multi-megawatt DC-DC converter. EPE'17 ECCE Europe, Sep 2017, Warsaw, Poland. ⟨10.23919/EPE17ECCEEurope.2017.8099005⟩. ⟨hal-01646807⟩
  • Chenjiang Yu, Cyril Buttay, Eric Labouré, Vincent Bley, Céline Combettes, et al.. Comparison of topside contact layouts for power dies embedded in PCB. ESTC, IMAPS, Sep 2016, Grenoble, France. ⟨10.1109/ESTC.2016.7764707⟩. ⟨hal-01373042⟩
  • Chenjiang Yu, Cyril Buttay, Eric Labouré. Improving the thermal management of power GaN devices. Advanced Technology Workshop (ATW) on Thermal Management, IMAPS, Sep 2016, Los Gatos, CA, United States. ⟨hal-01373027⟩
  • Cyril Buttay, Chenjiang Yu, Eric Labouré, Vincent Bley, Céline Combettes. EDT for Power Devices. Embedded Device Technology: “Disappearing Die – Embed your Chips”, IMAPS - NMI, Sep 2016, Caldicot, United Kingdom. ⟨hal-01373062⟩
  • Anne-Sophie Podlejski, Arnaud Bréard, Christian Vollaire, Cyril Buttay. Utilisation d’un modèle CEM pour l’estimation des pertes dans un module de puissance. CEM, Jul 2016, Rennes, France. ⟨hal-02161822⟩
  • Nicolas Quentin, Rémi Perrin, Christian Martin, Charles Joubert, Bertrand Lacombe, et al.. GaN Active-Clamp Flyback Converter with Resonant Operation Over a Wide Input Voltage Range. PCIM Europe 2016, May 2016, Nuremberg, Germany. pp.CD. ⟨hal-01387590⟩
  • Oriol Aviño Salvado, Cheng Chen, Cyril Buttay, Hervé Morel, Denis Labrousse, et al.. Analyse de la robustesse des MOSFET SiC pour les applications diode-less. Symposium de Génie Electrique (SGE'16), Jun 2016, Grenoble, France. ⟨hal-01361711⟩
  • Remi Perrin, Bruno Allard, Cyril Buttay, Nicolas Quentin, Wenli Zhang, et al.. 2 MHz high-density integrated power supply for gate driver in high-temperature applications. APEC, Mar 2016, Long Beach, CA, United States. ⟨10.1109/APEC.2016.7467922⟩. ⟨hal-01372141⟩
  • Rémi Perrin, Bruno Allard, Christian Martin, Cyril Buttay. Integrated High-Temperature Isolation barrier with Coreless Transformer. 9th CIPS, Mar 2016, Nuremberg, Germany. ⟨hal-01372145⟩
  • Bingyao Sun, Rolando Burgos, Dushan Boroyevich, Remi Perrin, Cyril Buttay, et al.. Two Comparison-Alternative High Temperature PCB-Embedded Transformer Designs for a 2 W Gate Driver Power Supply. ECCE, IEEE, Sep 2016, Milwaukee, WI, United States. ⟨10.1109/ECCE.2016.7855537⟩. ⟨hal-01373036⟩
  • Anne-Sophie Podlejski, Arnaud Bréard, Cyril Buttay, Eliana Rondon, Florent Morel, et al.. Layout modelling to predict compliance with EMC standards of power electronic converters. EMC, Aug 2015, Dresden, Germany. pp.779-784, ⟨10.1109/ISEMC.2015.7256262⟩. ⟨hal-01188561⟩
  • Cheng Chen, Denis Labrousse, Stéphane Lefebvre, Mickaël Petit, Cyril Buttay, et al.. Robustness of SiC MOSFETs in short-circuit mode. PCIM Europe 2015, May 2015, Nuremberg, Germany. ⟨hal-01196528⟩
  • Chenjiang Yu, Cyril Buttay, Eric Labouré, Vincent Bley, Céline Combettes. Highly integrated power electronic converters using active devices embedded in printed-circuit board. 4th Micro/Nano-Electronics, packaging and assembling, design and manufacturing forum MiNaPAD 2015, IMAPS, Apr 2015, Grenoble, France. ⟨hal-01197043⟩
  • Cheng Chen, Denis Labrousse, Stéphane Lefebvre, Mickael Petit, Cyril Buttay, et al.. Study of short-circuit robustness of SiC MOSFETs, analysis of the failure modes and comparison with BJTs. ESREF, Oct 2015, Toulouse, France. pp.1708-1713. ⟨hal-01700463⟩
  • Cyril Buttay, Bruno Allard, Raphaël Riva. Silver sintering for power electronics integration. ICEP- IAAC, IMAPS, Apr 2015, Kyoto, Japan. ⟨10.1109/ICEP-IAAC.2015.7111076⟩. ⟨hal-01196525⟩
  • Bruno Allard, Cyril Buttay, Christian Martin, Hervé Morel. Considerations for High Temperature Power Electronics. 18th International Symposium on Power Electronics Ee2015, Oct 2015, Novi Sad, Serbia. ⟨hal-01372146⟩
  • Cyril Buttay, Marwan Ali, Oriol Aviño Salvado, Hervé Morel, Bruno Allard. High temperature operation of SiC transistors. Advanced Technology Workshop (ATW) on Thermal Management, IMAPS, Sep 2015, Los Gatos, CA, United States. ⟨hal-01373030⟩
  • Chenjiang Yu, Éric Labouré, Cyril Buttay. Thermal management of lateral GaN power devices. 2015 IEEE IWIPP, May 2015, Chicago, IL, United States. ⟨10.1109/IWIPP.2015.7295973⟩. ⟨hal-01196527⟩
  • Raphaël Riva, Cyril Buttay, Marie-Laure Locatelli, V. Bley, Bruno Allard. Design and Manufacturing of a Double-Side Cooled, SiC based, High Temperature Inverter Leg. HiTEC 2014, May 2014, Albuquerque, United States. pp.THA27. ⟨hal-00997365⟩
  • Elias Haddad, Christian Martin, Charles Joubert, Bruno Allard, Cyril Buttay, et al.. Planar, Double-Layer Magnetic Inductors for Low Power, High Frequency DC-DC Converters. 8th CIPS, Feb 2014, Nuremberg, Germany. CD (5 p.). ⟨hal-00739037⟩
  • Cyril Buttay, Khalil El Falahi, Rémi Robutel, Stanislas Hascoët, Christian Martin, et al.. Integrated packaging allows for improvement in switching characteristics of silicon carbide devices. PCIM Europe 2014, May 2014, Nuremberg, Germany. 8 p. ⟨hal-00997355⟩
  • Cheng Chen, Denis Labrousse, Stéphane Lefebvre, Cyril Buttay, Hervé Morel. Estimation des pertes dans les transistors bipolaires SiC. Symposium de Génie Electrique (SGE'14), Jul 2014, Cachan, France. ⟨hal-01065220⟩
  • Anne-Sophie Podlejski, Cyril Buttay, Dominique Bergogne, Julien Morand, Christian Vollaire, et al.. Mesure précise des pertes dans un module d'électronique de puissance par une méthode calorimétrique. Symposium de Génie Electrique (SGE'14), Jul 2014, Cachan, France. ⟨hal-01065267⟩
  • Jean-Louis Marchesini, Pierre-Olivier Jeannin, Yvan Avenas, Leonardo Ruffeil de Oliveira, Cyril Buttay, et al.. Realization and Characterization of an IGBT Module Based on the Power Chip-on-Chip 3D Concept. ECCE, Sep 2014, Pittsburgh, PA, United States. ⟨10.1109/ECCE.2014.6954043⟩. ⟨hal-01067144⟩
  • Raphaël Riva, Cyril Buttay, Rémi Perrin, Marie-Laure Locatelli, Vincent Bley, et al.. 3D Packaging Structure for High Temperature Power electronics. From Nano to Micro Power Electronics and Packaging Workshop, IMAPS France, Oct 2014, Tours, France. ⟨hal-01081697⟩
  • Chen Cheng, Denis Labrousse, Stéphane Lefebvre, Hervé Morel, Cyril Buttay, et al.. Power Loss Estimation in SiC Power BJTs. PCIM Europe 2014, May 2014, Nuremberg, Germany. 8 p. ⟨hal-00997718⟩
  • Khalil El Falahi, Stanislas Hascoët, Cyril Buttay, Pascal Bevilacqua, Luong Viet Phung, et al.. High temperature, Smart Power Module for aircraft actuators. HiTEN'13, Jul 2013, Oxford, United Kingdom. ⟨hal-00874666⟩
  • Cyril Buttay. High Temperature Operation of SiC Converters. ECPE SiC and GaN user forum, May 2013, Munich, Germany. ⟨hal-00874751⟩
  • Rémy Ouaida, Cyril Buttay, Raphaël Riva, Dominique Bergogne, Christophe Raynaud, et al.. Thermal stability of SiC JFETs in conduction mode. EPE, Sep 2013, Lille, France. paper 223, ⟨10.1109/EPE.2013.6631881⟩. ⟨hal-00874471⟩
  • Bassem Mouawad, D. Fabregue, Cyril Buttay, Maher Soueidan. Full densification of molybdenum powders and multilayer materials obtained by Spark Plasma Sintering. ISIEM 2013, Society of Inorganic Materials, Japan (SIMJ) et Université Rennes 1, France (UR1)., Oct 2013, Rennes, France. ⟨hal-01081684⟩
  • Elias Haddad, Christian Martin, Cyril Buttay, Charles Joubert, Bruno Allard, et al.. High Temperature, High Frequency Micro-Inductors for Low Power DC-DC Converters. EPE, Sep 2013, Lille, France. paper 390, ⟨10.1109/EPE.2013.6631994⟩. ⟨hal-00874475⟩
  • Xavier Fonteneau, Florent Morel, Cyril Buttay, Hervé Morel, Philippe Lahaye. Predicting Static Losses in an Inverter-Leg built with SiC Normally-Off JFETs and SiC diodes. APEC, Mar 2013, Long Beach, CA, United States. pp.2636-2642, ⟨10.1109/APEC.2013.6520668⟩. ⟨hal-00829353⟩
  • Fabien Dubois, Dominique Bergogne, Dominique Tournier, Cyril Buttay, Régis Meuret, et al.. Analysis of the SiC VJFET gate punch-through and its dependence with the temperature. EPE, Sep 2013, Lille, France. Paper 344, ⟨10.1109/EPE.2013.6631963⟩. ⟨hal-00874655⟩
  • Rémy Ouaida, Cyril Buttay, Anh Dung Hoang, Raphaël Riva, Dominique Bergogne, et al.. Thermal Runaway Robustness of SiC VJFETs. CSCRM, Sep 2012, Saint-Pétersbourg, Russia. 2p. ⟨hal-00759975v2⟩
  • Stanislas Hascoët, Cyril Buttay, Dominique Planson, Rodica Chiriac, Amandine Masson. Pressureless Silver Sintering Die-Attach for SiC Power Devices. CSCRM, Sep 2012, Saint-Pétersbourg, Russia. 2p. ⟨hal-00759987v2⟩
  • Wissam Sabbah, Raphaël Riva, Stanislas Hascoët, Cyril Buttay, Stephane Azzopardi, et al.. Evaluation of silver-sintering die attach. 7th CIPS, Mar 2012, Nuremberg, Germany. pp.237-243. ⟨hal-00707733⟩
  • Bassem Mouawad, Cyril Buttay, Maher Soueidan, Hervé Morel, Bruno Allard, et al.. 3-Dimensional, Solder-Free Interconnect Technology for high-Performance Power Modules. 7th CIPS, Mar 2012, Nuremberg, Germany. pp.433-438. ⟨hal-00707741⟩
  • Dominique Bergogne, Fabien Dubois, Christian Martin, Khalil El Falahi, Luong Viet Phung, et al.. An Airborne High Temperature SiC Power Converter for Medium Power Smart Electro Mechanical Actuators. HiTEC 2012, May 2012, Albuquerque, United States. 6p. ⟨hal-00760366⟩
  • Khalil El Falahi, Fabien Dubois, Dominique Bergogne, Luong Viet Phung, Cyril Buttay, et al.. High temperature anti short circuit function for normally-on SiC JFET in an inverter leg configuration. HiTEC 2012, May 2012, Albuquerque, United States. 6p. ⟨hal-00760372⟩
  • Bassem Mouawad, Cyril Buttay, Maher Soueidan, Hervé Morel, Vincent Bley, et al.. Sintered molybdenum for a metallized ceramic substrate packaging for the wide-bandgap devices and high temperature applications. ISPSD, Jun 2012, Bruges, Belgium. pp.295-298, ⟨10.1109/ISPSD.2012.6229081⟩. ⟨hal-00707820⟩
  • Amandine Masson, Wissam Sabbah, Raphaël Riva, Cyril Buttay, Stephane Azzopardi, et al.. Report de puce par frittage d'argent - mise en oeuvre et analyse. 14ème EPF, Jul 2012, Bordeaux, France. pp.CD (ref 61). ⟨hal-00729156⟩
  • Christian Martin, Rémi Robutel, Cyril Buttay, Fabien Sixdenier, Pascal Bevilacqua, et al.. High Temperature Ageing of Fe-based Nanocrystalline Ribbons. HiTEC 2012, May 2012, Albuquerque, United States. 6p. ⟨hal-00760373⟩
  • Bruno Allard, Cyril Buttay, Dominique Tournier, Rémi Robutel, Jean-François Mogniotte, et al.. Higher temperature power electronics for larger-scale mechatronic integration. Automotive Power Electronics, Apr 2011, Paris, France. Actes sur CD (pas de pagination). ⟨hal-00687139⟩
  • Cyril Buttay, Christophe Raynaud, Hervé Morel, Gabriel Civrac, Marie-Laure Locatelli, et al.. Thermal Requirements of SiC Power Devices. 6th European Advanced Technology Workshop on Micropackaging and Thermal Management, Feb 2011, La Rochelle, France. ⟨hal-00672631⟩
  • Bassem Mouawad, Maher Soueidan, D. Fabregue, Cyril Buttay, Vincent Bley, et al.. Mechanical Study of Copper Bonded at Low Temperature Using Spark Plasma Sintering Process. CIMA, Mar 2011, Beyrouth, Lebanon. pp.CD. ⟨hal-00687147v2⟩
  • D. Fabregue, Bassem Mouawad, Cyril Buttay, Maher Soueidan, Aude Lamontagne, et al.. Elaboration of Architectured Materials by Spark Plasma Sintering. THERMEC, Aug 2011, Québec, Canada. pp.1885-1892, ⟨10.4028/www.scientific.net/MSF.706-709.1885⟩. ⟨hal-00687142⟩
  • Amandine Masson, Cyril Buttay, Hervé Morel, Christophe Raynaud, Stanislas Hascoët, et al.. High-temperature die-attaches for SiC power devices. EPE, Aug 2011, Birmingham, United Kingdom. pp.Article number 6020161. ⟨hal-00672602⟩
  • Elias Haddad, Christian Martin, Charles Joubert, Bruno Allard, Maher Soueidan, et al.. Modeling, Fabrication, and Characterization of Planar Inductors on YIG Substrates. CIMA, Mar 2011, Beyrouth, Lebanon. pp.Tu-P9. ⟨hal-00787193⟩
  • Cyril Buttay, Amandine Masson, Jianfeng Li, Mark Johnson, Mihai Lazar, et al.. Die Attach of Power Devices Using Silver Sintering - Bonding Process Optimization and Characterization. HiTEN 2011, Jul 2011, Oxford, United Kingdom. pp.1-7. ⟨hal-00672619⟩
  • Fabien Dubois, Damien Risaletto, Dominique Bergogne, Hervé Morel, Cyril Buttay, et al.. Active protections for normally-on SiC JFETs. EPE, Aug 2011, Birmingham, United Kingdom. pp.CD. ⟨hal-00629227⟩
  • Hervé Morel, Youness Hamieh, Dominique Tournier, Rémi Robutel, Fabien Dubois, et al.. A multi-physics model of the VJFET with a lateral channel. EPE, Aug 2011, Birmingham, United Kingdom. pp.CD. ⟨hal-00629220⟩
  • Cyril Buttay, Christophe Raynaud, Hervé Morel, Mihai Lazar, Gabriel Civrac, et al.. High-temperature behavior of SiC power diodes. EPE, Aug 2011, Birmingham, United Kingdom. pp.CD. ⟨hal-00629225⟩
  • Rémi Robutel, Christian Martin, Hervé Morel, Cyril Buttay, Dominique Bergogne, et al.. Design of High Temperature EMI Input Filter for a 2 kW HVDC-Fed Inverter. HiTEC 2010, May 2010, Albuquerque, United States. pp.000236. ⟨hal-00485284⟩
  • Rémi Robutel, Christian Martin, Cyril Buttay, Hervé Morel, Régis Meuret. Caractérisation des non-linéarités dans les condensateurs céramiques haute température. 13ème EPF, Jun 2010, Saint-Nazaire, France. ⟨hal-00618657⟩
  • Cyril Buttay, Rémi Robutel, Christian Martin, Christophe Raynaud, Siméon Dampieni, et al.. Effect of High Temperature Ageing on Active and Passive Power Devices. HiTEC 2010, May 2010, Albuquerque, United States. pp.000228. ⟨hal-00485273⟩
  • Dominique Bergogne, Asif Hammoud, Dominique Tournier, Cyril Buttay, Youness Amieh, et al.. Electro-thermal behaviour of a SiC JFET stressed by lightning-induced overvoltages. EPE, Sep 2009, Barcelone, France. pp.1--8. ⟨hal-00446059⟩
  • Cyril Buttay, Dominique Planson, Bruno Allard, Dominique Bergogne, Pascal Bevilacqua, et al.. State of the art of High Temperature Power Electronics. Microtherm, Jun 2009, Lodz, Poland. pp.8-17. ⟨hal-00413349⟩
  • Cyril Buttay, Olivier Brevet, Bruno Allard, Dominique Bergogne, Hervé Morel. Paralleling of Low-Voltage MOSFETs Operating in Avalanche Conditions. EPE, Sep 2005, Dresden, Germany. ⟨10.1109/EPE.2005.219271⟩. ⟨hal-00138894⟩
  • Hervé Morel, Bruno Allard, Sabrine M'Rad, Cyril Buttay, Kaiçar Ammous, et al.. Bond Graph Modeling of Current Diffusion in Magnetic Cores. ICBGM, Jan 2005, New Orleans, LA, United States. pp 87-91. ⟨hal-00412621⟩
  • Cyril Buttay, Dominique Bergogne, Hervé Morel, Bruno Allard, René Ehlinger, et al.. A Voltage-Measurement Based Estimator for Current and Temperature in MOSFET H-Bridge. EPE, Sep 2003, Toulouse, France. pp.1-10. ⟨hal-00413309⟩
  • Cyril Buttay, Dominique Bergogne, Hervé Morel, Bruno Allard, René Ehlinger, et al.. Towards a Sensorless Current and Temperature Monitoring in MOSFET-Based H-Bridge. IEEE PESC, Jun 2003, Accapulco, Mexico. pp.901 - 906, ⟨10.1109/PESC.2003.1218175⟩. ⟨hal-00413325⟩

Theses1 document

  • Cyril Buttay. Contribution à la conception par la simulation en électronique de puissance : application à l'onduleur basse tension. Sciences de l'ingénieur [physics]. INSA de Lyon, 2004. Français. ⟨tel-00327164⟩

Habilitation à diriger des recherches1 document

  • Cyril Buttay. Le Packaging en électronique de puissance. Sciences de l'ingénieur [physics]. INSA de lyon, 2015. ⟨tel-01267363⟩

Lectures5 documents

  • Cyril Buttay. Technologie des composants actifs et leur assemblage - Packaging - École Thématique CNRS 2019 Fiabilité et Sûreté de Fonctionnement. Doctorat. France. 2019. ⟨cel-02291508⟩
  • Cyril Buttay. Électronique haute température -- Contraintes sur la puce et le packaging. Doctorat. France. 2018. ⟨cel-02291510⟩
  • Cyril Buttay. Composants Actifs pour l'Électronique de puissance Master M1. Master. France. 2017. ⟨cel-01539770⟩
  • Cyril Buttay. Introduction au packaging en électronique de puissance : Cours de 2 h à destination d'élèves niveau master 1/2 (actuellement donné en 5 ème année de génie électrique à l'INSA de Lyon). École d'ingénieur. France. 2017. ⟨cel-01539750⟩
  • Cyril Buttay. Électronique de puissance embarquée et packaging Master M2. Master. France. 2016. ⟨cel-01539759⟩