Remi Dussart
247
Documents
Présentation
Publications et communications
Publications
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Optical emission spectroscopy spatial characterization of a silicon based Micro Hollow Cathode Discharge operating in Helium in DC regime76th Annual Gaseous Electronics Conference, Oct 2023, Ann Arbor, United States
Communication dans un congrès
hal-04134203v1
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Advances in optical diagnostics of Microplasmas: imaging and spectroscopyInternational Workshop on Microplasmas (IWM 11), Jun 2022, Raleigh, United States
Communication dans un congrès
hal-03633854v1
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Atmospheric Plasma DC Source in the Micro Scale Elaborated by Micro-NanotechnologiesXXV Europhysics Conference on Atomic and Molecular Physics of Ionized Gases (ESCAMPIG XXII), Jul 2022, Paris, France
Communication dans un congrès
hal-03049315v1
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Fabrication process and first charactesisation of novel silicon-based microplasma reactorsInternational Workshop on Microplasmas (IWM 11), Jun 2022, Raleigh, United States
Communication dans un congrès
hal-03698719v1
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Physical mechanisms involved in silicon based plasma microreactors operating in DC5th Asia Pacific Conference on Plasma Physics (AAPPS-DPP2021), Association of Asia-Pacific Physical Societies and Division of Plasma Physics, Sep 2021, online - Kyushu University, Japan
Communication dans un congrès
hal-03355293v1
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Atomic Layer Etching of Gallium Nitride (GaN) using fluorinated chemistry42nd International Symposium on Dry Process, Nov 2021, Online, Japan
Communication dans un congrès
hal-03539418v1
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Recent advances in micro-discharges ‒ sources and diagnosticsMGK Colloquium - Transient Atmospheric Plasmas: from plasmas to liquids to solids, Apr 2021, Bochum, Germany
Communication dans un congrès
hal-03218025v1
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SiOxFy layer deposition for cryogenic nanoscale etchingPLATHINIUM (Plasma Thin film International Union Meeting) 2021, Sep 2021, Antibes, France
Communication dans un congrès
hal-03539368v1
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Plasma cryogenic etching : benefits of cooling the substrate at a low temperature in etching process technologies42nd International Symposium on Dry Process, Nov 2021, Online, Japan
Communication dans un congrès
hal-03539474v1
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Atomic layer etching of Gallium Nitride (GaN) using SF6 and Ar plasmasPLATHINIUM (Plasma Thin film International Union Meeting) 2021, Sep 2021, Antibes, France
Communication dans un congrès
hal-03539383v1
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Resonance Broadening as a Valuable Diagnostic to Study Atmospheric Pressure Plasma \textendash ~Application to Micro-Plasmas9th International Workshop and Summer School on Plasma Spectroscopy (IPS 2020), Jun 2020, Greifswald, Germany
Communication dans un congrès
hal-03049314v1
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Études Spectroscopiques Aux Petites Échelles de Décharges à Haute Pression~: Intérêt Des Transitions RésonantesEcole Technologique Du Reseau Des Plasmas Froids, Sep 2020, Saint-Dié-des-Voges, France
Communication dans un congrès
hal-03049312v1
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Resonance broadening as a valuable diagnostic to study atmospheric pressure plasma – application to micro-plasmas9th International Workshop and Summer School on Plasma Spectroscopy (IPS 2020), Jun 2020, Greifswald, Germany
Communication dans un congrès
hal-03374037v1
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Atomic Layer Etching at cryogenic temperaturePlasma Thin Film International Union Meeting, Sep 2019, Antibes, France
Communication dans un congrès
hal-02311323v1
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Plasma processes applied to SiO2 cryo-atomic layer etchingXXXIV International Conference on Phenomena in Ionized Gases - 10th International Conference on Reactive Plasmas, Jul 2019, Sapporo, Japan
Communication dans un congrès
hal-02311288v1
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Intérêt des transitions résonnantes en spectroscopie pour les plasmas froids atmosphériques: diagnostic des ondes d’ionisations et de micro-cavités25e Congrès Général de la Société Française de Physique, Jul 2019, Nantes, France
Communication dans un congrès
hal-02189144v1
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Intérêt des transitions résonnantes en spectroscopie pour les plasmas froids à haute pression: diagnostic des ondes d’ionisations et de micro-cavités1e Rencontres Scientifiques Plasmas Froids et Lasers, Nov 2019, Toulouse, France
Communication dans un congrès
hal-02189173v1
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Atomic Layer Etching at low substrate temperature19th International Conference on Atomic Layer Deposition - 6th International Atomic Layer Etching Workshop, Jul 2019, Seattle, United States
Communication dans un congrès
hal-02311308v1
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Cryogenic process for Atomic Layer EtchingPlasma Etch and Strip in Microtechnology, May 2019, Grenoble, France
Communication dans un congrès
hal-02311291v1
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Low-k material cryoetch using high boiling point organic compounds to reduce plasma induced damage40th International Symposium on Dry Process, Nov 2018, Nagoya, France
Communication dans un congrès
hal-02311275v1
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Bulk micromachined Titanium MEMS16th NAMIS Workshop (NAMIS 2018), Jun 2018, Oulu, Finland
Communication dans un congrès
hal-02306373v1
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Étude par spectroscopie d'émission de la température du gaz à l'intérieur et au voisinage d'une micro-cavité plasma (MHCD)14e Journées du Réseau Plasmas Froids, Oct 2018, La Rochelle, France
Communication dans un congrès
hal-01974867v1
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Vectorial Electric Field Characterization Of Plasmas Using An Optical Probe71st Annual Gaseous Electronics Conference, Nov 2018, Portland, United States
Communication dans un congrès
hal-02018204v1
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The role of SiF4 physisorption in the cryogenic etching process of silicon40th International Symposium on Dry Process, Nov 2018, Nagoya, Japan
Communication dans un congrès
hal-02311267v1
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Electro-optical probe for dielectric barrier discharge analysis45th IEEE International Conference on Plasma Science (ICOPS 2018), Jun 2018, Denver, United States
Communication dans un congrès
hal-02017951v1
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Cryo-etching mechanism characterization by in-situ spectroscopic ellipsometrySurface Fest 2018, Jun 2018, Bordeaux, France
Communication dans un congrès
hal-02311254v1
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Titanium-based MEMS: Application for a novel implantable feedthrough using TTV (Through Titanium Vias) technologies6th Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum (MiNaPAD 2018), May 2018, Grenoble, France
Communication dans un congrès
hal-02306370v1
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Plasma properties of DC silicon based micro hollow cavity discharge (MHCD) operating in various gases - a spectroscopic study71st Annual Gaseous Electronics Conference, Nov 2018, Portland, United States
Communication dans un congrès
hal-02131687v1
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Microdischarge integration on silicon based devices70th Gaseous Electronics Conference, Nov 2017, Pittsburgh, United States
Communication dans un congrès
hal-01686038v1
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CRYOGENIC ETCHING APPLIED TO THE REALIZATION OF HIGH DENSITY CAPACITOR WITH A HOMOPOLYMER MASKInternational Conference on Plasma Processes 2017 (CIP2017), Jun 2017, Nice, France
Communication dans un congrès
hal-01561252v1
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Microstructuration of titanium for implantable componentsJournées Nationales sur les Technologies Emergentes en micro-nanofabrication, Nov 2017, Orléans, France
Communication dans un congrès
hal-02306063v1
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Effects of gas and surface temperatures during cryogenic etching of silicon with SF6/O269th Gaseous Electronic Conference, Oct 2016, Bochum, France
Communication dans un congrès
hal-01379701v1
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Cryoetching mechanisms and STiGer process evaluationInternational Symposium on Dry Process 2016 (DPS 2016), Nov 2016, Sapporo, Japan
Communication dans un congrès
hal-01561210v1
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Cryogenic processes for advanced material plasma etchingQuo vadis : Complex plasmas - TR 24, Aug 2016, Hambourg, Germany
Communication dans un congrès
hal-01374747v1
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Numerical and experimental investigation of cryogenic etching of silicon and porous low-dielectricInternational Symposium on Dry Process 2016 (DPS2016), Nov 2016, Sapporo, Japan
Communication dans un congrès
hal-01561212v1
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Enhanced lifetime for thin-dielectric microdischarge-arrays operating in DC69th Gaseous Electronic Conference, Oct 2016, Bochum, Germany
Communication dans un congrès
hal-01379698v1
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Low-Damage etching of highly porous OSG low-k dielectricsSPIE Advanced Lithography 2016, Feb 2016, San José, United States
Communication dans un congrès
hal-01280267v1
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Ignition phase of a silicon-based microdischarge array with excitation by burst waveformsInternational workshop on microplasmas, May 2015, Newark, United States
Communication dans un congrès
hal-01166021v1
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Cryogenic Etching of Silicon with SF6/O2/SiF4 plasmas: a modeling and experimental studyPlasma Etch and Strip in Microtechnology, Apr 2015, Leuven, Belgium
Communication dans un congrès
hal-01151530v1
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Reduction of plasma induced damage in cryogenic etching of low-k materials4th French Symposium on Emerging Technologies for micro-nanofabrication, Nov 2015, Ecully, France
Communication dans un congrès
hal-01277115v1
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Limitation of surface defects in deep GaN etchingAVS 62nd International Symposium & Exhibition, Oct 2015, San Jose, United States
Communication dans un congrès
hal-01228462v1
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Low damage cryoetching of low-K materialsSPIE Advanced Lithography 2015, Feb 2015, San José, United States
Communication dans un congrès
hal-01151543v1
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A novel low temperature etch approach to reduce ULK plasma damagePlasma Etch and Strip in Microtecnology, Apr 2015, Leuven, Belgium
Communication dans un congrès
hal-01151524v1
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DC and AC microplasmas on silicon : performances and limitationsAsian-European Plasma Surface Engineering, Masaru Hori, Sep 2015, Jeju, South Korea
Communication dans un congrès
hal-01217651v1
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Cryoetching processes applied to ULK material37th International Symposium on Dry process , Nov 2015, Awaji, Japan
Communication dans un congrès
hal-01287233v1
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Cryoetching processes applied to ULK material37th International Symposium on Dry Process (DPS 2015), Nov 2015, Awaji Island, Japan
Communication dans un congrès
hal-01228477v1
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Cryogenic etching of silicon with SF6/O2/SiF4 plasmas: a modelling and experimental study22nd International Symposium on Plasma Chemistry (ISPC 2015), Jul 2015, Antwerp, Belgium
Communication dans un congrès
hal-01228451v1
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Reduction of plasma induced damage of porous low-k materials using a cryogenic etching process22nd International Symposium on Plasma Chemistry (ISPC 2015), Jul 2015, Antwerp, Belgium
Communication dans un congrès
hal-01228448v1
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Energy flux diagnostics in thin film deposition by magnetron sputteringXXXII International Conference on Phenomena in Ionized Gases (ICPIG), Jul 2015, Iasi, Romania
Communication dans un congrès
hal-01290726v1
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Surface state improvement in GaN deep etching for power electronics applications37th International Symposium on Dry Process (DPS 2015), Nov 2015, Awaji Island, Japan
Communication dans un congrès
hal-01228470v1
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Plasma Cryogenic Etching: from 3D Integration to Low-k MaterialsChina Semiconductor Technology International Conference, Mar 2015, Shanghai, China
Communication dans un congrès
hal-01151533v1
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Cryogenic Etching of Porous Organosilicate Low-k Materials: Fluorine based plasma analysisPlasma Etch and Strip in Microtechnology, Apr 2015, Leuven, Belgium
Communication dans un congrès
hal-01151528v1
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Submicronic etched features of silicon with high aspect ratio obtained by cryogenic plasma deep-etching through perforated polymer thin films2015 MRS Spring Meeting & Exhibit, Apr 2015, San francisco, United States
Communication dans un congrès
hal-01151542v1
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Performances and limitations of DC microdischarges on silicon platforms20th International Colloquium on Plasma Processes (CIP), Jun 2015, Saint-Etienne, France
Communication dans un congrès
hal-01166022v1
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DRY DEEP ETCHING OF BULK TITANIUM BY PLASMA PROCESSESAVS 62nd International Symposium & Exhibition, Oct 2015, San Jose, United States
Communication dans un congrès
hal-01228465v1
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Cryogenic etching of porous organosilicate low-k materials: Reduction of plasma induced damageAVS 62nd International Symposium & Exhibition, Oct 2015, San Jose, United States
Communication dans un congrès
hal-01228458v1
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Performances and instabilities of silicon based microdischargesInternational workshop on microplasmas, May 2015, Newark, United States
Communication dans un congrès
hal-01166019v1
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Bulk titanium deep etching by plasma processes, 20th International Colloquium on Plasma Processes (CIP), Jun 2015, Saint-Etienne, France
Communication dans un congrès
hal-01166023v1
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Cryoetching of Silicon and Advanced Materials for 3D Interconnects226th meeting of the Electroschemical Society, Oct 2014, Cancun, Mexico
Communication dans un congrès
hal-01151844v1
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Cryogenic etching of submicronic features in silicon using masks based on porous polymer films226th meeting of the Electrochemical Society, Oct 2014, Cancun, Mexico
Communication dans un congrès
hal-01151839v1
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Improvement of GaN Deep Etched Surface State by Fluorination Dedicated to Power Devices226th meeting of the Electrochemical Society, Oct 2014, Cancun, Mexico
Communication dans un congrès
hal-01151851v1
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Study of energy transfers at the substrate during “transition steps” in magnetron sputter deposition14th International Conference on Plasma Surface Engineering PSE 2014 , Sep 2014, Garmisch-Partenkirchen, Germany
Communication dans un congrès
hal-01289446v1
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Spectroscopic investigations of transient processes in micro-cavity discharge reactorsInternational Symposium on Non-equilibrium Plasmas and Complex Systems, Feb 2014, Osaka, Japan
Communication dans un congrès
hal-01006368v1
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Multiscale etching of holes by cryogenic silicon etchingPlasma Etch and Strip in Microtechnology, May 2014, Gernoble, France
Communication dans un congrès
hal-01057242v1
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Low damage cryogenic etching of low-K materials for advanced interconnectsMaterials for Advanced Metallization, Mar 2014, Dresden, Germany
Communication dans un congrès
hal-01006369v1
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Submicrometric structured silicon surfaces obtained from polymer blend film by silica replication and cryogenic plasma etchingPlasma Etch and Strip in Microtechnology, May 2014, Grenoble, France
Communication dans un congrès
hal-01057586v1
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Effect of surface fluorination on GaN deep dry etching defectsPlasma Etch and Strip in Microtechnology, May 2014, Grenoble, France
Communication dans un congrès
hal-01057239v1
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Plasma cryoetching processes for silicon and advanced materialsInternational Conference on Microelectronics and Plasma Technology, Jul 2014, Gunsan, South Korea
Communication dans un congrès
hal-01057585v1
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Reproducible process for titanium deep etching19th International Vacuum Conference, Sep 2013, Paris, France
Communication dans un congrès
hal-01057233v1
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Reproducible process for Titanium deep etchingPlasma Etch and Strip in Microtechnology, Mar 2013, Louvain, Belgium
Communication dans un congrès
hal-00831358v1
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Deep etching processes for silicon micro- and nano-machiningLe Studium workshop : Bottom-up approaches to nanotechnology, May 2013, Orléans, France
Communication dans un congrès
hal-00831360v1
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Radio Frequency Diagnostics of MicroplasmasFrontiers in Low Temperature Plasma Diagnostics, Apr 2013, Kerkrade, Netherlands
Communication dans un congrès
hal-00831368v1
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RF diagnostics performed on DC Microplasmas19th International Vacuum Conference, Sep 2013, Paris, France
Communication dans un congrès
hal-01056614v1
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Applications of cryogenic plasma etching for microtechnology and advanced CMOS manufacturingPlasma Etch and Strip in Microtechnology, Mar 2013, Louvain, Belgium
Communication dans un congrès
hal-00831344v1
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Plasma surface interactions in deep dry etchingWorkshop on particle - surface interactions : from surface analysis to materials processing, Jun 2013, Luxembourg, Luxembourg
Communication dans un congrès
hal-00831337v1
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Spectroscopic Diagnostics of Ceramic MHCDsInternational Workshop on Microplasmas, May 2013, Pékin, China
Communication dans un congrès
hal-00831354v1
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Dry deep etching of GaN wide band-gap SemiconductorAVS 60th International Symposium & Exhibition, Oct 2013, Long Beach, United States
Communication dans un congrès
hal-01057235v1
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Dry deep etching of GaN wide-bandgap semiconductor19th International Vacuum Conference, Sep 2013, Paris, France
Communication dans un congrès
hal-01056606v1
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Energy flux measurements at the substrate deposition during reactive and non-reactive magnetron sputter deposition processes19th International Vacuum Conference, Sep 2013, Paris, France
Communication dans un congrès
hal-01166024v1
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On Causes of the Destruction of MHCD Sources During OperationInternational Workshop on Microplasmas, May 2013, Pékin, China
Communication dans un congrès
hal-00831363v1
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RF Diagnostics of MicroplasmasInternational Workshop on Microplasmas, May 2013, Pékin, China
Communication dans un congrès
hal-00831362v1
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Deep etching of gallium nitride by chlorine based plasmaJournées Nationales des Technologies Emergentes, May 2013, Evian, France
Communication dans un congrès
hal-00831346v1
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Integrated microplasmas on silicon: performances and limitations19th International Vacuum Conference, Sep 2013, Paris, France
Communication dans un congrès
hal-01056618v1
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Plasma deep etching of silicon, titanium and gallium nitride for microtechnologyAVS 60th International Symposium & Exhibition, Oct 2013, United States
Communication dans un congrès
hal-01006364v1
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Titanium deep etching for medical applicationsAVS 60th International Symposium & Exhibition, Oct 2013, Long Beach, United States
Communication dans un congrès
hal-01057236v1
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Damage Free Cryogenic Etching of Ultra Low-k MaterialsInternational Interconnect Technology Conference, Jun 2013, Kyoto, Japan
Communication dans un congrès
hal-01056603v1
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Investigations in SF6 and Cl2/Ar plasmas used for titanium deep etching by means of mass spectrometryESCAMPIG 2012, Jul 2012, Viana do Castelo, Portugal
Communication dans un congrès
hal-00831352v1
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Optimization of STiGer process used to etch high aspect ratio silicon microstructuresAVS 59th International Symposium and Exhibition, Oct 2012, Tampa, United States
Communication dans un congrès
hal-00747743v1
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Advantages of energy influx measurements in low pressure plasma processesInternational Conference on Plasma Surface Engineering, Sep 2012, Garmisch-Partenkirchen, Germany
Communication dans un congrès
hal-00831371v1
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Deep GaN Etching : Role of SiCl4 in Plasma ChemistryAVS 59th International Symposium and Exhibition, Oct 2012, Tampa, United States
Communication dans un congrès
hal-00747746v1
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Development and limitations of microplasma arrays on silicon operating in DCAVS 59th International Symposium and Exhibition, Oct 2012, United States
Communication dans un congrès
hal-00747741v1
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Damage free cryogenic etching of porous organosilicate low-k films for advanced interconnect applicationAVS 59th International Symposium and Exhibition, Oct 2012, Tampa, United States
Communication dans un congrès
hal-00747749v1
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Development of microdicharges in silicon operating in DC for medical applications4th International Conference on Plasma Medecine, Jun 2012, Orléans, France
Communication dans un congrès
hal-00831349v1
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Development and characterization of microplasma arrays on SiliconInternational Workshop on Physics of Microplasmas, May 2012, Bochum, Germany
Communication dans un congrès
hal-00707932v1
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Balanced/unbalanced planar magnetron plasma behaviour. Microscopic analysis by PIC-MCC modelling of the ion flux on thermal probes13th International Conference on Plasma Surface Engineering PSE 2012, Sep 2012, Garmisch-Partenkirchen, Germany
Communication dans un congrès
hal-01288936v1
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Integrated microplasmas on silicon: a new tool for lab-on-a-chip applicationsCancer Cells On Chip, Jun 2012, Lyon, France
Communication dans un congrès
hal-00707933v1
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Formation of black silicon by cryogenic plasma etching processesMicro- and Nano-Engineering (MNE), Sep 2012, Toulouse, France
Communication dans un congrès
hal-00831357v1
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Caractérisation de matrices de micro plasmas sur siliciumXIIeme congrès de la division Plasmas de la Société Française de Physique, May 2012, Orléans, France
Communication dans un congrès
hal-00707935v1
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Development of microdicharge arrays in silicon operating in DC and ACEuropean Physical Society/International Conference on Plasma Physics, Jul 2012, Stockholm, Sweden
Communication dans un congrès
hal-00831351v1
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Characterisation of Silicon based micro discharge plasma arrays in Direct Current (DC) at atmospheric pressure6th International Workshop on Microplasmas, Apr 2011, Paris, France
Communication dans un congrès
hal-00707925v1
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Energy influx measurements in low pressure plasmas for material processingInnovations in Thin Film Processing and Characterisation, and Magnetron, Ion Processing and Arc Technologies European Conference, ITFPC-MIATEC 2011 , Nov 2011, Nancy, France
Communication dans un congrès
hal-01289043v1
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Deep GaN Etching by Inductively Coupled PlasmaHeteroSiC-WASMPE 2011, Jun 2011, Tours, France
Communication dans un congrès
hal-00696418v1
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Obtaining a smooth surface after deep GaN etching18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès
hal-00696419v1
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Characterization of the ignition and the extinction of a Micro Hollow Cathode Discharge6th International Workshop on Microplasmas, Apr 2011, Paris, France
Communication dans un congrès
hal-00707924v1
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Deep Gallium Nitride Etching: ways to avoid etching defects3rd International Symposium on Advanced Plasma Science and its Applications for Nitrides and Nanomaterials, Mar 2011, Nagoya, Japan
Communication dans un congrès
hal-00696396v1
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Microcathode sustained discharges using Si integrated micro-discharges arrays6th International Workshop on Microplasmas, Apr 2011, France, France
Communication dans un congrès
hal-00707926v1
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Microcathode sustained discharges using Si integrated micro-reactors18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès
hal-00707929v1
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STiGer process for silicon deep etching: extended scalloping reduction on submicron trenches18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès
hal-00696422v1
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Deep etching of bulk titanium by plasma18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès
hal-00696425v1
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Deep silicon etching of 0.8 µm to hundreds of microns wide trenches with the STiGer processAVS 58th International Symposium & Exhibition, Oct 2011, Nashville, United States
Communication dans un congrès
hal-00696428v1
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Direct energy influx measurements in high power impulse sputtering2nd International Conference on HiPIMS, HiPIMS2011 , Jun 2011, Braunschweig, Germany
Communication dans un congrès
hal-01288780v1
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Micro plasma reactor arrays made in silicon18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès
hal-00707927v1
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Direct energy influx measurements between a biased substrate and a low pressure plasma18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès
hal-00707930v1
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Study of an MHCD operating in He using optical and electrical diagnosticsDiagnostics Microplasmas, Mar 2010, Germany
Communication dans un congrès
hal-00487365v1
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Gravure du GaN pour la prochaine génération de diodes SchottkyWorkshop MNTS 12-20, Minatec, Mar 2010, Grenoble, France
Communication dans un congrès
hal-00487358v1
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Ignition and extinction of a Micro Hollow Cathode Discharge operating in DC regimeAVS 57th International Symposium & Exhibition, Nov 2010, Albuquerque, United States
Communication dans un congrès
hal-00696390v1
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Comparaison d'une sonde calorimétrique et d'un capteur à thermopile pour la mesure des transferts d'énergie plasma basse pression/surface'Congrès Français de Thermique, May 2010, Le Touquet, France. pp.755-760
Communication dans un congrès
hal-00504417v1
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Micro-discharge plasma using silicon platformAVS 57th International Symposium & Exhibition, Oct 2010, Albuquerque, United States
Communication dans un congrès
hal-00707922v1
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Les Microdécharges en FranceJournées Plasma Québec du Réseau Plasma Froid, Jun 2010, France
Communication dans un congrès
hal-00503123v1
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Deep Gallium Nitride Etching63rd Gaseous Electronics Conference, Oct 2010, Paris, France
Communication dans un congrès
hal-00696376v1
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Silicon deep cryoetching with the STiGer process3RD WORKSHOP ON PLASMA ETCH AND STRIP IN MICROELECTRONICS, Mar 2010, France
Communication dans un congrès
hal-00487360v1
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Optimization of STiGer process for silicon deep etching63rd Gaseous Electronics Conference, Oct 2010, Paris, France
Communication dans un congrès
hal-00696366v1
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Deep Inductively Coupled Plasma Etching of GaNAVS 57th International Symposium & Exhibition, Nov 2010, Albuquerque, United States
Communication dans un congrès
hal-00696393v1
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Micro Hollow Cathode Discharge Arrays in silicon devices63rd Gaseous Electronics Conference, Oct 2010, Paris, France
Communication dans un congrès
hal-00681902v1
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Deep GaN Etching by Inductively Coupled Plasma3RD WORKSHOP ON PLASMA ETCH AND STRIP IN MICROELECTRONICS, Mar 2010, France
Communication dans un congrès
hal-00487363v1
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RF Diagnostics of Atmospheric Pressure Micro-PlasmasDiagnostics Microplasmas, Mar 2010, Germany
Communication dans un congrès
hal-00487366v1
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STiGer cryoetching process on silicon : results on performances for 0.8 um trenches17th International Colloquium on Plasma Processes, Jun 2009, Marseille, France
Communication dans un congrès
hal-00444466v1
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Electrical Characterization of Direct Current Atmospheric Pressure Micro-Discharges Using Radio Frequency Signals in Argon62nd Gaseous Electronics Conference, Oct 2009, Saratoga Springs, United States
Communication dans un congrès
hal-00444482v1
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Direct measurement of energy transfers during deposition of sputtered metal atoms17th International Colloquium on Plasma Processes, CIP 09, Jun 2009, Marseille, France
Communication dans un congrès
hal-00445581v1
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Formation of Columnar MicroStructures of silicon (CMS) in SF6/O2 plasma in cryogenic conditions17th International Colloquium on Plasma Processes, Jun 2009, Marseille, France
Communication dans un congrès
hal-00444402v1
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Ignition and characterization of Micro Hollow Cathode Discharges in Helium17th International Colloquium on Plasma Processes, Jun 2009, Marseille, France
Communication dans un congrès
hal-00444380v1
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Inductively Coupled Plasma Etching of GaN and Induced DefectsAVS 56th International Symposium & Exhibition, Nov 2009, San Jose, United States
Communication dans un congrès
hal-00444488v1
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A comparative study on O2 and SO2 passivating chemistry for silicon deep cryogenic etchingAVS 53rd International Symposium & Exhibition, Nov 2009, San Francisco, United States
Communication dans un congrès
hal-00442683v1
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GaN Etching by Inductively Coupled Plasma17th International Colloquium on Plasma Processes, Jun 2009, Marseille, France
Communication dans un congrès
hal-00444471v1
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Experiment and simulation results of limited cathode area MHCDs operating in HeAVS 56th International Symposium & Exhibition, Nov 2009, San Jose, United States
Communication dans un congrès
hal-00444491v1
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STiGer cryoetching process of silicon: passivation mechanisms, enhanced robustness and performancesPlasma Etch and Strip in Microelectronics 2nd International Workshop, Feb 2009, Louvain, Belgium
Communication dans un congrès
hal-00444370v1
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New Approach of Heat Transfer Characterization on Thin Si and Cu Solids.-Effects of Thermal Contact Resistance5th European Thermal-Sciences Conference, Eutrotherm 2008, May 2008, Netherlands. pp.101-106
Communication dans un congrès
hal-00443101v1
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Study of SiOxFy passivation layer deposited in SiF4/O2 ICP dischargeAVS 55th International Symposium & Exhibition, Oct 2008, Boston, United States
Communication dans un congrès
hal-00444361v1
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A direct measurement of the energy flux density in plasma surface interaction61st Gaseous Electronics Conference, 2008, United States
Communication dans un congrès
hal-00448760v1
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Micro transfert d'énergie dans un solide mince : effet de la résistance thermique de contactCongrès Français de Thermique, SFT 2008, Jun 2008, Toulouse, France. pp.385-390
Communication dans un congrès
hal-00443715v1
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Ignition of parallel Micro Hollow Cathode Discharges in He without ballasts61st Gaseous Electronics Conference, Oct 2008, Dallas, United States
Communication dans un congrès
hal-00444346v1
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Direct measurements of the energy transfers in deposition or etching low pressure plasma processes11th International Conference on Plasma Surface Engineering, PSE2008, Sep 2008, Garmisch-Partenkirchen, Germany
Communication dans un congrès
hal-00445589v1
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Cryoetching of silicon for MEMS and microelectronic components16th International Colloquium on Plasma Processes, Jun 2007, France
Communication dans un congrès
hal-00442662v1
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Direct current parallel microdischarges in heliumISPC-18, Aug 2007, Kyoto, Japan
Communication dans un congrès
hal-01303260v2
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A robust passivation-enhanced cryogenic process used for deep silicon etchingAVS 54th International Symposium & Exhibition, Oct 2007, Seattle, United States
Communication dans un congrès
hal-00444264v1
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Submicronic Etching in the Cryogenic Process16th International Colloquium on Plasma Processes, Jun 2007, Toulouse, France
Communication dans un congrès
hal-00442684v1
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A study on SF6/SiCl4 inductively coupled plasma by mass spectrometry and optical emission spectroscopy16th International Colloquium on Plasma Processes, Jun 2007, France
Communication dans un congrès
hal-00444208v1
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Global evaluation of the energy transfer between an ICP argon plasma and a surfaceInternatinal Symposium on Plasma Chemistry, ISPC-18, Aug 2007, Kyoto, Japan. 28p-5
Communication dans un congrès
hal-00443518v1
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Control of the ignition of direct current parallel microdischarges in helium16th International Colloquium on Plasma Processes, Jun 2007, France
Communication dans un congrès
hal-00442687v1
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A new generation of cryogenic processes for silicon deep etching60th Gaseous Electronics Conference, Oct 2007, Arlington, United States
Communication dans un congrès
hal-00442668v1
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A new generation of cryogenic processes for silicon deep etching60th Gaseous Electronics Conference, Oct 2007, Arlington, United States
Communication dans un congrès
hal-00365911v1
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SiOxFy film deposited by SiF4/O2 plasma on silicon at low temperature16th International Colloquium on Plasma Processes, Jun 2007, Toulouse, France
Communication dans un congrès
hal-00444198v1
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Neutral production in SF6/SiCl4 inductively coupled plasmas60th Gaseous Electronics Conference, Oct 2007, Arlington, United States
Communication dans un congrès
hal-00444252v1
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Fabrication process and electrical characterization of direct current parallel microdischarges in helium60th Gaseous Electronics Conference, Oct 2007, Arlington, United States
Communication dans un congrès
hal-00444259v1
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Direct current parallel microdischarges in heliumInternational Symposium on Plasma Chemistry, Aug 2007, Kyoto, Japan. pp.27A-a3
Communication dans un congrès
hal-00444228v1
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SiOxFy film growth in SiF4/O2 plasma at cryogenic temperature18th International Symposium on Plasma Chemistry, Aug 2007, Kyoto, Japan. pp.30P-105
Communication dans un congrès
hal-00444241v1
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Enhanced robustness of the cryogenic process for silicon deep etchingMicro- and Nano-Engineering, Sep 2007, Copenhague, Denmark
Communication dans un congrès
hal-00444248v1
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Limitation of the cathode area for direct current MHCD in Helium4th International Workshop on Microplasmas, Oct 2007, Tainan, Taiwan
Communication dans un congrès
hal-00444267v1
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SiOxFy passivation layer characterization in the silicon cryoetchingEighth International Conference on Advanced Surface Engineering (8th ICASE), Apr 2006, Japan
Communication dans un congrès
hal-00442663v1
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Electrical and spectroscopic study of DC microdischarges made in alumina3rd International Workshop on Microplasmas, May 2006, Greifswald, Germany
Communication dans un congrès
hal-00442675v1
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Mise au point d'un micro-fluxmètre pour la caractérisation des transferts d'énergie dans un plasma d'argonCongrès Français de Thermique, SFT 2006, May 2006, Île de Ré, France. pp.727-732
Communication dans un congrès
hal-00443914v1
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Mechanisms and optimization in the cryogenic etching plasma processWorkshop on Silicon dry processing, Sep 2006, Aix-La-Chapelle, Germany
Communication dans un congrès
hal-00442676v1
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Diagnostic des plasma par micro-fluxmètreCongrès de la division plasma de la SFP, 2006, May 2006, Pont-à-Mousson, France
Communication dans un congrès
hal-00448844v1
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Profils de raies en spectroscopie d'émission optique appliqués au diagnostic de micro-plasmasJournées 2023 Groupement de Recherche (GdR) étude des milieux ionisés Plasmas froids créés par décharge et laser (EMILI), Oct 2023, Nancy, France
Poster de conférence
hal-04194636v1
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Micro-fabricated silicon-based microplasma reactorsJournées Nationales sur les Technologies Emergentes (JNTE22), Nov 2022, Besançon (France), France
Poster de conférence
hal-03881662v1
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Cryo-ALE of Si based on SF6 physisorptionPLATHINIUM (Plasma Thin film International Union Meeting) 2021, Sep 2021, Antibes, France
Poster de conférence
hal-03539330v1
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Spectroscopic study of the neutral gas temperature of silicon based DC MHCD in various gases close to atmospheric pressure13th Frontiers in Low-Temperature Plasma Diagnostics, May 2019, Baf Honnef, Germany. 2019
Poster de conférence
hal-02131666v1
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Robust atmospheric pressure plasma source fabricated by microfabrication techniquesJournées Nationales sur les Technologies Emergentes (JNTE19), Nov 2019, Grenoble, France
Poster de conférence
hal-02291720v1
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The role of SiF4 physisorption in silicon cryoetchingPlasma Thin Film International Union Meeting, Sep 2019, Antibes, France
Poster de conférence
hal-02311339v1
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Neutral gas temperature in silicon based DC MHCD operated in various gases near atmospheric pressureInternational Workshop on Microplasmas - IWM 10, May 2019, Kyoto, Japan
Poster de conférence
hal-02189151v1
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Analysis of mechanisms involved in cryogenic ALE19th International Conference on Atomic Layer Deposition - 6th International Atomic Layer Etching Workshop, Jul 2019, Seattle, France
Poster de conférence
hal-02311314v1
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MEMS based nanofluidics device for the study of the nonlinear dynamics associate with the geochemical processesFrench symposium on Emerging Technologies for Micronanofabrication, Nov 2019, Grenoble, France
Poster de conférence
hal-02479390v1
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INTRODUCTION AU PROCÉDÉ DE GRAVURE CRYOGÉNIQUE DU SILICIUM15e Congrès de la Société Française de Physique Division Plasmas, Jun 2018, Bordeaux, France
Poster de conférence
hal-02311219v1
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Optimisation et packaging de microplasmas sur siliciumColloque de l'UMI-LN2, Jul 2018, Autrans, France
Poster de conférence
hal-01903397v1
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Time resolved investigation of rotational temperature of molecular nitrogen in micro-plasma arrays9th International Worksop on Microplasmas, Jun 2017, Garmisch Partenkirchen, Germany
Poster de conférence
hal-01577608v1
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Silicon micromachining at cryogenic temperatureDesign, Test, Integration and Packaging of MEMS/MOEMS 2017 (DTIP17), May 2017, Bordeaux, France
Poster de conférence
hal-01561233v1
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Titanium microstructuring for implantable componentsDesign, Test, Integration and Packaging of MEMS/MOEMS, May 2017, Bordeaux, France
Poster de conférence
hal-01561245v1
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Cryogenic ALE of silicon oxidePlasma Etch and Strip in Microtechnology, Oct 2017, Leuven, Belgium
Poster de conférence
hal-02306057v1
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Cryogenic etching of silicon with SF6/O2: a computational and experimental studyPlasma Etch and Strip in Microtechnology, May 2016, Grenoble, France
Poster de conférence
hal-01344725v1
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Advance in low-k cryogenic etching of porous organoscilicate : Investigation of a new gas with higher boiling point Organic (HBPO) and comparison with C4F8Plasma Etch and Strip in Microtechnology, May 2016, Grenoble, France
Poster de conférence
hal-01344722v1
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Chlorine-based plasma deep etching of bulk titaniumInternational Symposium on Dry Process 2016 (DPS2016), Nov 2016, Sapporo, Japan
Poster de conférence
hal-01561222v1
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Deep silicon etching: STiGer vs. BOSCHPlasma Etch and Strip in Microtechnology, May 2016, Grenoble, France
Poster de conférence
hal-01344704v1
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Enhanced reproducibility of SiO2 atomic layer etching by addition of O2 stepsInternational Symposium of Dry Process 2016 (DPS2016), Nov 2016, Sapporo, Japan
Poster de conférence
hal-01561230v1
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Near Atmospheric Pressure Etching of Silicon by MicroplasmaInternational workshop on microplasmas, May 2015, Newark, France
Poster de conférence
hal-01166020v1
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On the relationship between the energy flux at the substrate surface and the phase constitution of reactively magnetron sputtered titanium dioxide thin films14th International Conference on Plasma Surface Engineering PSE 2014 , Sep 2014, Garmisch-Partenkirchen, Germany
Poster de conférence
hal-01289438v1
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Détermination de l'énergie transférée aux surfaces lors de la modification de matériaux par procédés plasmas basse pression12ème congrès de la division plasma de la SFP , May 2012, Orléans, France
Poster de conférence
hal-01288927v1
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Direct energy influx measurement in reactive magnetron sputteringReactive sputter deposition RSD 2011, Dec 2011, Linköping, Sweden
Poster de conférence
hal-01288906v1
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A Heat Flux Microsensor for Direct Measurements in Plasma Surface InteractionsIgor Minin. Microsensors, Intech, pp.87, 2011, 978-953-307-170-1
Chapitre d'ouvrage
hal-00707968v1
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Un capteur de flux d'énergie dans les plasmasMRCT CNRS. Plasmas Froids : Systèmes d'analyse, Modélisation et Rayonnement, Presses imprimerie Saint-Etienne, pp.97-120, 2009
Chapitre d'ouvrage
hal-00443857v1
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