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33 résultats
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triés par
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Innovative SOI based MEMS using large deformation ultra-thin membranes: From micropumps to piezo-NEMS2nd Ukrainian-French Seminar "Semiconductor-on-Insulator materials, devices and circuits: physics, technology and diagnostics", Apr 2013, Kyiv, Ukraine
Communication dans un congrès
hal-01182194v1
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Tuning the Anti-Phase Mode Sensitivity to Vibrations of a MEMS Gyroscope2017 EuroSENSORS, Sep 2017, Paris, France
Communication dans un congrès
hal-02072175v1
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Silicon chip built-in heat spreader: characterization and optimization using integrated sensors3rd European Advanced Technology Workshop on Micropackaging and Thermal Management La Rochelle, France, Jan 2008, -, France
Communication dans un congrès
hal-00392499v1
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Thermal piezoresistive back action in p-type silicon nanogauges based MEMS28th Micromechanics and Microsystems Europe workshop (MME 2017), Aug 2017, Uppsala, Sweden
Communication dans un congrès
hal-02072176v1
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Ultra-thin membrane based MEMS and NEMS technologies: actuation, sensing and energy considerationsInternational Symposium on Component base of silicon micro- and nanoelectronics, solid state quantum computers, Sep 2013, Moscou, Russia
Communication dans un congrès
hal-01182208v1
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Copper Direct Bonding: an innovative 3D interconnect59th Electronic Components and Technology Conference,, Jun 2010, Las Vegas, United States
Communication dans un congrès
hal-00604278v1
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Impact de fortes contraintes mécaniques sur des nanostructures par intégration sur membranes ultra-fines2ème Atelier GDR MECANO,, Apr 2010, Ecole des Mines de Paris, France
Communication dans un congrès
hal-00604951v1
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Microcaloducs en siliciumRevue générale du Froid, AAF, 2004, vol. n°1041, pp.17-23, mars 2004
Article dans une revue
hal-00387244v1
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Numerical study of bimetallic actuated micro-membrane with large deformationsJournal of Micromechanics and Microengineering, 2013, 23 (1), pp.015011:1-9. ⟨10.1088/0960-1317/23/1/015011⟩
Article dans une revue
hal-01018689v1
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PiezoNEMS for Sensing and Energy HarvestingStrategical Conference of EU-Taiwan, Mar 2013, Taipei, Taiwan
Communication dans un congrès
hal-01182206v1
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Stiffness correction method for improving vibrations immunity of a MEMS tuning fork gyroscope7th International Conference "Micro&Nano 2018", Nov 2018, Thessaloniki, Greece
Communication dans un congrès
hal-02072179v1
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Réalisation de microcaloduc en silicium pour le refroidissement de l'électronique.1ères Journées de la Microfluidique de la société Française de Hydraulique, 2002, toulouse, France
Communication dans un congrès
hal-00387278v1
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SOI built-in heat spreader with temperature and pressure integrated sensors for cooling optimization and in-situ monitoring8th International Conference on Microtechnology and Thermal Problems in Electronics (MicroTherm'2009), Jul 2009, Lodz, Poland
Communication dans un congrès
hal-00603884v1
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PiezoNEMS: How to enhance piezoelectricity and piezoresistance in semiconductor nanowire for sensors and energy devicesIndo-US International Workshop on NanoSensor Science & Technology, IWNST 2013, Feb 2013, Berhampur, India
Communication dans un congrès
hal-01182184v1
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Fully depleted, trench-pinned photo gate for CMOS image sensor applicationsSensors, 2020, 20 (3), pp.727. ⟨10.3390/s20030727⟩
Article dans une revue
hal-03770921v1
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Electrical characterization of metal/a-SiC:H/Si MIS capacitors for DNA sensor applicationMicro & NanoEngineering (MNE) 2018, Sep 2018, Copenhague, Denmark
Communication dans un congrès
hal-02072177v1
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Influence of the fluid on the experimental performances of triangular silicon micro heat pipesJournal of Electronic Packaging, 2006, 128 (3), pp.294-296. ⟨10.1115/1.2229233⟩
Article dans une revue
hal-00119714v1
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Performance of micro heat pipes measured by integrated sensorsJournal of Micromechanics and Microengineering, 2006, 16 (5), pp.1047-1050. ⟨10.1088/0960-1317/16/5/023⟩
Article dans une revue
istex
hal-00358074v1
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AFM measurement of Young modulus and piezoelectricity on individual nanostructuresWorkshop on ``New trends in Electrical Scanning Probe Microscopies'', Oct 2010, Grenoble, France
Communication dans un congrès
hal-00604966v1
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PiezoNEMS: Semiconductor nanowires and heterostructures for sensing and energy harvesting2012 International Semiconductor Conference Dresden-Grenoble (ISCDG) - formerly known as the Semiconductor Conference Dresden (SCD), Sep 2012, Grenoble, France. pp.69-74, ⟨10.1109/ISCDG.2012.6359987⟩
Communication dans un congrès
hal-02333027v1
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Thermal actuated micropump for biological and medical application2013 SPIE Microtechnologies: Technical Summaries, Apr 2013, Grenoble, France. ⟨10.1117/12.2017916(2013)⟩
Communication dans un congrès
hal-01181260v1
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PiezoNEMS: new concepts for sensors and energy harvesting devicesWorkshop on Next generation of self-power smart sensors for environmental monitoring, Mar 2013, Nanyang, Singapore
Communication dans un congrès
hal-01182203v1
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Silicon integrated vapor chamber equipped with integrated sensor network for in-situ thermal monitoring and cooling optimization14th International Workshop on Thermal investigations of ICs and Systems, Sep 2008, -, France
Communication dans un congrès
hal-00392513v1
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Temperature sensor integration in all-silicon micro heat pipe arraysEurosensors XIX, Sep 2005, Barcelone, Spain
Communication dans un congrès
hal-00361739v1
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AFM manipulation and characterization of suspended nanostructures by for NEMS applicationsThe Transalpine Conference on Nanoscience and Nanotechnologies, Lyon, France, Sep 2008, LYON, France
Communication dans un congrès
hal-00392502v1
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Characterization of mechanical stress on nanostructures for NEMS applications by ultrathin-membrane and self-suspension techniques34th International Conference on Micro and Nano Engineering (MNE 2008), Athens, Greece,, Sep 2008, Athens, Greece
Communication dans un congrès
hal-00392518v1
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Integrated Micro & Nano Devices for Energy Harvesting & ControlJournées NanoMicroTechnologies au service de l'Energie, Nov 2012, Lyon, France
Communication dans un congrès
hal-01060949v1
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High mechanical stress applied to FD-SOI transistors using ultra thin Silicon membranesInternational Semiconductor Conference, Oct 2009, Sinaia, Romania. pp.93-96
Communication dans un congrès
hal-00602999v1
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Electrical characterization of metal/a-SiC:H/Si MIS capacitors for DNA sensor application7th International Conference "Micro&Nano 2018", Nov 2018, Thessaloniki, Greece
Communication dans un congrès
hal-02072182v1
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Tuning the Anti-Phase Mode Sensitivity to Vibrations of a MEMS GyroscopeProceedings, 2017, 1 (4), pp.355. ⟨10.3390/proceedings1040355⟩
Article dans une revue
hal-02060585v1
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