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Improvement of the thermal performance of printed circuit boards by embedding of graphite heat spreaders
Ahmed Sabry Eltaher Ahmed
,
Rémi Perrin
,
Guillaume Lefebvre
,
Cyril Buttay
,
Jacques Jay
16th European Advanced Technology Workshop on Micropackaging and Thermal management (THERMAL 2023), IMAPS, Mar 2023, Poitiers, France
Communication dans un congrès
hal-04147426v1
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Towards a Common Mode Current Free Packaging Solution for High Voltage Series Connected SiC MOSFET Switches
Cédric Mathieu de Vienne
,
Besar Asllani
,
Hugo Reynes
,
Martin Guillet
,
Amin Salim Obaid Al-Hinaai
Power Electronics, Intelligent Motion, Renewable Energy and Energy Management ( PCIM ) Europe, May 2023, Nuremberg, Germany
Communication dans un congrès
hal-04147021v1
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Design of Oil Insulated SiC Diode Rectifier for an MVDC SST
Pierre Le Métayer
,
Hugo Reynes
,
Piotr Dworakowski
,
Cyril Buttay
,
Drazen Dujic
International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM Europe 2023 ), May 2023, Nuremberg, Germany. pp.566091039, ⟨10.30420/566091039⟩
Communication dans un congrès
hal-04153731v1
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An Advanced Integrated Cooling Solution for High Voltage and Power Density Modules
Amin Salim Obaid Al-Hinaai
,
Till Huesgen
,
Cyril Buttay
,
Eric Vagnon
,
Ildiko Ettinger
Therminic 2023 - 29th International Workshop Thermal Investigations on ICs and Systems, Sep 2023, Budapest, Hungary. à paraître
Communication dans un congrès
hal-04240225v1
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Fault Ride Through of DC Solid State Transformer in Medium Voltage DC Systems
Pierre Le Métayer
,
Drazen Dujic
,
Cyril Buttay
,
Piotr Dworakowski
International Conference & Exhibition on Electricity Distribution (CIRED 2023), Jun 2023, Rome, Italy
Communication dans un congrès
hal-04154265v1
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A novel integrated cooling packaging for high power density semiconductors
Amin Salim Obaid Al-Hinaai
,
Till Huesgen
,
Cyril Buttay
,
Richard Zeitler
,
Daniela Mayer
Communication dans un congrès
hal-03803773v1
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Design of a test package for high voltage SiC diodes
Arthur Boutry
,
Bruno Lefebvre
,
Cyril Buttay
,
Eric Vagnon
,
Dominique Planson
Communication dans un congrès
hal-03772006v1
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Assessment of Partial Discharge Phenomenon in AC and Fast-rising Square Voltage Using Optical Detection Technique in Needle-Plane Configuration With Pressboard in Mineral Oil
Somya Anand
,
Eric Vagnon
,
Martin Guillet
,
Cyril Buttay
Communication dans un congrès
hal-03803771v1
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|
Modelling and Simulation of PCB Embedded Power Electronic Layouts
Cyril Buttay
,
Bahaeddine Ben Hamed
,
Ahmed Sabry Eltaher Ahmed
,
Guillaume Regnat
,
Rémi Perrin
ECPE Workshop "Embedding and Advanced Integration Technologies in Power Electronics", ECPE - European Center for Power Electronics, Nov 2022, Graz, Austria
Communication dans un congrès
hal-04147105v1
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Experimental study of the reduction and removal of turn-on snubber for IGCT based MMC submodule using fast silicon diodes
Arthur Boutry
,
Cyril Buttay
,
Besar Asllani
,
Bruno Lefebvre
,
Eric Vagnon
Proceedings of the European Power Electronics conference (EPE ECCE 2022), Sep 2022, Hannovre, Germany
Communication dans un congrès
hal-03775977v1
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|
Medium Voltage Diode Rectifier Design for High Step-Up DC-DC Converter
Pierre Le Métayer
,
Cyril Buttay
,
Drazen Dujic
,
Piotr Dworakowski
European Power Electronics conference (EPE ECCE 2022), Sep 2022, Hannovre, Germany
Communication dans un congrès
hal-03790420v1
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Graphite heat spreader for power component embedded in printed circuit boards (PCB)
Ahmed Sabry Eltaher Ahmed
,
Rémi Perrin
,
Guillaume Lefebvre
,
Cyril Buttay
,
Jacques Jay
Journée technique IEEE Electronics Packaging Society France, Chapitre français de l'IEEE Electronics Packaging Society, Dec 2022, Palaiseau, France
Communication dans un congrès
hal-04159893v1
|
|
Intégration hybride en électronique de puissance
Mickaël Petit
,
Cyril Buttay
Journée Electronique de Puissance, Mar 2022, Grenoble, France
Communication dans un congrès
hal-03712244v1
|
|
Unidirectional step-up isolated DC-DC converter for MVDC electrical networks
Piotr Dworakowski
,
Pierre Le Métayer
,
Drazen Dujic
,
Cyril Buttay
CIGRE Session 2022, Aug 2022, Paris, France
Communication dans un congrès
hal-03771023v1
|
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A Guide for Accurate and Repeatable Measurement of the R TH,JC of SiC Packages
Jack Knoll
,
Christina Dimarino
,
Cyril Buttay
Communication dans un congrès
hal-04030134v1
|
|
A Novel Packaging with Direct Dielectric Liquid Cooling for High Voltage Power Electronics
Amin Salim Obaid Al-Hinaai
,
Till Huesgen
,
Cyril Buttay
,
Eric Vagnon
,
Richard Zeitler
Communication dans un congrès
hal-03772005v1
|
|
Enhancing voltage rating of standard power modules for harsh environment applications
Hugo Reynes
,
Eric Vagnon
,
Cyril Buttay
,
Martin Guillet
Proceedings of the Power Conversion Intelligent Motion conference (PCIM) 2022, May 2022, Nuremberg, Germany. ⟨10.30420/565822083⟩
Communication dans un congrès
hal-03760089v1
|
|
Automatic Model Generation for PCB-based Power Electronics
Bahaeddine Ben Hamed
,
Guillaume Regnat
,
Guillaume Lefèvre
,
Cyril Buttay
Conference on Integrated Power Electronics Systems (CIPS), Mar 2022, Berlin, Germany
Communication dans un congrès
hal-03641121v1
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|
Electrical and optical partial discharge assessment of dielectric barriers in mineral oil and synthetic ester
Somya Anand
,
Eric Vagnon
,
Ayyoub Zouaghi
,
Martin Guillet
,
Cyril Buttay
Communication dans un congrès
hal-03515576v1
|
|
Break-even distance for MVDC electricity networks according to power loss criteria
Pierre Le Métayer
,
Juan Paez
,
Sellé Touré
,
Cyril Buttay
,
Drazen Dujic
Communication dans un congrès
hal-03366134v1
|
|
Characterization of 4 kV Charge-Balanced SiC MOSFETs
Jack Knoll
,
Mina Shawky
,
Sheng-Hung Yen
,
Ibrahim Eshera
,
Christina Dimarino
Communication dans un congrès
hal-03360838v1
|
|
High Power Density Design of Power Electronic Interrupter in Hybrid DC Circuit Breaker
Jian Liu
,
Lakshmi Ravi
,
Dong Dong
,
Rolando Burgos
,
Cyril Buttay
Communication dans un congrès
hal-03361482v1
|
|
Surge Current Capability of IGBT Based Power Electronic Interrupter Modules for Hybrid DC Circuit Breaker Applications
Lakshmi Ravi
,
Jian Liu
,
Dong Dong
,
Rolando Burgos
,
Cyril Buttay
Communication dans un congrès
hal-03361517v1
|
|
Simple and Precise Calorimetry Method for Evaluation of Losses in Power Electronic Converters
Nicolas Mary
,
Rémi Perrin
,
Stefan Mollov
,
Cyril Buttay
CIPS 2020, Mar 2020, Berlin, Germany
Communication dans un congrès
hal-02968788v1
|
|
How Good are the Design Tools in Power Electronics?
Thomas Lagier
,
Piotr Dworakowski
,
Laurent Chédot
,
François Wallart
,
Bruno Lefebvre
Communication dans un congrès
hal-02968867v1
|
|
Experimental validation and comparison of a SiC MOSFET based 100 kW 1.2 kV 20 kHz three-phase dual active bridge converter using two vector groups
Thomas Lagier
,
Piotr Dworakowski
,
Cyril Buttay
,
Philippe Ladoux
,
Andrzej Wilk
Communication dans un congrès
hal-02973471v1
|
|
Figures-of-Merit and current metric for the comparison of IGCTs and IGBTs in Modular Multilevel Converters
Arthur Boutry
,
Cyril Buttay
,
Dong Dong
,
Rolando Burgos
,
Bruno Lefebvre
Communication dans un congrès
hal-02968851v1
|
|
Surge Current Capability of Ga2O3 Schottky Diodes
Cyril Buttay
,
Hiu-Yung Wong
,
Boyan Wang
,
Ming Xiao
,
Christina Dimarino
CPES Annual Conference, Aug 2020, Blacksburg, VA, United States
Communication dans un congrès
hal-02968817v1
|
|
Thermosiphon for passive cooling of a MVDC converter iMaps-ATW on Micropackaging and Thermal Management
Majed Eddine Moustaid
,
Vincent Platel
,
Cyril Buttay
,
Bruno Lefebvre
15th European Advanced Technology Workshop on Micropackaging and Thermal Management, Feb 2020, La Rochelle, France
Communication dans un congrès
hal-02968778v1
|
|
Benefits of GaN transistors and embedding in PCB laminates
Cyril Buttay
,
Christian Martin
,
Charles Joubert
,
Hervé Morel
,
Bruno Allard
SIA Power Train & Electronics, Jun 2019, Paris, France
Communication dans un congrès
hal-02291496v1
|
|
Application of the PCB-Embedding Technology to a 3.3 kW Power Factor Corrector
Rémy Caillaud
,
Johan Le Lesle
,
Cyril Buttay
,
Florent Morel
,
Roberto Mrad
APEC, Mar 2019, Anaheim, Californie, United States
Communication dans un congrès
hal-02076184v1
|
|
Evaluation of the PCB-embedding technology for a 3.3 kW converter
Rémy Caillaud
,
Johan Le Lesle
,
Cyril Buttay
,
Florent Morel
,
Roberto Mrad
Communication dans un congrès
hal-02291502v1
|
|
Packaging Solution for SiC Power Modules with a Fail-to-Short Capability
Ilyas Dchar
,
Cyril Buttay
,
Hervé Morel
Communication dans un congrès
hal-02076181v1
|
|
Design of a Low-Capacitance Planar Transformer for a 4 kW/500 kHz DAB Converter
Pierre Demumieux
,
Oriol Avino-Salvado
,
Cyril Buttay
,
Christian Martin
,
Fabien Sixdenier
Communication dans un congrès
hal-02076183v1
|
|
A 3D Folded Power Inductor with PCB based technology for applications in the kW range
Johan Le Lesle
,
Corentin Darbas
,
Florent Morel
,
Nicolas Degrenne
,
Rémy Caillaud
Communication dans un congrès
hal-02076182v1
|
|
An investigation of current distribution over four GaN HEMTs in parallel configurations
Thilini Wickramasinghe
,
Cyril Buttay
,
Christian Martin
,
Hervé Morel
,
Pascal Bevilacqua
Communication dans un congrès
hal-02405882v1
|
|
A Study on Shunt Resistor-based Current Measurements for Fast Switching GaN Devices
Thilini Wickramasinghe
,
Bruno Allard
,
Cyril Buttay
,
Charles Joubert
,
Christian Martin
Communication dans un congrès
hal-02405883v1
|
|
Die Interconnection for Power Module 3.0
Vincent Bley
,
Cyril Buttay
,
Denis Labrousse
,
Mickael Petit
,
Bojan Djuric
ECPE Workshop "Power Module 2.0", Oct 2019, Hambourg, Germany
Communication dans un congrès
hal-02405800v1
|
|
Study of convective condensation in a thermosiphon loop
Majed Eddine Moustaid
,
Vincent Platel
,
Cyril Buttay
14th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics (HEFAT 2019), Jul 2019, Wicklow, Ireland
Communication dans un congrès
hal-02417004v1
|
|
Design, manufacturing and characterization of printed circuit board embedded inductors for power applications
Rémy Caillaud
,
Cyril Buttay
,
Roberto Mrad
,
Johan Le Lesle
,
Florent Morel
Communication dans un congrès
hal-01736336v1
|
|
Application of the PCB-Embedding Technology in Power Electronics – State of the Art and Proposed Development
Cyril Buttay
,
Christian Martin
,
Florent Morel
,
Rémy Caillaud
,
Johan Le Leslé
Communication dans un congrès
hal-01844981v1
|
|
Design of a 1200 V, 100 kW Power Converter: How Good are the Design and Modelling Tools?
Thomas Lagier
,
Cyril Buttay
,
Piotr Dworakowski
,
Benhur Zolett
ECPE Workshop "The Future of Simulation in Power Electronics Packaging for Thermal and Stress Management", Nov 2018, Nuremberg, Germany
Communication dans un congrès
hal-01939745v1
|
|
Design of a 3kW power converter using PCB-embedding technology
Rémy Caillaud
,
Johan Le Lesle
,
Cyril Buttay
,
Florent Morel
,
Roberto Mrad
From Nano to Micro Power Electronics And Packaging Workshop (IMAPS), Nov 2018, Tours, France
Communication dans un congrès
hal-01935157v1
|
|
Design considerations for the 2-phase cooling system of a 5 MW MVDC converter
Majededdine Moustaid
,
Cyril Buttay
,
Vincent Platel
Troisième ATW Européen Micropackaging et management thermique, Jan 2018, La Rochelle, France
Communication dans un congrès
hal-01895892v1
|
|
A 100 kW 1.2 kV 20 kHz DC-DC converter prototype based on the Dual Active Bridge topology
Thomas Lagier
,
Laurent Chédot
,
François Wallart
,
Layal Ghossein
,
Bruno Lefebvre
Communication dans un congrès
hal-01747437v1
|
|
Procédé de microfabrication de transformateurs intégrés
Maxime Semard
,
Christian Martin
,
Cyril Buttay
,
Charles Joubert
Symposium de Génie Electrique (SGE'18), Université de Lorraine [UL], Jul 2018, Nancy, France
Communication dans un congrès
hal-01844983v1
|
|
Packaging with double-side cooling capability for SiC devices, based on silver sintering
Cyril Buttay
,
Raphaël Riva
,
Bruno Allard
,
Marie-Laure Locatelli
,
Vincent Bley
Communication dans un congrès
hal-01895805v1
|
|
High-Temperature Coplanar Transformer
Maxime Semard
,
Christian Martin
,
Cyril Buttay
,
Charles Joubert
Communication dans un congrès
hal-01736329v1
|
|
Packaging of 10 kV SiC MOSFETs: Trade-Off Between Electrical and Thermal Performances
Cyril Buttay
,
Hugo Reynes
International Forum on Wide Bandgap Semiconductors China (IFWS), Oct 2018, Shenzhen, China
Communication dans un congrès
hal-01895875v1
|
|
Characterization of Materials and their Interfaces in a DBC Substrate for Power Electronics Applications
Aymen Ben Kabaar
,
Cyril Buttay
,
Olivier Dezellus
,
Rafael Estevez
,
Anthony Gravouil
ECPE Workshop "Future of Simulation in Power Electronics Packaging for Thermal and Stress Management", Nov 2018, Nuremberg, Germany
Communication dans un congrès
hal-01935060v1
|
|
Optimisation of an Integrated Bidirectional Interleaved Single-Phase Power Factor Corrector
Johan Le Lesle
,
Rémy Caillaud
,
Florent Morel
,
Nicolas Degrenne
,
Cyril Buttay
PCIM Europe 2018, Jun 2018, Nuremberg, Germany
Communication dans un congrès
hal-01844988v1
|
|
Optimum Design of a Single-Phase Power Pulsating Buffer (PPB) with PCB-integrated Inductor Technologies
Johan Le Lesle
,
Rémy Caillaud
,
Cyril Buttay
,
Florent Morel
,
Nicolas Degrenne
Communication dans un congrès
hal-01736332v1
|
|
Protruding Ceramic Substrates for High Voltage Packaging Of Wide Bandgap Semiconductors
Hugo Reynes
,
Cyril Buttay
,
Hervé Morel
Communication dans un congrès
hal-01645029v1
|
|
Thermal Management Optimization of a 5 MW Power Electronic Converter
Hugo Reynes
,
Jose Maneiro
,
Cyril Buttay
,
Piotr Dworakowski
12th european advanced technology workshop on micropackaging and thermal management (iMaps), IMAPS, Feb 2017, La Rochelle, France
Communication dans un congrès
hal-01473614v1
|
|
Étude de la robustesse de l’oxyde de grille pour des applications aéronautiques
Oriol Aviño Salvado
,
Hervé Morel
,
Cyril Buttay
JCGE, May 2017, Arras, France. pp.146345
Communication dans un congrès
hal-01534712v1
|
|
Etat de l’art de l’intégration en électronique de puissance et axes de recherches associés
Vincent Bley
,
Cyril Buttay
,
Mickael Petit
ISP3D, Mar 2017, Toulouse, France
Communication dans un congrès
hal-01802078v1
|
|
Robustness of SiC MOSFET under avalanche conditions
Ilyas Dchar
,
Marion Zolkos
,
Cyril Buttay
,
Hervé Morel
Communication dans un congrès
hal-01535735v1
|
|
High power PCB-embedded inductors based on ferrite powder
Rémy Caillaud
,
Cyril Buttay
,
Johan Le Lesle
,
Florent Morel
,
Roberto Mrad
5th Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum (MiNaPAD 2017, IMAPS, May 2017, Grenoble, France
Communication dans un congrès
hal-01535727v1
|
|
Evaluation of printed-circuit boards materials for high temperature operation
Oriol Aviño Salvado
,
Wissam Sabbah
,
Cyril Buttay
,
Hervé Morel
,
Pascal Bevilacqua
HiTEN, IMAPS, Jul 2017, Cambridge, United Kingdom
Communication dans un congrès
hal-01565131v1
|
|
Comparison of planar and Toroidal PCB integrated inductors for a multi-cellular 3.3 kW PFC
Rémy Caillaud
,
Cyril Buttay
,
Roberto Mrad
,
Johan Le Lesle
,
Florent Morel
Communication dans un congrès
hal-01535721v1
|
|
Multi-objective optimisation of a bidirectional single-phase grid connected AC/DC converter (PFC) with two different modulation principles
Johan Le Lesle
,
Rémy Caillaud
,
Florent Morel
,
Nicolas Degrenne
,
Cyril Buttay
Communication dans un congrès
hal-01644174v1
|
|
Design of a SiC based triple active bridge ceil for a multi-megawatt DC-DC converter
Jose Maneiro
,
Roland Ryndzionek
,
Thomas Lagier
,
Piotr Dworakowski
,
Cyril Buttay
Communication dans un congrès
hal-01646807v1
|
|
Integrated High-Temperature Isolation barrier with Coreless Transformer
Rémi Perrin
,
Bruno Allard
,
Christian Martin
,
Cyril Buttay
9th CIPS, Mar 2016, Nuremberg, Germany
Communication dans un congrès
hal-01372145v1
|
|
Comparison of topside contact layouts for power dies embedded in PCB
Chenjiang Yu
,
Cyril Buttay
,
Eric Labouré
,
Vincent Bley
,
Céline Combettes
Communication dans un congrès
hal-01373042v1
|
|
2 MHz high-density integrated power supply for gate driver in high-temperature applications
Remi Perrin
,
Bruno Allard
,
Cyril Buttay
,
Nicolas Quentin
,
Wenli Zhang
Communication dans un congrès
hal-01372141v1
|
|
Utilisation d’un modèle CEM pour l’estimation des pertes dans un module de puissance
Anne-Sophie Podlejski
,
Arnaud Bréard
,
Christian Vollaire
,
Cyril Buttay
CEM, Jul 2016, Rennes, France
Communication dans un congrès
hal-02161822v1
|
|
GaN Active-Clamp Flyback Converter with Resonant Operation Over a Wide Input Voltage Range
Nicolas Quentin
,
Rémi Perrin
,
Christian Martin
,
Charles Joubert
,
Bertrand Lacombe
PCIM Europe 2016, May 2016, Nuremberg, Germany. pp.CD
Communication dans un congrès
hal-01387590v1
|
|
Analyse de la robustesse des MOSFET SiC pour les applications diode-less
Oriol Aviño Salvado
,
Cheng Chen
,
Cyril Buttay
,
Hervé Morel
,
Denis Labrousse
Symposium de Génie Electrique (SGE'16), Jun 2016, Grenoble, France
Communication dans un congrès
hal-01361711v1
|
|
Two Comparison-Alternative High Temperature PCB-Embedded Transformer Designs for a 2 W Gate Driver Power Supply
Bingyao Sun
,
Rolando Burgos
,
Dushan Boroyevich
,
Remi Perrin
,
Cyril Buttay
Communication dans un congrès
hal-01373036v1
|
|
EDT for Power Devices
Cyril Buttay
,
Chenjiang Yu
,
Eric Labouré
,
Vincent Bley
,
Céline Combettes
Embedded Device Technology: “Disappearing Die – Embed your Chips”, IMAPS - NMI, Sep 2016, Caldicot, United Kingdom
Communication dans un congrès
hal-01373062v1
|
|
Improving the thermal management of power GaN devices
Chenjiang Yu
,
Cyril Buttay
,
Eric Labouré
Advanced Technology Workshop (ATW) on Thermal Management, IMAPS, Sep 2016, Los Gatos, CA, United States
Communication dans un congrès
hal-01373027v1
|
|
Silver sintering for power electronics integration
Cyril Buttay
,
Bruno Allard
,
Raphaël Riva
Communication dans un congrès
hal-01196525v1
|
|
Thermal management of lateral GaN power devices
Chenjiang Yu
,
Éric Labouré
,
Cyril Buttay
Communication dans un congrès
hal-01196527v1
|
|
High temperature operation of SiC transistors
Cyril Buttay
,
Marwan Ali
,
Oriol Aviño Salvado
,
Hervé Morel
,
Bruno Allard
Advanced Technology Workshop (ATW) on Thermal Management, IMAPS, Sep 2015, Los Gatos, CA, United States
Communication dans un congrès
hal-01373030v1
|
|
Robustness of SiC MOSFETs in short-circuit mode
Cheng Chen
,
Denis Labrousse
,
Stéphane Lefebvre
,
Mickaël Petit
,
Cyril Buttay
PCIM Europe 2015, May 2015, Nuremberg, Germany
Communication dans un congrès
hal-01196528v1
|
|
Highly integrated power electronic converters using active devices embedded in printed-circuit board
Chenjiang Yu
,
Cyril Buttay
,
Eric Labouré
,
Vincent Bley
,
Céline Combettes
4th Micro/Nano-Electronics, packaging and assembling, design and manufacturing forum MiNaPAD 2015, IMAPS, Apr 2015, Grenoble, France
Communication dans un congrès
hal-01197043v1
|
|
Considerations for High Temperature Power Electronics
Bruno Allard
,
Cyril Buttay
,
Christian Martin
,
Hervé Morel
18th International Symposium on Power Electronics Ee2015, Oct 2015, Novi Sad, Serbia
Communication dans un congrès
hal-01372146v1
|
|
Layout modelling to predict compliance with EMC standards of power electronic converters
Anne-Sophie Podlejski
,
Arnaud Bréard
,
Cyril Buttay
,
Eliana Rondon
,
Florent Morel
Communication dans un congrès
hal-01188561v1
|
|
Study of short-circuit robustness of SiC MOSFETs, analysis of the failure modes and comparison with BJTs
Cheng Chen
,
Denis Labrousse
,
Stéphane Lefebvre
,
Mickael Petit
,
Cyril Buttay
ESREF, Oct 2015, Toulouse, France. pp.1708-1713
Communication dans un congrès
hal-01700463v1
|
|
Integrated packaging allows for improvement in switching characteristics of silicon carbide devices
Cyril Buttay
,
Khalil El Falahi
,
Rémi Robutel
,
Stanislas Hascoët
,
Christian Martin
PCIM Europe 2014, May 2014, Nuremberg, Germany. 8 p
Communication dans un congrès
hal-00997355v1
|
|
Design and Manufacturing of a Double-Side Cooled, SiC based, High Temperature Inverter Leg
Raphaël Riva
,
Cyril Buttay
,
Marie-Laure Locatelli
,
Vincent Bley
,
Bruno Allard
HiTEC 2014, May 2014, Albuquerque, United States. pp.THA27
Communication dans un congrès
hal-00997365v1
|
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Estimation des pertes dans les transistors bipolaires SiC
Cheng Chen
,
Denis Labrousse
,
Stéphane Lefebvre
,
Cyril Buttay
,
Hervé Morel
Symposium de Génie Electrique (SGE'14), Jul 2014, Cachan, France
Communication dans un congrès
hal-01065220v1
|
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3D Packaging Structure for High Temperature Power electronics
Raphaël Riva
,
Cyril Buttay
,
Rémi Perrin
,
Marie-Laure Locatelli
,
Vincent Bley
From Nano to Micro Power Electronics and Packaging Workshop, IMAPS France, Oct 2014, Tours, France
Communication dans un congrès
hal-01081697v1
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Planar, Double-Layer Magnetic Inductors for Low Power, High Frequency DC-DC Converters
Elias Haddad
,
Christian Martin
,
Charles Joubert
,
Bruno Allard
,
Cyril Buttay
8th CIPS, Feb 2014, Nuremberg, Germany. CD (5 p.)
Communication dans un congrès
hal-00739037v1
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Mesure précise des pertes dans un module d'électronique de puissance par une méthode calorimétrique
Anne-Sophie Podlejski
,
Cyril Buttay
,
Dominique Bergogne
,
Julien Morand
,
Christian Vollaire
Symposium de Génie Electrique (SGE'14), Jul 2014, Cachan, France
Communication dans un congrès
hal-01065267v1
|
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Power Loss Estimation in SiC Power BJTs
Chen Cheng
,
Denis Labrousse
,
Stéphane Lefebvre
,
Hervé Morel
,
Cyril Buttay
PCIM Europe 2014, May 2014, Nuremberg, Germany. 8 p
Communication dans un congrès
hal-00997718v1
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Realization and Characterization of an IGBT Module Based on the Power Chip-on-Chip 3D Concept
Jean-Louis Marchesini
,
Pierre-Olivier Jeannin
,
Yvan Avenas
,
Leonardo Ruffeil de Oliveira
,
Cyril Buttay
Communication dans un congrès
hal-01067144v1
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Predicting Static Losses in an Inverter-Leg built with SiC Normally-Off JFETs and SiC diodes
Xavier Fonteneau
,
Florent Morel
,
Cyril Buttay
,
Hervé Morel
,
Philippe Lahaye
Communication dans un congrès
hal-00829353v1
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High Temperature Operation of SiC Converters
Cyril Buttay
ECPE SiC and GaN user forum, May 2013, Munich, Germany
Communication dans un congrès
hal-00874751v1
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Analysis of the SiC VJFET gate punch-through and its dependence with the temperature
Fabien Dubois
,
Dominique Bergogne
,
Dominique Tournier
,
Cyril Buttay
,
Régis Meuret
Communication dans un congrès
hal-00874655v1
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Full densification of molybdenum powders and multilayer materials obtained by Spark Plasma Sintering
Bassem Mouawad
,
D. Fabregue
,
Cyril Buttay
,
Maher Soueidan
ISIEM 2013, Society of Inorganic Materials, Japan (SIMJ) et Université Rennes 1, France (UR1)., Oct 2013, Rennes, France
Communication dans un congrès
hal-01081684v1
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High Temperature, High Frequency Micro-Inductors for Low Power DC-DC Converters
Elias Haddad
,
Christian Martin
,
Cyril Buttay
,
Charles Joubert
,
Bruno Allard
Communication dans un congrès
hal-00874475v1
|
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High temperature, Smart Power Module for aircraft actuators
Khalil El Falahi
,
Stanislas Hascoët
,
Cyril Buttay
,
Pascal Bevilacqua
,
Luong Viet Phung
HiTEN'13, Jul 2013, Oxford, United Kingdom
Communication dans un congrès
hal-00874666v1
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Thermal stability of SiC JFETs in conduction mode
Rémy Ouaida
,
Cyril Buttay
,
Raphaël Riva
,
Dominique Bergogne
,
Christophe Raynaud
Communication dans un congrès
hal-00874471v1
|
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High Temperature Ageing of Fe-based Nanocrystalline Ribbons
Christian Martin
,
Rémi Robutel
,
Cyril Buttay
,
Fabien Sixdenier
,
Pascal Bevilacqua
HiTEC 2012, May 2012, Albuquerque, United States. 6p
Communication dans un congrès
hal-00760373v1
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Report de puce par frittage d'argent - mise en oeuvre et analyse
Amandine Masson
,
Wissam Sabbah
,
Raphaël Riva
,
Cyril Buttay
,
Stephane Azzopardi
14ème EPF, Jul 2012, Bordeaux, France. pp.CD (ref 61)
Communication dans un congrès
hal-00729156v1
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Sintered molybdenum for a metallized ceramic substrate packaging for the wide-bandgap devices and high temperature applications
Bassem Mouawad
,
Cyril Buttay
,
Maher Soueidan
,
Hervé Morel
,
Vincent Bley
Communication dans un congrès
hal-00707820v1
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Pressureless Silver Sintering Die-Attach for SiC Power Devices
Stanislas Hascoët
,
Cyril Buttay
,
Dominique Planson
,
Rodica Chiriac
,
Amandine Masson
CSCRM, Sep 2012, Saint-Pétersbourg, Russia. 2p
Communication dans un congrès
hal-00759987v2
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3-Dimensional, Solder-Free Interconnect Technology for high-Performance Power Modules
Bassem Mouawad
,
Cyril Buttay
,
Maher Soueidan
,
Hervé Morel
,
Bruno Allard
7th CIPS, Mar 2012, Nuremberg, Germany. pp.433-438
Communication dans un congrès
hal-00707741v1
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An Airborne High Temperature SiC Power Converter for Medium Power Smart Electro Mechanical Actuators
Dominique Bergogne
,
Fabien Dubois
,
Christian Martin
,
Khalil El Falahi
,
Luong Viet Phung
HiTEC 2012, May 2012, Albuquerque, United States. 6p
Communication dans un congrès
hal-00760366v1
|
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Evaluation of silver-sintering die attach
Wissam Sabbah
,
Raphaël Riva
,
Stanislas Hascoët
,
Cyril Buttay
,
Stephane Azzopardi
7th CIPS, Mar 2012, Nuremberg, Germany. pp.237-243
Communication dans un congrès
hal-00707733v1
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High temperature anti short circuit function for normally-on SiC JFET in an inverter leg configuration
Khalil El Falahi
,
Fabien Dubois
,
Dominique Bergogne
,
Luong Viet Phung
,
Cyril Buttay
HiTEC 2012, May 2012, Albuquerque, United States. 6p
Communication dans un congrès
hal-00760372v1
|
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Thermal Runaway Robustness of SiC VJFETs
Rémy Ouaida
,
Cyril Buttay
,
Anh Dung Hoang
,
Raphaël Riva
,
Dominique Bergogne
CSCRM, Sep 2012, Saint-Pétersbourg, Russia. 2p
Communication dans un congrès
hal-00759975v2
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Active protections for normally-on SiC JFETs
Fabien Dubois
,
Damien Risaletto
,
Dominique Bergogne
,
Hervé Morel
,
Cyril Buttay
EPE, Aug 2011, Birmingham, United Kingdom. pp.CD
Communication dans un congrès
hal-00629227v1
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Higher temperature power electronics for larger-scale mechatronic integration
Bruno Allard
,
Cyril Buttay
,
Dominique Tournier
,
Rémi Robutel
,
Jean-François Mogniotte
Automotive Power Electronics, Apr 2011, Paris, France. Actes sur CD (pas de pagination)
Communication dans un congrès
hal-00687139v1
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Modeling, Fabrication, and Characterization of Planar Inductors on YIG Substrates
Elias Haddad
,
Christian Martin
,
Charles Joubert
,
Bruno Allard
,
Maher Soueidan
CIMA, Mar 2011, Beyrouth, Lebanon. pp.Tu-P9
Communication dans un congrès
hal-00787193v1
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A multi-physics model of the VJFET with a lateral channel
Hervé Morel
,
Youness Hamieh
,
Dominique Tournier
,
Rémi Robutel
,
Fabien Dubois
EPE, Aug 2011, Birmingham, United Kingdom. pp.CD
Communication dans un congrès
hal-00629220v1
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High-temperature die-attaches for SiC power devices
Amandine Masson
,
Cyril Buttay
,
Hervé Morel
,
Christophe Raynaud
,
Stanislas Hascoët
EPE, Aug 2011, Birmingham, United Kingdom. pp.Article number 6020161
Communication dans un congrès
hal-00672602v1
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Thermal Requirements of SiC Power Devices
Cyril Buttay
,
Christophe Raynaud
,
Hervé Morel
,
Gabriel Civrac
,
Marie-Laure Locatelli
6th European Advanced Technology Workshop on Micropackaging and Thermal Management, Feb 2011, La Rochelle, France
Communication dans un congrès
hal-00672631v1
|
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Mechanical Study of Copper Bonded at Low Temperature Using Spark Plasma Sintering Process
Bassem Mouawad
,
Maher Soueidan
,
D. Fabregue
,
Cyril Buttay
,
Vincent Bley
CIMA, Mar 2011, Beyrouth, Lebanon. pp.CD
Communication dans un congrès
hal-00687147v2
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Elaboration of Architectured Materials by Spark Plasma Sintering
D. Fabregue
,
Bassem Mouawad
,
Cyril Buttay
,
Maher Soueidan
,
Aude Lamontagne
Communication dans un congrès
hal-00687142v1
|
|
High-temperature behavior of SiC power diodes
Cyril Buttay
,
Christophe Raynaud
,
Hervé Morel
,
Mihai Lazar
,
Gabriel Civrac
EPE, Aug 2011, Birmingham, United Kingdom. pp.CD
Communication dans un congrès
hal-00629225v1
|
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Die Attach of Power Devices Using Silver Sintering - Bonding Process Optimization and Characterization
Cyril Buttay
,
Amandine Masson
,
Jianfeng Li
,
Mark C. Johnson
,
Mihai Lazar
HiTEN 2011, Jul 2011, Oxford, United Kingdom. pp.1-7
Communication dans un congrès
hal-00672619v1
|
|
Caractérisation des non-linéarités dans les condensateurs céramiques haute température
Rémi Robutel
,
Christian Martin
,
Cyril Buttay
,
Hervé Morel
,
Régis Meuret
13ème EPF, Jun 2010, Saint-Nazaire, France
Communication dans un congrès
hal-00618657v1
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Design of High Temperature EMI Input Filter for a 2 kW HVDC-Fed Inverter
Rémi Robutel
,
Christian Martin
,
Hervé Morel
,
Cyril Buttay
,
Dominique Bergogne
HiTEC 2010, May 2010, Albuquerque, United States. pp.000236
Communication dans un congrès
hal-00485284v1
|
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Effect of High Temperature Ageing on Active and Passive Power Devices
Cyril Buttay
,
Rémi Robutel
,
Christian Martin
,
Christophe Raynaud
,
Siméon Dampieni
HiTEC 2010, May 2010, Albuquerque, United States. pp.000228
Communication dans un congrès
hal-00485273v1
|
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Electro-thermal behaviour of a SiC JFET stressed by lightning-induced overvoltages
Dominique Bergogne
,
Asif Hammoud
,
Dominique Tournier
,
Cyril Buttay
,
Youness Amieh
EPE, Sep 2009, Barcelone, France. pp.1--8
Communication dans un congrès
hal-00446059v1
|
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State of the art of High Temperature Power Electronics
Cyril Buttay
,
Dominique Planson
,
Bruno Allard
,
Dominique Bergogne
,
Pascal Bevilacqua
Microtherm, Jun 2009, Lodz, Poland. pp.8-17
Communication dans un congrès
hal-00413349v1
|
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Paralleling of Low-Voltage MOSFETs Operating in Avalanche Conditions
Cyril Buttay
,
Olivier Brevet
,
Bruno Allard
,
Dominique Bergogne
,
Hervé Morel
Communication dans un congrès
hal-00138894v1
|
|
Bond Graph Modeling of Current Diffusion in Magnetic Cores
Hervé Morel
,
Bruno Allard
,
Sabrine M'Rad
,
Cyril Buttay
,
Kaiçar Ammous
ICBGM, Jan 2005, New Orleans, LA, United States. pp 87-91
Communication dans un congrès
hal-00412621v1
|
|
A Voltage-Measurement Based Estimator for Current and Temperature in MOSFET H-Bridge
Cyril Buttay
,
Dominique Bergogne
,
Hervé Morel
,
Bruno Allard
,
René Ehlinger
EPE, Sep 2003, Toulouse, France. pp.1-10
Communication dans un congrès
hal-00413309v1
|
|
Towards a Sensorless Current and Temperature Monitoring in MOSFET-Based H-Bridge
Cyril Buttay
,
Dominique Bergogne
,
Hervé Morel
,
Bruno Allard
,
René Ehlinger
Communication dans un congrès
hal-00413325v1
|