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Cyril Buttay

188
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Publications

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Physics-based Strategies for Fast TDDB Testing and Lifetime Estimation in SiC Power MOSFETs

O. Aviñó-Salvadó , Cyril Buttay , F. Bonet , C. Raynaud , P. Bevilacqua
IEEE Transactions on Industrial Electronics, inPress, ⟨10.1109/TIE.2023.3281705⟩
Article dans une revue hal-04147050v1
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Surge Current Interruption Capability of Discrete IGBT Devices in DC Hybrid Circuit Breakers

Lakshmi Ravi , Jian Liu , Jingcun Liu , Yuhao Zhang , Cyril Buttay
IEEE Journal of Emerging and Selected Topics in Power Electronics, inPress, ⟨10.1109/JESTPE.2023.3264933⟩
Article dans une revue hal-04065646v1
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Phase-Shifted Full Bridge DC–DC Converter for Photovoltaic MVDC Power Collection Networks

Pierre Le Metayer , Quentin Loeuillet , Francois Wallart , Cyril Buttay , Drazen Dujic
IEEE Access, 2023, 11, pp.19039-19048. ⟨10.1109/ACCESS.2023.3247952⟩
Article dans une revue hal-04029587v1
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Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective

Yuan Qin , Benjamin Albano , Joseph Spencer , James Spencer Lundh , Boyan Wang
Journal of Physics D: Applied Physics, 2023, 56 (9), pp.093001. ⟨10.1088/1361-6463/acb4ff⟩
Article dans une revue hal-04029608v1
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12 kV 1 kA Breaking Capable Modular Power Electronic Interrupter with Staged Turn-off Strategy for Medium Voltage DC Hybrid Circuit Breaker

Jian Liu , Lakshmi Ravi , Cyril Buttay , Rolando Burgos , Steve Schmalz
IEEE Transactions on Industry Applications, 2022, 58 (5), pp.6343 - 6356. ⟨10.1109/TIA.2022.3185570⟩
Article dans une revue hal-03782551v1
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Improved Measurement Accuracy for Junction-to-Case Thermal Resistance of GaN HEMT Packages by Gate-to-Gate Electrical Resistance and Stacking Thermal Interface Materials

Shengchang Lu , Zichen Zhang , Cyril Buttay , Khai Ngo , Guo-Quan Lu
IEEE Transactions on Power Electronics, inPress, ⟨10.1109/TPEL.2022.3142273⟩
Article dans une revue hal-03543281v1
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Optical Detection of Partial Discharges Under Fast Rising Square Voltages in Dielectric Liquids

Somya Anand , Eric Vagnon , Martin Guillet , Cyril Buttay
IEEE Access, 2022, 10, pp.89758-89768. ⟨10.1109/ACCESS.2022.3200748⟩
Article dans une revue hal-03768924v1
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Modeling and test of a thermosyphon loop for the cooling of a megawatt-range power electronics converter

Majededdine Moustaid , Vincent Platel , Martin Guillet , Hugo Reynes , Cyril Buttay
International Journal of Thermofluids, 2022, 13, pp.100129. ⟨10.1016/j.ijft.2021.100129⟩
Article dans une revue hal-03526803v1
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Packaged Ga2O3 Schottky Rectifiers with Over 60 A Surge Current Capability

Ming Xiao , Boyan Wang , Jingcun Liu , Ruizhe Zhang , Zichen Zhang
IEEE Transactions on Power Electronics, inPress, ⟨10.1109/TPEL.2021.3049966⟩
Article dans une revue hal-03186511v1
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(Invited) How to Achieve Low Thermal Resistance and High Electrothermal Ruggedness in Ga 2 O 3 Devices?

Yuhao Zhang , Boyan Wang , Ming Xiao , Joseph Spencer , Ruizhe Zhang
ECS Transactions, 2021, 104 (5), pp.21-32. ⟨10.1149/10405.0021ecst⟩
Article dans une revue hal-03366208v1
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Low Thermal Resistance (0.5 K/W) Ga₂O₃ Schottky Rectifiers With Double-Side Packaging

Boyan Wang , Ming Xiao , Jack Knoll , Cyril Buttay , Kohei Sasaki
IEEE Electron Device Letters, 2021, 42 (8), pp.1132-1135. ⟨10.1109/LED.2021.3089035⟩
Article dans une revue hal-03366175v1
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New Definition of Critical Energy for SiC MOSFET Robustness under Short- Circuit Operations: the Repetitive Critical Energy

C. Chen , Tien-Anh A Nguyen , D Labrousse , S Lefebvre , Cyril Buttay
Microelectronics Reliability, 2020, 114, pp.113839. ⟨10.1016/j.microrel.2020.113839⟩
Article dans une revue hal-02968998v1
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Surge Current Capability of Ultra-Wide-Bandgap Ga2O3 Schottky Diodes

Cyril Buttay , Hiu-Yung Wong , Boyan Wang , Ming Xiao , Christina Dimarino
Microelectronics Reliability, In press, ⟨10.1016/j.microrel.2020.113743⟩
Article dans une revue hal-02968947v1
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Thermal Considerations of a Power Converter with Components Embedded in Printed Circuit Boards

Rémy Caillaud , Cyril Buttay , Roberto Mrad , Johan Le Lesle , Florent Morel
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019, 10 (2), ⟨10.1109/TCPMT.2019.2939969⟩
Article dans une revue hal-02291493v1
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Analysis and modelling of the role of temperature in the static forward characteristics of an IGBT

Layachi Boussouar , Hervé Morel , Bruno Allard , Cyril Buttay
International Journal of Power Electronics, 2019, 10 (3), pp.187. ⟨10.1504/ijpelec.2019.099337⟩
Article dans une revue hal-02121811v1
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Extraction of the 4H-SiC/SiO₂ Barrier Height Over Temperature

Oriol Aviño Salvado , Besar Asllani , Cyril Buttay , Christophe Raynaud , Hervé Morel
IEEE Transactions on Electron Devices, 2019, 67 (1), pp.63 - 68. ⟨10.1109/TED.2019.2955181⟩
Article dans une revue hal-02418097v1
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SiC MOSFETs robustness for diode-less applications

Oriol Aviño Salvado , C. Cheng , Cyril Buttay , Hervé Morel , D Labrousse
EPE Journal - European Power Electronics and Drives, 2018, pp.1 - 8. ⟨10.1080/09398368.2018.1456836⟩
Article dans une revue hal-01844980v1
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Threshold voltage instability in SiC MOSFETs as a consequence of current conduction in their body diode

Oriol Aviño Salvado , Hervé Morel , Cyril Buttay , Denis Labrousse , Stéphane Lefebvre
Microelectronics Reliability, 2018, 88-90, pp.636-640. ⟨10.1016/j.microrel.2018.06.033⟩
Article dans une revue hal-01895791v1
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Lifetime of power electronics interconnections in accelerated test conditions: High temperature storage and thermal cycling

Wissam Sabbah , Faical Arabi , Oriol Aviño Salvado , Cyril Buttay , Loic Théolier
Microelectronics Reliability, 2017, ⟨10.1016/j.microrel.2017.06.091⟩
Article dans une revue hal-01562549v1
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SiC power devices packaging with a short-circuit failure mode capability

Ilyas Dchar , Cyril Buttay , Hervé Morel
Microelectronics Reliability, 2017, ⟨10.1016/j.microrel.2017.07.003⟩
Article dans une revue hal-01562547v1
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Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications

Aymen Ben Kabaar , Cyril Buttay , Olivier Dezellus , R Estevez , Anthony Gravouil
Microelectronics Reliability, 2017, ⟨10.1016/j.microrel.2017.06.001⟩
Article dans une revue hal-01541230v1
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High temperature ageing of microelectronics assemblies with SAC solder joints

Wissam Sabbah , Pierre Bondue , Oriol Aviño Salvado , Cyril Buttay , Héìène Frémont
Microelectronics Reliability, 2017, ⟨10.1016/j.microrel.2017.06.065⟩
Article dans une revue hal-01564755v1
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Evaluation of printed-circuit boards materials for high temperature operation

Oriol Aviño Salvado , Wissam Sabbah , Cyril Buttay , Hervé Morel , Pascal Bevilacqua
Journal of Microelectronics and Electronic Packaging, 2017, 14 (4), ⟨10.4071/imaps.516313⟩
Article dans une revue hal-01674483v1
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Sintered-Silver Bonding of High-Temperature Piezoelectric Ceramic Sensors

Justine Billore , Stanislas Hascoët , Rémi Robutel , Cyril Buttay , Jianfeng Li
IEEE Transactions on Components and Packaging Technologies, 2016, pp.1-7. ⟨10.1109/TCPMT.2016.2628874⟩
Article dans une revue hal-01419042v1
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Avalanche robustness of SiC Schottky diode

Ilyas Dchar , Cyril Buttay , Hervé Morel
Microelectronics Reliability, 2016, ⟨10.1016/j.microrel.2016.07.086⟩
Article dans une revue hal-01373039v1
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Thermal management and electromagnetic analysis for GaN devices packaging on DBC substrate

Chenjiang Yu , Cyril Buttay , Eric Labouré
IEEE Transactions on Power Electronics, 2016, 32 (2), pp. 906 - 910. ⟨10.1109/TPEL.2016.2585658⟩
Article dans une revue hal-01373065v1
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Implementation and Switching Behavior of a PCB-DBC IGBT Module Based on the Power Chip-on-Chip 3D Concept

Jean-Louis Marchesini , Pierre-Olivier Jeannin , Yvan Avenas , Johan Delaine , Cyril Buttay
IEEE Transactions on Industry Applications, 2016, PP (99), ⟨10.1109/TIA.2016.2604379⟩
Article dans une revue hal-01373011v1
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Study of short-circuit robustness of SiC MOSFETs, analysis of the failure modes and comparison with BJTs

Cheng Chen , Denis Labrousse , Stéphane Lefebvre , Mickael Petit , Cyril Buttay
Microelectronics Reliability, 2015, pp.6. ⟨10.1016/j.microrel.2015.06.097⟩
Article dans une revue hal-01198584v1

Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles

Jianfeng Li , Mark Johnson , Cyril Buttay , Wissam Sabbah , Stephane Azzopardi
Journal of Materials Processing Technology, 2015, pp.299-308. ⟨10.1016/j.jmatprotec.2014.08.002⟩
Article dans une revue hal-01065130v1
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Direct Copper Bonding for Power Interconnects: Design, Manufacturing, and Test

Bassem Mouawad , Benoit Thollin , Cyril Buttay , Laurent Dupont , Vincent Bley
IEEE Transactions on Components, Packaging and Manufacturing Technology. Part A, Manufacturing Technology, 2015, 5 (1), pp.143-150. ⟨10.1109/TCPMT.2014.2376882⟩
Article dans une revue hal-01207014v1

Measurement and numerical analysis of C-V characteristics for normally-on SiCED-JFET

Sami Ghedira , Cyril Buttay , Hervé Morel , Kamel Besbes
European Physical Journal: Applied Physics, 2014, 66 (2), pp.20103. ⟨10.1051/epjap/2014130533⟩
Article dans une revue hal-01005929v1

Fabrication and characterization of a planar interleaved micro-transformer with magnetic core

Faouzi Kahlouche , Khamis Youssouf , Mahamat Hassan Béchir , Stéphane Capraro , A. Siblini
Microelectronics Journal, 2014, 45 (7), pp.893-897. ⟨10.1016/j.mejo.2014.03.003⟩
Article dans une revue hal-01058212v1
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Thermal Stability of Silicon Carbide Power JFETs

Cyril Buttay , Rémy Ouaida , Hervé Morel , Dominique Bergogne , Christophe Raynaud
IEEE Transactions on Electron Devices, 2013, 60 (12), pp.4191 - 4198. ⟨10.1109/TED.2013.2287714⟩
Article dans une revue hal-00881667v1
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Die attach using silver sintering. Practical implementation and analysis

Amandine Masson , Wissam Sabbah , Raphaël Riva , Cyril Buttay , Stephane Azzopardi
European Journal of Electrical Engineering, 2013, 16 (3-4), pp.293-305. ⟨10.3166/ejee.16.293-305⟩
Article dans une revue hal-00874465v1

Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy

Wissam Sabbah , Stephane Azzopardi , Cyril Buttay , Régis Meuret , Eric Woirgard
Microelectronics Reliability, 2013, 53 (9-11), pp.1617-1621. ⟨10.1016/j.microrel.2013.07.101⟩
Article dans une revue hal-00881584v1
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Thermal Runaway Robustness of SiC VJFETs

Rémy Ouaida , Cyril Buttay , Anh Dung Hoang , Raphaël Riva , Dominique Bergogne
Materials Science Forum, 2013, 740-742, pp.929-933. ⟨10.4028/www.scientific.net/MSF.740-742.929⟩
Article dans une revue hal-00799884v1
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Migration issues in sintered-silver die attaches operating at high temperature

Raphaël Riva , Cyril Buttay , Bruno Allard , Pascal Bevilacqua
Microelectronics Reliability, 2013, 53 (9-11), pp.1592-1596. ⟨10.1016/j.microrel.2013.07.103⟩
Article dans une revue hal-00874458v1

Electro-Thermal Behaviour of a SiC JFET Stressed by Lightning Induced Over-Voltages

Dominique Bergogne , Cyril Buttay , Rémi Robutel , Fabien Dubois , Rémy Ouaida
EPE Journal - European Power Electronics and Drives, 2013, 23 (3), pp.5--12
Article dans une revue hal-00997389v1
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Design and Implementation of Integrated Common Mode Capacitors for SiC JFET Inverters

Rémi Robutel , Christian Martin , Cyril Buttay , Hervé Morel , Paulo Mattavelli
IEEE Transactions on Power Electronics, 2013, PP (99), pp.1. ⟨10.1109/TPEL.2013.2279772⟩
Article dans une revue hal-00874455v1
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Thermal stability of silicon-carbide power diodes

Cyril Buttay , Christophe Raynaud , Hervé Morel , Gabriel Civrac , Marie-Laure Locatelli
IEEE Transactions on Electron Devices, 2012, 59 (3), pp.761-769. ⟨10.1109/TED.2011.2181390⟩
Article dans une revue hal-00672440v1

Normally-On SIC JFETs: Active Protections

Fabien Dubois , Dominique Bergogne , Cyril Buttay , Hervé Morel , Régis Meuret
EPE Journal - European Power Electronics and Drives, 2012, 22 (3), pp.6-13
Article dans une revue hal-00821756v1
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Application of the Spark Plasma Sintering Technique to Low-Temperature Copper Bonding

Bassem Mouawad , Maher Soueidan , D. Fabregue , Cyril Buttay , Bruno Allard
IEEE Transactions on Components and Packaging Technologies, 2012, 2 (4), pp.553 - 560. ⟨10.1109/TCPMT.2012.2186453⟩
Article dans une revue hal-00672244v1
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Pressureless Silver Sintering Die-Attach for SiC Power Devices

Stanislas Hascoët , Cyril Buttay , Dominique Planson , Rodica Chiriac , Amandine Masson
Materials Science Forum, 2012, 740 - 742, pp.851-854. ⟨10.4028/www.scientific.net/MSF.740-742.851⟩
Article dans une revue hal-00799893v1
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Full densification of Molybdenum powders using Spark Plasma Sintering

Bassem Mouawad , Maher Soueidan , D. Fabregue , Cyril Buttay , Vincent Bley
Metallurgical and Materials Transactions A, 2012, pp.1-8. ⟨10.1007/s11661-012-1144-2⟩
Article dans une revue hal-00707782v1

State of the art of high temperature power electronics

Cyril Buttay , Dominique Planson , Bruno Allard , Dominique Bergogne , Pascal Bevilacqua
Materials Science and Engineering: B, 2011, 176 (4), pp.283-288. ⟨10.1016/j.mseb.2010.10.003⟩
Article dans une revue hal-00597432v1
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Modeling, Fabrication, and Characterization of Planar Inductors on YIG Substrates

Elias Haddad , Christian Martin , Charles Joubert , Bruno Allard , Maher Soueidan
Advanced Materials Research, 2011, 324, pp.294-297. ⟨10.4028/www.scientific.net/AMR.324.294⟩
Article dans une revue hal-00672240v1

Design of a High Temperature EMI Input Filter for a 2 kW HVDC-Fed Inverter

Rémi Robutel , Christian Martin , Hervé Morel , Cyril Buttay , Nicolas Gazel
Journal of Microelectronics and Electronic Packaging, 2011, 8 (1), pp.23-30
Article dans une revue hal-00729066v1
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Mechanical Study of Copper Bonded at Low Temperature Using Spark Plasma Sintering Process

Bassem Mouawad , Maher Soueidan , D. Fabregue , Cyril Buttay , Vincent Bley
Advanced Materials Research, 2011, 324, pp.177-180. ⟨10.4028/www.scientific.net/AMR.324.177⟩
Article dans une revue hal-00799899v1
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A Comparative Study of Predictive Current Control Schemes for a Permanent Magnet Synchronous Machine Drive

Florent Morel , Xuefang Lin-Shi , Jean-Marie Rétif , Bruno Allard , Cyril Buttay
IEEE Transactions on Industrial Electronics, 2009, 56 (7), pp.2715 - 2728. ⟨10.1109/TIE.2009.2018429⟩
Article dans une revue hal-00386480v1
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Experimental Analysis of Punch-Through Conditions in Power P-I-N Diodes

Tarek Ben Salah , Cyril Buttay , Bruno Allard , Hervé Morel , Sami Ghedira
IEEE Transactions on Power Electronics, 2007, 22 (1), pp.13-20. ⟨10.1109/TPEL.2006.886648⟩
Article dans une revue hal-00135198v1
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Model Requirements for Simulation of Low-Voltage MOSFET in Automotive Applications

Cyril Buttay , Hervé Morel , Bruno Allard , Pierre Lefranc , Olivier Brevet
IEEE Transactions on Power Electronics, 2006, 21 (3), pp.613-624. ⟨10.1109/TPEL.2006.872383⟩
Article dans une revue hal-00138878v1
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Avalanche Behavior of Low-Voltage Power MOSFETs

Cyril Buttay , Tarek Ben Salah , Dominique Bergogne , Bruno Allard , Hervé Morel
IEEE Power Electronics Letters, 2004, 2 (3), pp.104-107. ⟨10.1109/LPEL.2004.839638⟩
Article dans une revue hal-00138863v1

Improvement of the thermal performance of printed circuit boards by embedding of graphite heat spreaders

Ahmed Sabry Eltaher Ahmed , Rémi Perrin , Guillaume Lefebvre , Cyril Buttay , Jacques Jay
16th European Advanced Technology Workshop on Micropackaging and Thermal management (THERMAL 2023), IMAPS, Mar 2023, Poitiers, France
Communication dans un congrès hal-04147426v1
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Towards a Common Mode Current Free Packaging Solution for High Voltage Series Connected SiC MOSFET Switches

Cédric Mathieu de Vienne , Besar Asllani , Hugo Reynes , Martin Guillet , Amin Salim Obaid Al-Hinaai
Power Electronics, Intelligent Motion, Renewable Energy and Energy Management ( PCIM ) Europe, May 2023, Nuremberg, Germany
Communication dans un congrès hal-04147021v1
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Design of Oil Insulated SiC Diode Rectifier for an MVDC SST

Pierre Le Métayer , Hugo Reynes , Piotr Dworakowski , Cyril Buttay , Drazen Dujic
International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM Europe 2023 ), May 2023, Nuremberg, Germany. pp.566091039, ⟨10.30420/566091039⟩
Communication dans un congrès hal-04153731v1
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An Advanced Integrated Cooling Solution for High Voltage and Power Density Modules

Amin Salim Obaid Al-Hinaai , Till Huesgen , Cyril Buttay , Eric Vagnon , Ildiko Ettinger
Therminic 2023 - 29th International Workshop Thermal Investigations on ICs and Systems, Sep 2023, Budapest, Hungary. à paraître
Communication dans un congrès hal-04240225v1
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Fault Ride Through of DC Solid State Transformer in Medium Voltage DC Systems

Pierre Le Métayer , Drazen Dujic , Cyril Buttay , Piotr Dworakowski
International Conference & Exhibition on Electricity Distribution (CIRED 2023), Jun 2023, Rome, Italy
Communication dans un congrès hal-04154265v1
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A novel integrated cooling packaging for high power density semiconductors

Amin Salim Obaid Al-Hinaai , Till Huesgen , Cyril Buttay , Richard Zeitler , Daniela Mayer
28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2022), Sep 2022, Dublin, Ireland. ⟨10.1109/THERMINIC57263.2022.9950643⟩
Communication dans un congrès hal-03803773v1
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Design of a test package for high voltage SiC diodes

Arthur Boutry , Bruno Lefebvre , Cyril Buttay , Eric Vagnon , Dominique Planson
Proceedings of the International Workshop on Integrated Power Packaging (IWIPP 2022), Aug 2022, Grenoble, France. ⟨10.1109/IWIPP50752.2022.9894223⟩
Communication dans un congrès hal-03772006v1
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Assessment of Partial Discharge Phenomenon in AC and Fast-rising Square Voltage Using Optical Detection Technique in Needle-Plane Configuration With Pressboard in Mineral Oil

Somya Anand , Eric Vagnon , Martin Guillet , Cyril Buttay
2022 IEEE 21st International Conference on Dielectric Liquids (ICDL), May 2022, Sevilla, Spain. pp.1-4, ⟨10.1109/ICDL49583.2022.9830959⟩
Communication dans un congrès hal-03803771v1

Modelling and Simulation of PCB Embedded Power Electronic Layouts

Cyril Buttay , Bahaeddine Ben Hamed , Ahmed Sabry Eltaher Ahmed , Guillaume Regnat , Rémi Perrin
ECPE Workshop "Embedding and Advanced Integration Technologies in Power Electronics", ECPE - European Center for Power Electronics, Nov 2022, Graz, Austria
Communication dans un congrès hal-04147105v1
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Experimental study of the reduction and removal of turn-on snubber for IGCT based MMC submodule using fast silicon diodes

Arthur Boutry , Cyril Buttay , Besar Asllani , Bruno Lefebvre , Eric Vagnon
Proceedings of the European Power Electronics conference (EPE ECCE 2022), Sep 2022, Hannovre, Germany
Communication dans un congrès hal-03775977v1
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Medium Voltage Diode Rectifier Design for High Step-Up DC-DC Converter

Pierre Le Métayer , Cyril Buttay , Drazen Dujic , Piotr Dworakowski
European Power Electronics conference (EPE ECCE 2022), Sep 2022, Hannovre, Germany
Communication dans un congrès hal-03790420v1

Graphite heat spreader for power component embedded in printed circuit boards (PCB)

Ahmed Sabry Eltaher Ahmed , Rémi Perrin , Guillaume Lefebvre , Cyril Buttay , Jacques Jay
Journée technique IEEE Electronics Packaging Society France, Chapitre français de l'IEEE Electronics Packaging Society, Dec 2022, Palaiseau, France
Communication dans un congrès hal-04159893v1

Intégration hybride en électronique de puissance

Mickaël Petit , Cyril Buttay
Journée Electronique de Puissance, Mar 2022, Grenoble, France
Communication dans un congrès hal-03712244v1
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Unidirectional step-up isolated DC-DC converter for MVDC electrical networks

Piotr Dworakowski , Pierre Le Métayer , Drazen Dujic , Cyril Buttay
CIGRE Session 2022, Aug 2022, Paris, France
Communication dans un congrès hal-03771023v1
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A Guide for Accurate and Repeatable Measurement of the R TH,JC of SiC Packages

Jack Knoll , Christina Dimarino , Cyril Buttay
2022 IEEE Energy Conversion Congress and Exposition (ECCE), Oct 2022, Detroit, France. pp.1-7, ⟨10.1109/ECCE50734.2022.9947814⟩
Communication dans un congrès hal-04030134v1
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A Novel Packaging with Direct Dielectric Liquid Cooling for High Voltage Power Electronics

Amin Salim Obaid Al-Hinaai , Till Huesgen , Cyril Buttay , Eric Vagnon , Richard Zeitler
Proceedings of the International Workshop on Integrated Power Packaging (IWIPP 2022), Aug 2022, Grenoble, France. ⟨10.1109/IWIPP50752.2022.9894055⟩
Communication dans un congrès hal-03772005v1
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Enhancing voltage rating of standard power modules for harsh environment applications

Hugo Reynes , Eric Vagnon , Cyril Buttay , Martin Guillet
Proceedings of the Power Conversion Intelligent Motion conference (PCIM) 2022, May 2022, Nuremberg, Germany. ⟨10.30420/565822083⟩
Communication dans un congrès hal-03760089v1
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Automatic Model Generation for PCB-based Power Electronics

Bahaeddine Ben Hamed , Guillaume Regnat , Guillaume Lefèvre , Cyril Buttay
Conference on Integrated Power Electronics Systems (CIPS), Mar 2022, Berlin, Germany
Communication dans un congrès hal-03641121v1
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Electrical and optical partial discharge assessment of dielectric barriers in mineral oil and synthetic ester

Somya Anand , Eric Vagnon , Ayyoub Zouaghi , Martin Guillet , Cyril Buttay
EIC, Jun 2021, Denver, United States. pp.602-605, ⟨10.1109/EIC49891.2021.9612267⟩
Communication dans un congrès hal-03515576v1
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Break-even distance for MVDC electricity networks according to power loss criteria

Pierre Le Métayer , Juan Paez , Sellé Touré , Cyril Buttay , Drazen Dujic
EPE'21 ECCE Europe, Sep 2021, Ghent, Belgium. https://ieeexplore.ieee.org/document/9570416, ⟨10.23919/EPE21ECCEEurope50061.2021.9570416⟩
Communication dans un congrès hal-03366134v1
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Characterization of 4 kV Charge-Balanced SiC MOSFETs

Jack Knoll , Mina Shawky , Sheng-Hung Yen , Ibrahim Eshera , Christina Dimarino
APEC, Jun 2021, Phoenix, AZ, United States. ⟨10.1109/APEC42165.2021.9487454⟩
Communication dans un congrès hal-03360838v1
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High Power Density Design of Power Electronic Interrupter in Hybrid DC Circuit Breaker

Jian Liu , Lakshmi Ravi , Dong Dong , Rolando Burgos , Cyril Buttay
APEC, Jun 2021, Phoenix, United States. pp.33-38, ⟨10.1109/APEC42165.2021.9487241⟩
Communication dans un congrès hal-03361482v1
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Surge Current Capability of IGBT Based Power Electronic Interrupter Modules for Hybrid DC Circuit Breaker Applications

Lakshmi Ravi , Jian Liu , Dong Dong , Rolando Burgos , Cyril Buttay
IEEE Applied Power Electronics Conference and Exposition (APEC 2021), Jun 2021, Phoenix, AZ, United States. pp.395-400, ⟨10.1109/APEC42165.2021.9487086⟩
Communication dans un congrès hal-03361517v1
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Simple and Precise Calorimetry Method for Evaluation of Losses in Power Electronic Converters

Nicolas Mary , Rémi Perrin , Stefan Mollov , Cyril Buttay
CIPS 2020, Mar 2020, Berlin, Germany
Communication dans un congrès hal-02968788v1
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How Good are the Design Tools in Power Electronics?

Thomas Lagier , Piotr Dworakowski , Laurent Chédot , François Wallart , Bruno Lefebvre
EPE’20 ECCE Europe, Sep 2020, Lyon (Virtual conference), France. ⟨10.23919/EPE20ECCEEurope43536.2020.9215942⟩
Communication dans un congrès hal-02968867v1
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Experimental validation and comparison of a SiC MOSFET based 100 kW 1.2 kV 20 kHz three-phase dual active bridge converter using two vector groups

Thomas Lagier , Piotr Dworakowski , Cyril Buttay , Philippe Ladoux , Andrzej Wilk
EPE’20 ECCE Europe, Sep 2020, Lyon ( virtual ), France. ⟨10.23919/EPE20ECCEEurope43536.2020.9215631⟩
Communication dans un congrès hal-02973471v1
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Figures-of-Merit and current metric for the comparison of IGCTs and IGBTs in Modular Multilevel Converters

Arthur Boutry , Cyril Buttay , Dong Dong , Rolando Burgos , Bruno Lefebvre
EPE’20 ECCE Europe, Sep 2020, Lyon, France. ⟨10.23919/EPE20ECCEEurope43536.2020.9215711⟩
Communication dans un congrès hal-02968851v1
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Surge Current Capability of Ga2O3 Schottky Diodes

Cyril Buttay , Hiu-Yung Wong , Boyan Wang , Ming Xiao , Christina Dimarino
CPES Annual Conference, Aug 2020, Blacksburg, VA, United States
Communication dans un congrès hal-02968817v1

Thermosiphon for passive cooling of a MVDC converter iMaps-ATW on Micropackaging and Thermal Management

Majed Eddine Moustaid , Vincent Platel , Cyril Buttay , Bruno Lefebvre
15th European Advanced Technology Workshop on Micropackaging and Thermal Management, Feb 2020, La Rochelle, France
Communication dans un congrès hal-02968778v1
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Benefits of GaN transistors and embedding in PCB laminates

Cyril Buttay , Christian Martin , Charles Joubert , Hervé Morel , Bruno Allard
SIA Power Train & Electronics, Jun 2019, Paris, France
Communication dans un congrès hal-02291496v1

Application of the PCB-Embedding Technology to a 3.3 kW Power Factor Corrector

Rémy Caillaud , Johan Le Lesle , Cyril Buttay , Florent Morel , Roberto Mrad
APEC, Mar 2019, Anaheim, Californie, United States
Communication dans un congrès hal-02076184v1
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Evaluation of the PCB-embedding technology for a 3.3 kW converter

Rémy Caillaud , Johan Le Lesle , Cyril Buttay , Florent Morel , Roberto Mrad
IEEE IWIPP, Apr 2019, Toulouse, France. ⟨10.1109/IWIPP.2019.8799080⟩
Communication dans un congrès hal-02291502v1
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Packaging Solution for SiC Power Modules with a Fail-to-Short Capability

Ilyas Dchar , Cyril Buttay , Hervé Morel
APEC, Mar 2019, Anaheim, Californie, United States. ⟨10.1109/APEC.2019.8722126⟩
Communication dans un congrès hal-02076181v1
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Design of a Low-Capacitance Planar Transformer for a 4 kW/500 kHz DAB Converter

Pierre Demumieux , Oriol Avino-Salvado , Cyril Buttay , Christian Martin , Fabien Sixdenier
APEC, Mar 2019, Anaheim, Californie, United States. pp.18720757, ⟨10.1109/APEC.2019.8722279⟩
Communication dans un congrès hal-02076183v1
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A 3D Folded Power Inductor with PCB based technology for applications in the kW range

Johan Le Lesle , Corentin Darbas , Florent Morel , Nicolas Degrenne , Rémy Caillaud
APEC, Mar 2019, Anaheim, Californie, United States. ⟨10.1109/APEC.2019.8722295⟩
Communication dans un congrès hal-02076182v1
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An investigation of current distribution over four GaN HEMTs in parallel configurations

Thilini Wickramasinghe , Cyril Buttay , Christian Martin , Hervé Morel , Pascal Bevilacqua
The 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA 2019), Oct 2019, Raleigh, United States. ⟨10.1109/WiPDA46397.2019.8998816⟩
Communication dans un congrès hal-02405882v1
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A Study on Shunt Resistor-based Current Measurements for Fast Switching GaN Devices

Thilini Wickramasinghe , Bruno Allard , Cyril Buttay , Charles Joubert , Christian Martin
45th IEEE IECON, Oct 2019, Lisbonne, Portugal. ⟨10.1109/IECON.2019.8927490⟩
Communication dans un congrès hal-02405883v1

Die Interconnection for Power Module 3.0

Vincent Bley , Cyril Buttay , Denis Labrousse , Mickael Petit , Bojan Djuric
ECPE Workshop "Power Module 2.0", Oct 2019, Hambourg, Germany
Communication dans un congrès hal-02405800v1
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Study of convective condensation in a thermosiphon loop

Majed Eddine Moustaid , Vincent Platel , Cyril Buttay
14th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics (HEFAT 2019), Jul 2019, Wicklow, Ireland
Communication dans un congrès hal-02417004v1
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Design, manufacturing and characterization of printed circuit board embedded inductors for power applications

Rémy Caillaud , Cyril Buttay , Roberto Mrad , Johan Le Lesle , Florent Morel
2018 IEEE ICIT, Feb 2018, Lyon, France. ⟨10.1109/ICIT.2018.8352262⟩
Communication dans un congrès hal-01736336v1
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Application of the PCB-Embedding Technology in Power Electronics – State of the Art and Proposed Development

Cyril Buttay , Christian Martin , Florent Morel , Rémy Caillaud , Johan Le Leslé
3D-PEIM, Jun 2018, College Park, Maryland, United States. ⟨10.1109/3DPEIM.2018.8525236⟩
Communication dans un congrès hal-01844981v1

Design of a 1200 V, 100 kW Power Converter: How Good are the Design and Modelling Tools?

Thomas Lagier , Cyril Buttay , Piotr Dworakowski , Benhur Zolett
ECPE Workshop "The Future of Simulation in Power Electronics Packaging for Thermal and Stress Management", Nov 2018, Nuremberg, Germany
Communication dans un congrès hal-01939745v1

Design of a 3kW power converter using PCB-embedding technology

Rémy Caillaud , Johan Le Lesle , Cyril Buttay , Florent Morel , Roberto Mrad
From Nano to Micro Power Electronics And Packaging Workshop (IMAPS), Nov 2018, Tours, France
Communication dans un congrès hal-01935157v1

Design considerations for the 2-phase cooling system of a 5 MW MVDC converter

Majededdine Moustaid , Cyril Buttay , Vincent Platel
Troisième ATW Européen Micropackaging et management thermique, Jan 2018, La Rochelle, France
Communication dans un congrès hal-01895892v1
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A 100 kW 1.2 kV 20 kHz DC-DC converter prototype based on the Dual Active Bridge topology

Thomas Lagier , Laurent Chédot , François Wallart , Layal Ghossein , Bruno Lefebvre
2018 IEEE ICIT, Feb 2018, Lyon, France. ⟨10.1109/ICIT.2018.8352238⟩
Communication dans un congrès hal-01747437v1
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Procédé de microfabrication de transformateurs intégrés

Maxime Semard , Christian Martin , Cyril Buttay , Charles Joubert
Symposium de Génie Electrique (SGE'18), Université de Lorraine [UL], Jul 2018, Nancy, France
Communication dans un congrès hal-01844983v1
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Packaging with double-side cooling capability for SiC devices, based on silver sintering

Cyril Buttay , Raphaël Riva , Bruno Allard , Marie-Laure Locatelli , Vincent Bley
44th IEEE IECON, IEEE, Oct 2018, Washington DC, United States. ⟨10.1109/IECON.2018.8591117⟩
Communication dans un congrès hal-01895805v1
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High-Temperature Coplanar Transformer

Maxime Semard , Christian Martin , Cyril Buttay , Charles Joubert
2018 IEEE ICIT, A. Sari, Laboratoire Ampère, Feb 2018, Lyon, France. pp.730 - 735, ⟨10.1109/ICIT.2018.8352268⟩
Communication dans un congrès hal-01736329v1

Packaging of 10 kV SiC MOSFETs: Trade-Off Between Electrical and Thermal Performances

Cyril Buttay , Hugo Reynes
International Forum on Wide Bandgap Semiconductors China (IFWS), Oct 2018, Shenzhen, China
Communication dans un congrès hal-01895875v1

Characterization of Materials and their Interfaces in a DBC Substrate for Power Electronics Applications

Aymen Ben Kabaar , Cyril Buttay , Olivier Dezellus , Rafael Estevez , Anthony Gravouil
ECPE Workshop "Future of Simulation in Power Electronics Packaging for Thermal and Stress Management", Nov 2018, Nuremberg, Germany
Communication dans un congrès hal-01935060v1
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Optimisation of an Integrated Bidirectional Interleaved Single-Phase Power Factor Corrector

Johan Le Lesle , Rémy Caillaud , Florent Morel , Nicolas Degrenne , Cyril Buttay
PCIM Europe 2018, Jun 2018, Nuremberg, Germany
Communication dans un congrès hal-01844988v1
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Optimum Design of a Single-Phase Power Pulsating Buffer (PPB) with PCB-integrated Inductor Technologies

Johan Le Lesle , Rémy Caillaud , Cyril Buttay , Florent Morel , Nicolas Degrenne
2018 IEEE ICIT, Feb 2018, Lyon, France. ⟨10.1109/ICIT.2018.8352277⟩
Communication dans un congrès hal-01736332v1
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Protruding Ceramic Substrates for High Voltage Packaging Of Wide Bandgap Semiconductors

Hugo Reynes , Cyril Buttay , Hervé Morel
WiPDA, Oct 2017, Albuquerque, United States. ⟨10.1109/WiPDA.2017.8170581⟩
Communication dans un congrès hal-01645029v1

Thermal Management Optimization of a 5 MW Power Electronic Converter

Hugo Reynes , Jose Maneiro , Cyril Buttay , Piotr Dworakowski
12th european advanced technology workshop on micropackaging and thermal management (iMaps), IMAPS, Feb 2017, La Rochelle, France
Communication dans un congrès hal-01473614v1

Étude de la robustesse de l’oxyde de grille pour des applications aéronautiques

Oriol Aviño Salvado , Hervé Morel , Cyril Buttay
JCGE, May 2017, Arras, France. pp.146345
Communication dans un congrès hal-01534712v1

Etat de l’art de l’intégration en électronique de puissance et axes de recherches associés

Vincent Bley , Cyril Buttay , Mickael Petit
ISP3D, Mar 2017, Toulouse, France
Communication dans un congrès hal-01802078v1
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Robustness of SiC MOSFET under avalanche conditions

Ilyas Dchar , Marion Zolkos , Cyril Buttay , Hervé Morel
APEC, Mar 2017, Tampa, FL, United States. pp.2263-2268, ⟨10.1109/APEC.2017.7931015⟩
Communication dans un congrès hal-01535735v1

High power PCB-embedded inductors based on ferrite powder

Rémy Caillaud , Cyril Buttay , Johan Le Lesle , Florent Morel , Roberto Mrad
5th Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum (MiNaPAD 2017, IMAPS, May 2017, Grenoble, France
Communication dans un congrès hal-01535727v1
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Evaluation of printed-circuit boards materials for high temperature operation

Oriol Aviño Salvado , Wissam Sabbah , Cyril Buttay , Hervé Morel , Pascal Bevilacqua
HiTEN, IMAPS, Jul 2017, Cambridge, United Kingdom
Communication dans un congrès hal-01565131v1
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Comparison of planar and Toroidal PCB integrated inductors for a multi-cellular 3.3 kW PFC

Rémy Caillaud , Cyril Buttay , Roberto Mrad , Johan Le Lesle , Florent Morel
2017 IEEE IWIPP, Apr 2017, Delft, Netherlands. ⟨10.1109/IWIPP.2017.7936757⟩
Communication dans un congrès hal-01535721v1

Multi-objective optimisation of a bidirectional single-phase grid connected AC/DC converter (PFC) with two different modulation principles

Johan Le Lesle , Rémy Caillaud , Florent Morel , Nicolas Degrenne , Cyril Buttay
ECCE, Oct 2017, Cincinnati, OH, United States. ⟨10.1109/ECCE.2017.8096889⟩
Communication dans un congrès hal-01644174v1
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Design of a SiC based triple active bridge ceil for a multi-megawatt DC-DC converter

Jose Maneiro , Roland Ryndzionek , Thomas Lagier , Piotr Dworakowski , Cyril Buttay
EPE'17 ECCE Europe, Sep 2017, Warsaw, Poland. ⟨10.23919/EPE17ECCEEurope.2017.8099005⟩
Communication dans un congrès hal-01646807v1
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Integrated High-Temperature Isolation barrier with Coreless Transformer

Rémi Perrin , Bruno Allard , Christian Martin , Cyril Buttay
9th CIPS, Mar 2016, Nuremberg, Germany
Communication dans un congrès hal-01372145v1
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Comparison of topside contact layouts for power dies embedded in PCB

Chenjiang Yu , Cyril Buttay , Eric Labouré , Vincent Bley , Céline Combettes
ESTC, IMAPS, Sep 2016, Grenoble, France. ⟨10.1109/ESTC.2016.7764707⟩
Communication dans un congrès hal-01373042v1
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2 MHz high-density integrated power supply for gate driver in high-temperature applications

Remi Perrin , Bruno Allard , Cyril Buttay , Nicolas Quentin , Wenli Zhang
APEC, Mar 2016, Long Beach, CA, United States. ⟨10.1109/APEC.2016.7467922⟩
Communication dans un congrès hal-01372141v1

Utilisation d’un modèle CEM pour l’estimation des pertes dans un module de puissance

Anne-Sophie Podlejski , Arnaud Bréard , Christian Vollaire , Cyril Buttay
CEM, Jul 2016, Rennes, France
Communication dans un congrès hal-02161822v1

GaN Active-Clamp Flyback Converter with Resonant Operation Over a Wide Input Voltage Range

Nicolas Quentin , Rémi Perrin , Christian Martin , Charles Joubert , Bertrand Lacombe
PCIM Europe 2016, May 2016, Nuremberg, Germany. pp.CD
Communication dans un congrès hal-01387590v1
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Analyse de la robustesse des MOSFET SiC pour les applications diode-less

Oriol Aviño Salvado , Cheng Chen , Cyril Buttay , Hervé Morel , Denis Labrousse
Symposium de Génie Electrique (SGE'16), Jun 2016, Grenoble, France
Communication dans un congrès hal-01361711v1
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Two Comparison-Alternative High Temperature PCB-Embedded Transformer Designs for a 2 W Gate Driver Power Supply

Bingyao Sun , Rolando Burgos , Dushan Boroyevich , Remi Perrin , Cyril Buttay
ECCE, IEEE, Sep 2016, Milwaukee, WI, United States. ⟨10.1109/ECCE.2016.7855537⟩
Communication dans un congrès hal-01373036v1

EDT for Power Devices

Cyril Buttay , Chenjiang Yu , Eric Labouré , Vincent Bley , Céline Combettes
Embedded Device Technology: “Disappearing Die – Embed your Chips”, IMAPS - NMI, Sep 2016, Caldicot, United Kingdom
Communication dans un congrès hal-01373062v1

Improving the thermal management of power GaN devices

Chenjiang Yu , Cyril Buttay , Eric Labouré
Advanced Technology Workshop (ATW) on Thermal Management, IMAPS, Sep 2016, Los Gatos, CA, United States
Communication dans un congrès hal-01373027v1
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Silver sintering for power electronics integration

Cyril Buttay , Bruno Allard , Raphaël Riva
ICEP- IAAC, IMAPS, Apr 2015, Kyoto, Japan. ⟨10.1109/ICEP-IAAC.2015.7111076⟩
Communication dans un congrès hal-01196525v1
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Thermal management of lateral GaN power devices

Chenjiang Yu , Éric Labouré , Cyril Buttay
2015 IEEE IWIPP, May 2015, Chicago, IL, United States. ⟨10.1109/IWIPP.2015.7295973⟩
Communication dans un congrès hal-01196527v1

High temperature operation of SiC transistors

Cyril Buttay , Marwan Ali , Oriol Aviño Salvado , Hervé Morel , Bruno Allard
Advanced Technology Workshop (ATW) on Thermal Management, IMAPS, Sep 2015, Los Gatos, CA, United States
Communication dans un congrès hal-01373030v1
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Robustness of SiC MOSFETs in short-circuit mode

Cheng Chen , Denis Labrousse , Stéphane Lefebvre , Mickaël Petit , Cyril Buttay
PCIM Europe 2015, May 2015, Nuremberg, Germany
Communication dans un congrès hal-01196528v1
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Highly integrated power electronic converters using active devices embedded in printed-circuit board

Chenjiang Yu , Cyril Buttay , Eric Labouré , Vincent Bley , Céline Combettes
4th Micro/Nano-Electronics, packaging and assembling, design and manufacturing forum MiNaPAD 2015, IMAPS, Apr 2015, Grenoble, France
Communication dans un congrès hal-01197043v1
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Considerations for High Temperature Power Electronics

Bruno Allard , Cyril Buttay , Christian Martin , Hervé Morel
18th International Symposium on Power Electronics Ee2015, Oct 2015, Novi Sad, Serbia
Communication dans un congrès hal-01372146v1

Layout modelling to predict compliance with EMC standards of power electronic converters

Anne-Sophie Podlejski , Arnaud Bréard , Cyril Buttay , Eliana Rondon , Florent Morel
EMC, Aug 2015, Dresden, Germany. pp.779-784, ⟨10.1109/ISEMC.2015.7256262⟩
Communication dans un congrès hal-01188561v1

Study of short-circuit robustness of SiC MOSFETs, analysis of the failure modes and comparison with BJTs

Cheng Chen , Denis Labrousse , Stéphane Lefebvre , Mickael Petit , Cyril Buttay
ESREF, Oct 2015, Toulouse, France. pp.1708-1713
Communication dans un congrès hal-01700463v1
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Integrated packaging allows for improvement in switching characteristics of silicon carbide devices

Cyril Buttay , Khalil El Falahi , Rémi Robutel , Stanislas Hascoët , Christian Martin
PCIM Europe 2014, May 2014, Nuremberg, Germany. 8 p
Communication dans un congrès hal-00997355v1
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Design and Manufacturing of a Double-Side Cooled, SiC based, High Temperature Inverter Leg

Raphaël Riva , Cyril Buttay , Marie-Laure Locatelli , Vincent Bley , Bruno Allard
HiTEC 2014, May 2014, Albuquerque, United States. pp.THA27
Communication dans un congrès hal-00997365v1
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Estimation des pertes dans les transistors bipolaires SiC

Cheng Chen , Denis Labrousse , Stéphane Lefebvre , Cyril Buttay , Hervé Morel
Symposium de Génie Electrique (SGE'14), Jul 2014, Cachan, France
Communication dans un congrès hal-01065220v1

3D Packaging Structure for High Temperature Power electronics

Raphaël Riva , Cyril Buttay , Rémi Perrin , Marie-Laure Locatelli , Vincent Bley
From Nano to Micro Power Electronics and Packaging Workshop, IMAPS France, Oct 2014, Tours, France
Communication dans un congrès hal-01081697v1

Planar, Double-Layer Magnetic Inductors for Low Power, High Frequency DC-DC Converters

Elias Haddad , Christian Martin , Charles Joubert , Bruno Allard , Cyril Buttay
8th CIPS, Feb 2014, Nuremberg, Germany. CD (5 p.)
Communication dans un congrès hal-00739037v1
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Mesure précise des pertes dans un module d'électronique de puissance par une méthode calorimétrique

Anne-Sophie Podlejski , Cyril Buttay , Dominique Bergogne , Julien Morand , Christian Vollaire
Symposium de Génie Electrique (SGE'14), Jul 2014, Cachan, France
Communication dans un congrès hal-01065267v1
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Power Loss Estimation in SiC Power BJTs

Chen Cheng , Denis Labrousse , Stéphane Lefebvre , Hervé Morel , Cyril Buttay
PCIM Europe 2014, May 2014, Nuremberg, Germany. 8 p
Communication dans un congrès hal-00997718v1

Realization and Characterization of an IGBT Module Based on the Power Chip-on-Chip 3D Concept

Jean-Louis Marchesini , Pierre-Olivier Jeannin , Yvan Avenas , Leonardo Ruffeil de Oliveira , Cyril Buttay
ECCE, Sep 2014, Pittsburgh, PA, United States. ⟨10.1109/ECCE.2014.6954043⟩
Communication dans un congrès hal-01067144v1
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Predicting Static Losses in an Inverter-Leg built with SiC Normally-Off JFETs and SiC diodes

Xavier Fonteneau , Florent Morel , Cyril Buttay , Hervé Morel , Philippe Lahaye
APEC, Mar 2013, Long Beach, CA, United States. pp.2636-2642, ⟨10.1109/APEC.2013.6520668⟩
Communication dans un congrès hal-00829353v1

High Temperature Operation of SiC Converters

Cyril Buttay
ECPE SiC and GaN user forum, May 2013, Munich, Germany
Communication dans un congrès hal-00874751v1
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Analysis of the SiC VJFET gate punch-through and its dependence with the temperature

Fabien Dubois , Dominique Bergogne , Dominique Tournier , Cyril Buttay , Régis Meuret
EPE, Sep 2013, Lille, France. Paper 344, ⟨10.1109/EPE.2013.6631963⟩
Communication dans un congrès hal-00874655v1
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Full densification of molybdenum powders and multilayer materials obtained by Spark Plasma Sintering

Bassem Mouawad , D. Fabregue , Cyril Buttay , Maher Soueidan
ISIEM 2013, Society of Inorganic Materials, Japan (SIMJ) et Université Rennes 1, France (UR1)., Oct 2013, Rennes, France
Communication dans un congrès hal-01081684v1
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High Temperature, High Frequency Micro-Inductors for Low Power DC-DC Converters

Elias Haddad , Christian Martin , Cyril Buttay , Charles Joubert , Bruno Allard
EPE, Sep 2013, Lille, France. paper 390, ⟨10.1109/EPE.2013.6631994⟩
Communication dans un congrès hal-00874475v1
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High temperature, Smart Power Module for aircraft actuators

Khalil El Falahi , Stanislas Hascoët , Cyril Buttay , Pascal Bevilacqua , Luong Viet Phung
HiTEN'13, Jul 2013, Oxford, United Kingdom
Communication dans un congrès hal-00874666v1
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Thermal stability of SiC JFETs in conduction mode

Rémy Ouaida , Cyril Buttay , Raphaël Riva , Dominique Bergogne , Christophe Raynaud
EPE, Sep 2013, Lille, France. paper 223, ⟨10.1109/EPE.2013.6631881⟩
Communication dans un congrès hal-00874471v1

High Temperature Ageing of Fe-based Nanocrystalline Ribbons

Christian Martin , Rémi Robutel , Cyril Buttay , Fabien Sixdenier , Pascal Bevilacqua
HiTEC 2012, May 2012, Albuquerque, United States. 6p
Communication dans un congrès hal-00760373v1
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Report de puce par frittage d'argent - mise en oeuvre et analyse

Amandine Masson , Wissam Sabbah , Raphaël Riva , Cyril Buttay , Stephane Azzopardi
14ème EPF, Jul 2012, Bordeaux, France. pp.CD (ref 61)
Communication dans un congrès hal-00729156v1
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Sintered molybdenum for a metallized ceramic substrate packaging for the wide-bandgap devices and high temperature applications

Bassem Mouawad , Cyril Buttay , Maher Soueidan , Hervé Morel , Vincent Bley
ISPSD, Jun 2012, Bruges, Belgium. pp.295-298, ⟨10.1109/ISPSD.2012.6229081⟩
Communication dans un congrès hal-00707820v1
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Pressureless Silver Sintering Die-Attach for SiC Power Devices

Stanislas Hascoët , Cyril Buttay , Dominique Planson , Rodica Chiriac , Amandine Masson
CSCRM, Sep 2012, Saint-Pétersbourg, Russia. 2p
Communication dans un congrès hal-00759987v2
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3-Dimensional, Solder-Free Interconnect Technology for high-Performance Power Modules

Bassem Mouawad , Cyril Buttay , Maher Soueidan , Hervé Morel , Bruno Allard
7th CIPS, Mar 2012, Nuremberg, Germany. pp.433-438
Communication dans un congrès hal-00707741v1

An Airborne High Temperature SiC Power Converter for Medium Power Smart Electro Mechanical Actuators

Dominique Bergogne , Fabien Dubois , Christian Martin , Khalil El Falahi , Luong Viet Phung
HiTEC 2012, May 2012, Albuquerque, United States. 6p
Communication dans un congrès hal-00760366v1
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Evaluation of silver-sintering die attach

Wissam Sabbah , Raphaël Riva , Stanislas Hascoët , Cyril Buttay , Stephane Azzopardi
7th CIPS, Mar 2012, Nuremberg, Germany. pp.237-243
Communication dans un congrès hal-00707733v1

High temperature anti short circuit function for normally-on SiC JFET in an inverter leg configuration

Khalil El Falahi , Fabien Dubois , Dominique Bergogne , Luong Viet Phung , Cyril Buttay
HiTEC 2012, May 2012, Albuquerque, United States. 6p
Communication dans un congrès hal-00760372v1
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Thermal Runaway Robustness of SiC VJFETs

Rémy Ouaida , Cyril Buttay , Anh Dung Hoang , Raphaël Riva , Dominique Bergogne
CSCRM, Sep 2012, Saint-Pétersbourg, Russia. 2p
Communication dans un congrès hal-00759975v2

Active protections for normally-on SiC JFETs

Fabien Dubois , Damien Risaletto , Dominique Bergogne , Hervé Morel , Cyril Buttay
EPE, Aug 2011, Birmingham, United Kingdom. pp.CD
Communication dans un congrès hal-00629227v1
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Higher temperature power electronics for larger-scale mechatronic integration

Bruno Allard , Cyril Buttay , Dominique Tournier , Rémi Robutel , Jean-François Mogniotte
Automotive Power Electronics, Apr 2011, Paris, France. Actes sur CD (pas de pagination)
Communication dans un congrès hal-00687139v1

Modeling, Fabrication, and Characterization of Planar Inductors on YIG Substrates

Elias Haddad , Christian Martin , Charles Joubert , Bruno Allard , Maher Soueidan
CIMA, Mar 2011, Beyrouth, Lebanon. pp.Tu-P9
Communication dans un congrès hal-00787193v1

A multi-physics model of the VJFET with a lateral channel

Hervé Morel , Youness Hamieh , Dominique Tournier , Rémi Robutel , Fabien Dubois
EPE, Aug 2011, Birmingham, United Kingdom. pp.CD
Communication dans un congrès hal-00629220v1
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High-temperature die-attaches for SiC power devices

Amandine Masson , Cyril Buttay , Hervé Morel , Christophe Raynaud , Stanislas Hascoët
EPE, Aug 2011, Birmingham, United Kingdom. pp.Article number 6020161
Communication dans un congrès hal-00672602v1

Thermal Requirements of SiC Power Devices

Cyril Buttay , Christophe Raynaud , Hervé Morel , Gabriel Civrac , Marie-Laure Locatelli
6th European Advanced Technology Workshop on Micropackaging and Thermal Management, Feb 2011, La Rochelle, France
Communication dans un congrès hal-00672631v1
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Mechanical Study of Copper Bonded at Low Temperature Using Spark Plasma Sintering Process

Bassem Mouawad , Maher Soueidan , D. Fabregue , Cyril Buttay , Vincent Bley
CIMA, Mar 2011, Beyrouth, Lebanon. pp.CD
Communication dans un congrès hal-00687147v2
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Elaboration of Architectured Materials by Spark Plasma Sintering

D. Fabregue , Bassem Mouawad , Cyril Buttay , Maher Soueidan , Aude Lamontagne
THERMEC, Aug 2011, Québec, Canada. pp.1885-1892, ⟨10.4028/www.scientific.net/MSF.706-709.1885⟩
Communication dans un congrès hal-00687142v1

High-temperature behavior of SiC power diodes

Cyril Buttay , Christophe Raynaud , Hervé Morel , Mihai Lazar , Gabriel Civrac
EPE, Aug 2011, Birmingham, United Kingdom. pp.CD
Communication dans un congrès hal-00629225v1
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Die Attach of Power Devices Using Silver Sintering - Bonding Process Optimization and Characterization

Cyril Buttay , Amandine Masson , Jianfeng Li , Mark C. Johnson , Mihai Lazar
HiTEN 2011, Jul 2011, Oxford, United Kingdom. pp.1-7
Communication dans un congrès hal-00672619v1

Caractérisation des non-linéarités dans les condensateurs céramiques haute température

Rémi Robutel , Christian Martin , Cyril Buttay , Hervé Morel , Régis Meuret
13ème EPF, Jun 2010, Saint-Nazaire, France
Communication dans un congrès hal-00618657v1

Design of High Temperature EMI Input Filter for a 2 kW HVDC-Fed Inverter

Rémi Robutel , Christian Martin , Hervé Morel , Cyril Buttay , Dominique Bergogne
HiTEC 2010, May 2010, Albuquerque, United States. pp.000236
Communication dans un congrès hal-00485284v1

Effect of High Temperature Ageing on Active and Passive Power Devices

Cyril Buttay , Rémi Robutel , Christian Martin , Christophe Raynaud , Siméon Dampieni
HiTEC 2010, May 2010, Albuquerque, United States. pp.000228
Communication dans un congrès hal-00485273v1
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Electro-thermal behaviour of a SiC JFET stressed by lightning-induced overvoltages

Dominique Bergogne , Asif Hammoud , Dominique Tournier , Cyril Buttay , Youness Amieh
EPE, Sep 2009, Barcelone, France. pp.1--8
Communication dans un congrès hal-00446059v1
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State of the art of High Temperature Power Electronics

Cyril Buttay , Dominique Planson , Bruno Allard , Dominique Bergogne , Pascal Bevilacqua
Microtherm, Jun 2009, Lodz, Poland. pp.8-17
Communication dans un congrès hal-00413349v1
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Paralleling of Low-Voltage MOSFETs Operating in Avalanche Conditions

Cyril Buttay , Olivier Brevet , Bruno Allard , Dominique Bergogne , Hervé Morel
EPE, Sep 2005, Dresden, Germany. ⟨10.1109/EPE.2005.219271⟩
Communication dans un congrès hal-00138894v1
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Bond Graph Modeling of Current Diffusion in Magnetic Cores

Hervé Morel , Bruno Allard , Sabrine M'Rad , Cyril Buttay , Kaiçar Ammous
ICBGM, Jan 2005, New Orleans, LA, United States. pp 87-91
Communication dans un congrès hal-00412621v1
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A Voltage-Measurement Based Estimator for Current and Temperature in MOSFET H-Bridge

Cyril Buttay , Dominique Bergogne , Hervé Morel , Bruno Allard , René Ehlinger
EPE, Sep 2003, Toulouse, France. pp.1-10
Communication dans un congrès hal-00413309v1
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Towards a Sensorless Current and Temperature Monitoring in MOSFET-Based H-Bridge

Cyril Buttay , Dominique Bergogne , Hervé Morel , Bruno Allard , René Ehlinger
IEEE PESC, Jun 2003, Accapulco, Mexico. pp.901 - 906, ⟨10.1109/PESC.2003.1218175⟩
Communication dans un congrès hal-00413325v1
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L’électronique pour la conversion - Projet ciblé VERTIGO: Vertical GaN for High Voltage

Cyril Buttay , Julien Buckley
Lancement et première journée scientifique annuelle du PEPR Électronique, Mar 2023, Poitier, France
Poster de conférence hal-04388116v1
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Le Packaging en électronique de puissance

Cyril Buttay
Sciences de l'ingénieur [physics]. INSA de lyon, 2015
HDR tel-01267363v1